Investigation of abnormal negative threshold voltage shift under positive bias stress in input/output n-channel metal-oxide-semiconductor field-effect transistors with TiN/HfO2 structure using fast I-V measurement

This letter investigates abnormal negative threshold voltage shifts under positive bias stress in input/output (I/O) TiN/HfO2 n-channel metal-oxide-semiconductor field-effect transistors using fast I-V measurement. This phenomenon is attributed to a reversible charge/discharge effect in pre-existing...

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Veröffentlicht in:Applied physics letters 2014-03, Vol.104 (11)
Hauptverfasser: Ho, Szu-Han, Chang, Ting-Chang, Lu, Ying-Hsin, Chen, Ching-En, Tsai, Jyun-Yu, Liu, Kuan-Ju, Tseng, Tseung-Yuen, Cheng, Osbert, Huang, Cheng-Tung, Lu, Ching-Sen
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container_issue 11
container_start_page
container_title Applied physics letters
container_volume 104
creator Ho, Szu-Han
Chang, Ting-Chang
Lu, Ying-Hsin
Chen, Ching-En
Tsai, Jyun-Yu
Liu, Kuan-Ju
Tseng, Tseung-Yuen
Cheng, Osbert
Huang, Cheng-Tung
Lu, Ching-Sen
description This letter investigates abnormal negative threshold voltage shifts under positive bias stress in input/output (I/O) TiN/HfO2 n-channel metal-oxide-semiconductor field-effect transistors using fast I-V measurement. This phenomenon is attributed to a reversible charge/discharge effect in pre-existing bulk traps. Moreover, in standard performance devices, threshold-voltage (Vt) shifts positively during fast I-V double sweep measurement. However, in I/O devices, Vt shifts negatively since electrons escape from bulk traps to metal gate rather than channel electrons injecting to bulk traps. Consequently, decreasing pre-existing bulk traps in I/O devices, which can be achieved by adopting HfxZr1−xO2 as gate oxide, can reduce the charge/discharge effect.
doi_str_mv 10.1063/1.4868532
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This phenomenon is attributed to a reversible charge/discharge effect in pre-existing bulk traps. Moreover, in standard performance devices, threshold-voltage (Vt) shifts positively during fast I-V double sweep measurement. However, in I/O devices, Vt shifts negatively since electrons escape from bulk traps to metal gate rather than channel electrons injecting to bulk traps. 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This phenomenon is attributed to a reversible charge/discharge effect in pre-existing bulk traps. Moreover, in standard performance devices, threshold-voltage (Vt) shifts positively during fast I-V double sweep measurement. However, in I/O devices, Vt shifts negatively since electrons escape from bulk traps to metal gate rather than channel electrons injecting to bulk traps. Consequently, decreasing pre-existing bulk traps in I/O devices, which can be achieved by adopting HfxZr1−xO2 as gate oxide, can reduce the charge/discharge effect.</abstract><cop>Melville</cop><pub>American Institute of Physics</pub><doi>10.1063/1.4868532</doi></addata></record>
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source AIP Journals Complete; Alma/SFX Local Collection
subjects Applied physics
Bias
Discharge
Electrons
Field effect transistors
Hafnium oxide
Input output
MOSFETs
Semiconductor devices
Threshold voltage
Transistors
title Investigation of abnormal negative threshold voltage shift under positive bias stress in input/output n-channel metal-oxide-semiconductor field-effect transistors with TiN/HfO2 structure using fast I-V measurement
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