Effect of TiO2 Nanoparticles Addition on the Thermal, Microstructural and Room-Temperature Creep Behavior of Sn-Zn Based Solder

The effect of adding TiO 2 nanoparticles as well as aging time on the thermal, microstructural and creep properties of Sn-6.5Zn solder was studied. The Sn-6.5Zn composite solders were prepared by mechanically dispersing different weight percentages (0.0 wt.%, 0.25 wt.%, 0.50 wt.%, 0.75 wt.% and 1.0 ...

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Veröffentlicht in:	Journal of electronic materials 2018-12, Vol.47 (12), p.6984-6994
Hauptverfasser:	Yassin, A. M., Zahran, H. Y., Abd El-Rehim, A. F.
Format:	Artikel
Sprache:	eng
Schlagworte:	Aging Characterization and Evaluation of Materials Chemistry and Materials Science Creep rate Creep strength Creep tests Electronics and Microelectronics Heat treatment Instrumentation Materials Science Mechanical properties Microstructure Nanoparticles Optical and Electronic Materials Room temperature Scanning electron microscopy Solders Solid State Physics Tensile creep Thermodynamic properties Titanium dioxide Water quenching Weight X-ray diffraction Zinc
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