Effect of TiO2 Nanoparticles Addition on the Thermal, Microstructural and Room-Temperature Creep Behavior of Sn-Zn Based Solder
The effect of adding TiO 2 nanoparticles as well as aging time on the thermal, microstructural and creep properties of Sn-6.5Zn solder was studied. The Sn-6.5Zn composite solders were prepared by mechanically dispersing different weight percentages (0.0 wt.%, 0.25 wt.%, 0.50 wt.%, 0.75 wt.% and 1.0 ...
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| Veröffentlicht in: | Journal of electronic materials 2018-12, Vol.47 (12), p.6984-6994 |
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| creator | Yassin, A. M. Zahran, H. Y. Abd El-Rehim, A. F. |
| description | The effect of adding TiO
2
nanoparticles as well as aging time on the thermal, microstructural and creep properties of Sn-6.5Zn solder was studied. The Sn-6.5Zn composite solders were prepared by mechanically dispersing different weight percentages (0.0 wt.%, 0.25 wt.%, 0.50 wt.%, 0.75 wt.% and 1.0 wt.%) of TiO
2
nanoparticles into Sn-6.5Zn solder. After being solution heat treated at 453 K for 4 h, specimens were cooled by water quenching at 273 K. Specimens were artificially aged at 393 K for durations ranging from 15 to 120 min, followed by water quenching at 273 K to cease further aging. The thermal behavior of the composite solders was investigated using differential scanning calorimetry (DSC). X-ray diffraction (XRD) and scanning electron microscopy (SEM) were used to observe the microstructure of the solders. The mechanical properties were characterized using tensile creep tests and correlated with microstructural features. The investigation revealed that the minimum creep rate of solders decreased with the increase in the content of TiO
2
, while it increased with increasing aging time. The data from microstructure-properties analysis showed that the nano-TiO
2
particles had significantly refined the microstructure and improved the creep resistance in comparison with the Sn-Zn solder. The calculated stress exponent values were close to 7. |
| doi_str_mv | 10.1007/s11664-018-6624-8 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_2127629430</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2127629430</sourcerecordid><originalsourceid>FETCH-LOGICAL-c316t-b9c01d8dae1da40c6af94cd173824e1aaa33a2e0d6a352d30ba324cdfedc7cb73</originalsourceid><addsrcrecordid>eNp1kM1LxDAQxYMouH78Ad4CXo1mkjbtHnXxC1YFXUG8hNlk6la6TU26gif_dbus4EkYGBh-7z3mMXYE8hSkLM4SgDGZkFAKY1Qmyi02gjzTAkrzss1GUhsQudL5LttL6V1KyKGEEfu-rCpyPQ8Vn9UPit9jGzqMfe0aSvzc-7qvQ8uH6RfEZwuKS2xO-F3tYkh9XLl-FbHh2Hr-GMJSzGjZUcThSnwSiTp-QQv8rENcRzy14rXlF5jI86fQeIoHbKfCJtHh795nz1eXs8mNmD5c307Op8JpML2Yj50EX3ok8JhJZ7AaZ85DoUuVESCi1qhIeoM6V17LOWo1ABV5V7h5offZ8ca3i-FjRam372EV2yHSKlCFUeNMy4GCDbX-LkWqbBfrJcYvC9Kue7abnu3Qs133bMtBozaaNLDtG8U_5_9FP2pogc0</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2127629430</pqid></control><display><type>article</type><title>Effect of TiO2 Nanoparticles Addition on the Thermal, Microstructural and Room-Temperature Creep Behavior of Sn-Zn Based Solder</title><source>SpringerLink Journals - AutoHoldings</source><creator>Yassin, A. M. ; Zahran, H. Y. ; Abd El-Rehim, A. F.</creator><creatorcontrib>Yassin, A. M. ; Zahran, H. Y. ; Abd El-Rehim, A. F.</creatorcontrib><description>The effect of adding TiO
2
nanoparticles as well as aging time on the thermal, microstructural and creep properties of Sn-6.5Zn solder was studied. The Sn-6.5Zn composite solders were prepared by mechanically dispersing different weight percentages (0.0 wt.%, 0.25 wt.%, 0.50 wt.%, 0.75 wt.% and 1.0 wt.%) of TiO
2
nanoparticles into Sn-6.5Zn solder. After being solution heat treated at 453 K for 4 h, specimens were cooled by water quenching at 273 K. Specimens were artificially aged at 393 K for durations ranging from 15 to 120 min, followed by water quenching at 273 K to cease further aging. The thermal behavior of the composite solders was investigated using differential scanning calorimetry (DSC). X-ray diffraction (XRD) and scanning electron microscopy (SEM) were used to observe the microstructure of the solders. The mechanical properties were characterized using tensile creep tests and correlated with microstructural features. The investigation revealed that the minimum creep rate of solders decreased with the increase in the content of TiO
2
, while it increased with increasing aging time. The data from microstructure-properties analysis showed that the nano-TiO
2
particles had significantly refined the microstructure and improved the creep resistance in comparison with the Sn-Zn solder. The calculated stress exponent values were close to 7.</description><identifier>ISSN: 0361-5235</identifier><identifier>EISSN: 1543-186X</identifier><identifier>DOI: 10.1007/s11664-018-6624-8</identifier><language>eng</language><publisher>New York: Springer US</publisher><subject>Aging ; Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Creep rate ; Creep strength ; Creep tests ; Electronics and Microelectronics ; Heat treatment ; Instrumentation ; Materials Science ; Mechanical properties ; Microstructure ; Nanoparticles ; Optical and Electronic Materials ; Room temperature ; Scanning electron microscopy ; Solders ; Solid State Physics ; Tensile creep ; Thermodynamic properties ; Titanium dioxide ; Water quenching ; Weight ; X-ray diffraction ; Zinc</subject><ispartof>Journal of electronic materials, 2018-12, Vol.47 (12), p.6984-6994</ispartof><rights>The Minerals, Metals & Materials Society 2018</rights><rights>Journal of Electronic Materials is a copyright of Springer, (2018). All Rights Reserved.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c316t-b9c01d8dae1da40c6af94cd173824e1aaa33a2e0d6a352d30ba324cdfedc7cb73</citedby><cites>FETCH-LOGICAL-c316t-b9c01d8dae1da40c6af94cd173824e1aaa33a2e0d6a352d30ba324cdfedc7cb73</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s11664-018-6624-8$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s11664-018-6624-8$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,780,784,27924,27925,41488,42557,51319</link.rule.ids></links><search><creatorcontrib>Yassin, A. M.</creatorcontrib><creatorcontrib>Zahran, H. Y.</creatorcontrib><creatorcontrib>Abd El-Rehim, A. F.</creatorcontrib><title>Effect of TiO2 Nanoparticles Addition on the Thermal, Microstructural and Room-Temperature Creep Behavior of Sn-Zn Based Solder</title><title>Journal of electronic materials</title><addtitle>Journal of Elec Materi</addtitle><description>The effect of adding TiO
2
nanoparticles as well as aging time on the thermal, microstructural and creep properties of Sn-6.5Zn solder was studied. The Sn-6.5Zn composite solders were prepared by mechanically dispersing different weight percentages (0.0 wt.%, 0.25 wt.%, 0.50 wt.%, 0.75 wt.% and 1.0 wt.%) of TiO
2
nanoparticles into Sn-6.5Zn solder. After being solution heat treated at 453 K for 4 h, specimens were cooled by water quenching at 273 K. Specimens were artificially aged at 393 K for durations ranging from 15 to 120 min, followed by water quenching at 273 K to cease further aging. The thermal behavior of the composite solders was investigated using differential scanning calorimetry (DSC). X-ray diffraction (XRD) and scanning electron microscopy (SEM) were used to observe the microstructure of the solders. The mechanical properties were characterized using tensile creep tests and correlated with microstructural features. The investigation revealed that the minimum creep rate of solders decreased with the increase in the content of TiO
2
, while it increased with increasing aging time. The data from microstructure-properties analysis showed that the nano-TiO
2
particles had significantly refined the microstructure and improved the creep resistance in comparison with the Sn-Zn solder. The calculated stress exponent values were close to 7.</description><subject>Aging</subject><subject>Characterization and Evaluation of Materials</subject><subject>Chemistry and Materials Science</subject><subject>Creep rate</subject><subject>Creep strength</subject><subject>Creep tests</subject><subject>Electronics and Microelectronics</subject><subject>Heat treatment</subject><subject>Instrumentation</subject><subject>Materials Science</subject><subject>Mechanical properties</subject><subject>Microstructure</subject><subject>Nanoparticles</subject><subject>Optical and Electronic Materials</subject><subject>Room temperature</subject><subject>Scanning electron microscopy</subject><subject>Solders</subject><subject>Solid State Physics</subject><subject>Tensile creep</subject><subject>Thermodynamic properties</subject><subject>Titanium dioxide</subject><subject>Water quenching</subject><subject>Weight</subject><subject>X-ray diffraction</subject><subject>Zinc</subject><issn>0361-5235</issn><issn>1543-186X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2018</creationdate><recordtype>article</recordtype><sourceid>8G5</sourceid><sourceid>ABUWG</sourceid><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><sourceid>GNUQQ</sourceid><sourceid>GUQSH</sourceid><sourceid>M2O</sourceid><recordid>eNp1kM1LxDAQxYMouH78Ad4CXo1mkjbtHnXxC1YFXUG8hNlk6la6TU26gif_dbus4EkYGBh-7z3mMXYE8hSkLM4SgDGZkFAKY1Qmyi02gjzTAkrzss1GUhsQudL5LttL6V1KyKGEEfu-rCpyPQ8Vn9UPit9jGzqMfe0aSvzc-7qvQ8uH6RfEZwuKS2xO-F3tYkh9XLl-FbHh2Hr-GMJSzGjZUcThSnwSiTp-QQv8rENcRzy14rXlF5jI86fQeIoHbKfCJtHh795nz1eXs8mNmD5c307Op8JpML2Yj50EX3ok8JhJZ7AaZ85DoUuVESCi1qhIeoM6V17LOWo1ABV5V7h5offZ8ca3i-FjRam372EV2yHSKlCFUeNMy4GCDbX-LkWqbBfrJcYvC9Kue7abnu3Qs133bMtBozaaNLDtG8U_5_9FP2pogc0</recordid><startdate>20181201</startdate><enddate>20181201</enddate><creator>Yassin, A. M.</creator><creator>Zahran, H. Y.</creator><creator>Abd El-Rehim, A. F.</creator><general>Springer US</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>3V.</scope><scope>7XB</scope><scope>88I</scope><scope>8AF</scope><scope>8AO</scope><scope>8FE</scope><scope>8FG</scope><scope>8FK</scope><scope>8G5</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>GNUQQ</scope><scope>GUQSH</scope><scope>HCIFZ</scope><scope>KB.</scope><scope>L6V</scope><scope>M2O</scope><scope>M2P</scope><scope>M7S</scope><scope>MBDVC</scope><scope>P5Z</scope><scope>P62</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>PTHSS</scope><scope>Q9U</scope><scope>S0X</scope></search><sort><creationdate>20181201</creationdate><title>Effect of TiO2 Nanoparticles Addition on the Thermal, Microstructural and Room-Temperature Creep Behavior of Sn-Zn Based Solder</title><author>Yassin, A. M. ; Zahran, H. Y. ; Abd El-Rehim, A. F.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c316t-b9c01d8dae1da40c6af94cd173824e1aaa33a2e0d6a352d30ba324cdfedc7cb73</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2018</creationdate><topic>Aging</topic><topic>Characterization and Evaluation of Materials</topic><topic>Chemistry and Materials Science</topic><topic>Creep rate</topic><topic>Creep strength</topic><topic>Creep tests</topic><topic>Electronics and Microelectronics</topic><topic>Heat treatment</topic><topic>Instrumentation</topic><topic>Materials Science</topic><topic>Mechanical properties</topic><topic>Microstructure</topic><topic>Nanoparticles</topic><topic>Optical and Electronic Materials</topic><topic>Room temperature</topic><topic>Scanning electron microscopy</topic><topic>Solders</topic><topic>Solid State Physics</topic><topic>Tensile creep</topic><topic>Thermodynamic properties</topic><topic>Titanium dioxide</topic><topic>Water quenching</topic><topic>Weight</topic><topic>X-ray diffraction</topic><topic>Zinc</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Yassin, A. M.</creatorcontrib><creatorcontrib>Zahran, H. Y.</creatorcontrib><creatorcontrib>Abd El-Rehim, A. F.</creatorcontrib><collection>CrossRef</collection><collection>ProQuest Central (Corporate)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>Science Database (Alumni Edition)</collection><collection>STEM Database</collection><collection>ProQuest Pharma Collection</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>Research Library (Alumni Edition)</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies & Aerospace Collection</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>ProQuest Central Student</collection><collection>Research Library Prep</collection><collection>SciTech Premium Collection</collection><collection>Materials Science Database</collection><collection>ProQuest Engineering Collection</collection><collection>Research Library</collection><collection>Science Database</collection><collection>Engineering Database</collection><collection>Research Library (Corporate)</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>Engineering Collection</collection><collection>ProQuest Central Basic</collection><collection>SIRS Editorial</collection><jtitle>Journal of electronic materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Yassin, A. M.</au><au>Zahran, H. Y.</au><au>Abd El-Rehim, A. F.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Effect of TiO2 Nanoparticles Addition on the Thermal, Microstructural and Room-Temperature Creep Behavior of Sn-Zn Based Solder</atitle><jtitle>Journal of electronic materials</jtitle><stitle>Journal of Elec Materi</stitle><date>2018-12-01</date><risdate>2018</risdate><volume>47</volume><issue>12</issue><spage>6984</spage><epage>6994</epage><pages>6984-6994</pages><issn>0361-5235</issn><eissn>1543-186X</eissn><abstract>The effect of adding TiO
2
nanoparticles as well as aging time on the thermal, microstructural and creep properties of Sn-6.5Zn solder was studied. The Sn-6.5Zn composite solders were prepared by mechanically dispersing different weight percentages (0.0 wt.%, 0.25 wt.%, 0.50 wt.%, 0.75 wt.% and 1.0 wt.%) of TiO
2
nanoparticles into Sn-6.5Zn solder. After being solution heat treated at 453 K for 4 h, specimens were cooled by water quenching at 273 K. Specimens were artificially aged at 393 K for durations ranging from 15 to 120 min, followed by water quenching at 273 K to cease further aging. The thermal behavior of the composite solders was investigated using differential scanning calorimetry (DSC). X-ray diffraction (XRD) and scanning electron microscopy (SEM) were used to observe the microstructure of the solders. The mechanical properties were characterized using tensile creep tests and correlated with microstructural features. The investigation revealed that the minimum creep rate of solders decreased with the increase in the content of TiO
2
, while it increased with increasing aging time. The data from microstructure-properties analysis showed that the nano-TiO
2
particles had significantly refined the microstructure and improved the creep resistance in comparison with the Sn-Zn solder. The calculated stress exponent values were close to 7.</abstract><cop>New York</cop><pub>Springer US</pub><doi>10.1007/s11664-018-6624-8</doi><tpages>11</tpages></addata></record> |
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| subjects | Aging Characterization and Evaluation of Materials Chemistry and Materials Science Creep rate Creep strength Creep tests Electronics and Microelectronics Heat treatment Instrumentation Materials Science Mechanical properties Microstructure Nanoparticles Optical and Electronic Materials Room temperature Scanning electron microscopy Solders Solid State Physics Tensile creep Thermodynamic properties Titanium dioxide Water quenching Weight X-ray diffraction Zinc |
| title | Effect of TiO2 Nanoparticles Addition on the Thermal, Microstructural and Room-Temperature Creep Behavior of Sn-Zn Based Solder |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-08T05%3A49%3A15IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Effect%20of%20TiO2%20Nanoparticles%20Addition%20on%20the%20Thermal,%20Microstructural%20and%20Room-Temperature%20Creep%20Behavior%20of%20Sn-Zn%20Based%20Solder&rft.jtitle=Journal%20of%20electronic%20materials&rft.au=Yassin,%20A.%20M.&rft.date=2018-12-01&rft.volume=47&rft.issue=12&rft.spage=6984&rft.epage=6994&rft.pages=6984-6994&rft.issn=0361-5235&rft.eissn=1543-186X&rft_id=info:doi/10.1007/s11664-018-6624-8&rft_dat=%3Cproquest_cross%3E2127629430%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=2127629430&rft_id=info:pmid/&rfr_iscdi=true |