In-Plane Longitudinal Cutting in Single-Crystal Silicon Wafer Surface Micromachining

The current concept of grinding or abrasive machining involves the formation and removal of segmented strips of material termed chips from the surface of the solid. A novel cutting mechanism is hereby presented in this research study that suggests that the generation of chips from the surface does n...

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Veröffentlicht in:	Solid state phenomena 2017-08, Vol.261, p.93-100
1. Verfasser:	delos Reyes, Ronald Allan S.
Format:	Artikel
Sprache:	eng
Schlagworte:	Micromachining Silicon wafers Single crystals
Online-Zugang:	Volltext
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