Microstructural Characterization of Defects and Chemical Etching for HgCdSe/ZnTe/Si (211) Heterostructures

In this work, transmission electron microscopy has been used to investigate HgCdSe/ZnTe/Si (211) heterostructures grown by molecular beam epitaxy and to study the effects of chemical etchants for measurements of defect density in the HgCdSe epilayers. Both ZnTe/Si and HgCdSe/ZnTe interfaces were dec...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Journal of electronic materials 2019-01, Vol.48 (1), p.571-582
Hauptverfasser: Vaghayenegar, M., Doyle, K. J., Trivedi, S., Wijewarnasuriya, P., Smith, David J.
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 582
container_issue 1
container_start_page 571
container_title Journal of electronic materials
container_volume 48
creator Vaghayenegar, M.
Doyle, K. J.
Trivedi, S.
Wijewarnasuriya, P.
Smith, David J.
description In this work, transmission electron microscopy has been used to investigate HgCdSe/ZnTe/Si (211) heterostructures grown by molecular beam epitaxy and to study the effects of chemical etchants for measurements of defect density in the HgCdSe epilayers. Both ZnTe/Si and HgCdSe/ZnTe interfaces were decorated with {111}-type stacking faults inclined at angles of ∼ 19° or ∼ 90° with respect to the interface plane. Similar stacking faults were also present in the upper regions of the HgCdSe films. High-resolution imaging and Fourier image analysis revealed dislocations, mostly with a 3 1 ¯ 11 Burgers vector, at both ZnTe/Si and HgCdSe/ZnTe interfaces. Etching solutions based on different combinations of nitric acid, hydrochloric acid and lactic acid were tried in attempts to identify an etchant that provided one-to-one correspondence between etch pits and defects in the HgCdSe layer. Focused-ion-beam milling and transmission electron microscopy were used to prepare site-specific cross-section samples from across the etch pits. However, many defects in regions surrounding the etch pits were unaffected by the various different etchants.
doi_str_mv 10.1007/s11664-018-6737-0
format Article
fullrecord <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_2127090587</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2127090587</sourcerecordid><originalsourceid>FETCH-LOGICAL-c316t-9de0f2b51333e3cc7eecd52ffd75317405b46ddf04e7a97df246ff81d543cff03</originalsourceid><addsrcrecordid>eNp1kLFOwzAQhi0EEqXwAGyRWGAI9dmxnY4oFIpUxNAiIRYrtc9tqjYptjPA05MqCCamG-77v9P9hFwCvQVK1SgASJmlFPJUKq5SekQGIDKeQi7fjsmAcgmpYFyckrMQNpSCgBwGZPNcGd-E6FsTW19uk2Jd-tJE9NVXGaumThqX3KNDE0NS1rbb464yHTiJZl3Vq8Q1PpmuCjvH0Xu9wNG8Sq4ZwE0yxc7yq8ZwTk5cuQ148TOH5PVhsiim6ezl8am4m6WGg4zp2CJ1bCmAc47cGIVorGDOWSU4qIyKZSatdTRDVY6VdSyTzuVgu2-Nc5QPyVXv3fvmo8UQ9aZpfd2d1AyYomMqctVR0FOH94NHp_e-2pX-UwPVh0p1X6nuKtWHSvXBzPpM6Nh6hf7P_H_oG5GGecA</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2127090587</pqid></control><display><type>article</type><title>Microstructural Characterization of Defects and Chemical Etching for HgCdSe/ZnTe/Si (211) Heterostructures</title><source>SpringerLink Journals - AutoHoldings</source><creator>Vaghayenegar, M. ; Doyle, K. J. ; Trivedi, S. ; Wijewarnasuriya, P. ; Smith, David J.</creator><creatorcontrib>Vaghayenegar, M. ; Doyle, K. J. ; Trivedi, S. ; Wijewarnasuriya, P. ; Smith, David J.</creatorcontrib><description>In this work, transmission electron microscopy has been used to investigate HgCdSe/ZnTe/Si (211) heterostructures grown by molecular beam epitaxy and to study the effects of chemical etchants for measurements of defect density in the HgCdSe epilayers. Both ZnTe/Si and HgCdSe/ZnTe interfaces were decorated with {111}-type stacking faults inclined at angles of ∼ 19° or ∼ 90° with respect to the interface plane. Similar stacking faults were also present in the upper regions of the HgCdSe films. High-resolution imaging and Fourier image analysis revealed dislocations, mostly with a 3 1 ¯ 11 Burgers vector, at both ZnTe/Si and HgCdSe/ZnTe interfaces. Etching solutions based on different combinations of nitric acid, hydrochloric acid and lactic acid were tried in attempts to identify an etchant that provided one-to-one correspondence between etch pits and defects in the HgCdSe layer. Focused-ion-beam milling and transmission electron microscopy were used to prepare site-specific cross-section samples from across the etch pits. However, many defects in regions surrounding the etch pits were unaffected by the various different etchants.</description><identifier>ISSN: 0361-5235</identifier><identifier>EISSN: 1543-186X</identifier><identifier>DOI: 10.1007/s11664-018-6737-0</identifier><language>eng</language><publisher>New York: Springer US</publisher><subject>Burgers vector ; Characterization and Evaluation of Materials ; Chemical etching ; Chemistry and Materials Science ; Defects ; Dislocations ; Electronics and Microelectronics ; Electrons ; Epitaxial growth ; Etch pits ; Etchants ; Heterostructures ; Hydrochloric acid ; Image analysis ; Image resolution ; Instrumentation ; Lactic acid ; Materials Science ; Molecular beam epitaxy ; Nitric acid ; Optical and Electronic Materials ; Organic chemistry ; Solid State Physics ; Stacking faults ; Transmission electron microscopy ; Zinc tellurides</subject><ispartof>Journal of electronic materials, 2019-01, Vol.48 (1), p.571-582</ispartof><rights>The Minerals, Metals &amp; Materials Society 2018</rights><rights>Journal of Electronic Materials is a copyright of Springer, (2018). All Rights Reserved.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c316t-9de0f2b51333e3cc7eecd52ffd75317405b46ddf04e7a97df246ff81d543cff03</citedby><cites>FETCH-LOGICAL-c316t-9de0f2b51333e3cc7eecd52ffd75317405b46ddf04e7a97df246ff81d543cff03</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s11664-018-6737-0$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s11664-018-6737-0$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,780,784,27924,27925,41488,42557,51319</link.rule.ids></links><search><creatorcontrib>Vaghayenegar, M.</creatorcontrib><creatorcontrib>Doyle, K. J.</creatorcontrib><creatorcontrib>Trivedi, S.</creatorcontrib><creatorcontrib>Wijewarnasuriya, P.</creatorcontrib><creatorcontrib>Smith, David J.</creatorcontrib><title>Microstructural Characterization of Defects and Chemical Etching for HgCdSe/ZnTe/Si (211) Heterostructures</title><title>Journal of electronic materials</title><addtitle>Journal of Elec Materi</addtitle><description>In this work, transmission electron microscopy has been used to investigate HgCdSe/ZnTe/Si (211) heterostructures grown by molecular beam epitaxy and to study the effects of chemical etchants for measurements of defect density in the HgCdSe epilayers. Both ZnTe/Si and HgCdSe/ZnTe interfaces were decorated with {111}-type stacking faults inclined at angles of ∼ 19° or ∼ 90° with respect to the interface plane. Similar stacking faults were also present in the upper regions of the HgCdSe films. High-resolution imaging and Fourier image analysis revealed dislocations, mostly with a 3 1 ¯ 11 Burgers vector, at both ZnTe/Si and HgCdSe/ZnTe interfaces. Etching solutions based on different combinations of nitric acid, hydrochloric acid and lactic acid were tried in attempts to identify an etchant that provided one-to-one correspondence between etch pits and defects in the HgCdSe layer. Focused-ion-beam milling and transmission electron microscopy were used to prepare site-specific cross-section samples from across the etch pits. However, many defects in regions surrounding the etch pits were unaffected by the various different etchants.</description><subject>Burgers vector</subject><subject>Characterization and Evaluation of Materials</subject><subject>Chemical etching</subject><subject>Chemistry and Materials Science</subject><subject>Defects</subject><subject>Dislocations</subject><subject>Electronics and Microelectronics</subject><subject>Electrons</subject><subject>Epitaxial growth</subject><subject>Etch pits</subject><subject>Etchants</subject><subject>Heterostructures</subject><subject>Hydrochloric acid</subject><subject>Image analysis</subject><subject>Image resolution</subject><subject>Instrumentation</subject><subject>Lactic acid</subject><subject>Materials Science</subject><subject>Molecular beam epitaxy</subject><subject>Nitric acid</subject><subject>Optical and Electronic Materials</subject><subject>Organic chemistry</subject><subject>Solid State Physics</subject><subject>Stacking faults</subject><subject>Transmission electron microscopy</subject><subject>Zinc tellurides</subject><issn>0361-5235</issn><issn>1543-186X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2019</creationdate><recordtype>article</recordtype><sourceid>8G5</sourceid><sourceid>ABUWG</sourceid><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><sourceid>GNUQQ</sourceid><sourceid>GUQSH</sourceid><sourceid>M2O</sourceid><recordid>eNp1kLFOwzAQhi0EEqXwAGyRWGAI9dmxnY4oFIpUxNAiIRYrtc9tqjYptjPA05MqCCamG-77v9P9hFwCvQVK1SgASJmlFPJUKq5SekQGIDKeQi7fjsmAcgmpYFyckrMQNpSCgBwGZPNcGd-E6FsTW19uk2Jd-tJE9NVXGaumThqX3KNDE0NS1rbb464yHTiJZl3Vq8Q1PpmuCjvH0Xu9wNG8Sq4ZwE0yxc7yq8ZwTk5cuQ148TOH5PVhsiim6ezl8am4m6WGg4zp2CJ1bCmAc47cGIVorGDOWSU4qIyKZSatdTRDVY6VdSyTzuVgu2-Nc5QPyVXv3fvmo8UQ9aZpfd2d1AyYomMqctVR0FOH94NHp_e-2pX-UwPVh0p1X6nuKtWHSvXBzPpM6Nh6hf7P_H_oG5GGecA</recordid><startdate>20190101</startdate><enddate>20190101</enddate><creator>Vaghayenegar, M.</creator><creator>Doyle, K. J.</creator><creator>Trivedi, S.</creator><creator>Wijewarnasuriya, P.</creator><creator>Smith, David J.</creator><general>Springer US</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>3V.</scope><scope>7XB</scope><scope>88I</scope><scope>8AF</scope><scope>8AO</scope><scope>8FE</scope><scope>8FG</scope><scope>8FK</scope><scope>8G5</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>GNUQQ</scope><scope>GUQSH</scope><scope>HCIFZ</scope><scope>KB.</scope><scope>L6V</scope><scope>M2O</scope><scope>M2P</scope><scope>M7S</scope><scope>MBDVC</scope><scope>P5Z</scope><scope>P62</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>PTHSS</scope><scope>Q9U</scope><scope>S0X</scope></search><sort><creationdate>20190101</creationdate><title>Microstructural Characterization of Defects and Chemical Etching for HgCdSe/ZnTe/Si (211) Heterostructures</title><author>Vaghayenegar, M. ; Doyle, K. J. ; Trivedi, S. ; Wijewarnasuriya, P. ; Smith, David J.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c316t-9de0f2b51333e3cc7eecd52ffd75317405b46ddf04e7a97df246ff81d543cff03</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2019</creationdate><topic>Burgers vector</topic><topic>Characterization and Evaluation of Materials</topic><topic>Chemical etching</topic><topic>Chemistry and Materials Science</topic><topic>Defects</topic><topic>Dislocations</topic><topic>Electronics and Microelectronics</topic><topic>Electrons</topic><topic>Epitaxial growth</topic><topic>Etch pits</topic><topic>Etchants</topic><topic>Heterostructures</topic><topic>Hydrochloric acid</topic><topic>Image analysis</topic><topic>Image resolution</topic><topic>Instrumentation</topic><topic>Lactic acid</topic><topic>Materials Science</topic><topic>Molecular beam epitaxy</topic><topic>Nitric acid</topic><topic>Optical and Electronic Materials</topic><topic>Organic chemistry</topic><topic>Solid State Physics</topic><topic>Stacking faults</topic><topic>Transmission electron microscopy</topic><topic>Zinc tellurides</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Vaghayenegar, M.</creatorcontrib><creatorcontrib>Doyle, K. J.</creatorcontrib><creatorcontrib>Trivedi, S.</creatorcontrib><creatorcontrib>Wijewarnasuriya, P.</creatorcontrib><creatorcontrib>Smith, David J.</creatorcontrib><collection>CrossRef</collection><collection>ProQuest Central (Corporate)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>Science Database (Alumni Edition)</collection><collection>STEM Database</collection><collection>ProQuest Pharma Collection</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>Research Library (Alumni Edition)</collection><collection>Materials Science &amp; Engineering Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies &amp; Aerospace Collection</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>ProQuest Central Student</collection><collection>Research Library Prep</collection><collection>SciTech Premium Collection</collection><collection>Materials Science Database</collection><collection>ProQuest Engineering Collection</collection><collection>Research Library</collection><collection>Science Database</collection><collection>Engineering Database</collection><collection>Research Library (Corporate)</collection><collection>Advanced Technologies &amp; Aerospace Database</collection><collection>ProQuest Advanced Technologies &amp; Aerospace Collection</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>Engineering Collection</collection><collection>ProQuest Central Basic</collection><collection>SIRS Editorial</collection><jtitle>Journal of electronic materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Vaghayenegar, M.</au><au>Doyle, K. J.</au><au>Trivedi, S.</au><au>Wijewarnasuriya, P.</au><au>Smith, David J.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Microstructural Characterization of Defects and Chemical Etching for HgCdSe/ZnTe/Si (211) Heterostructures</atitle><jtitle>Journal of electronic materials</jtitle><stitle>Journal of Elec Materi</stitle><date>2019-01-01</date><risdate>2019</risdate><volume>48</volume><issue>1</issue><spage>571</spage><epage>582</epage><pages>571-582</pages><issn>0361-5235</issn><eissn>1543-186X</eissn><abstract>In this work, transmission electron microscopy has been used to investigate HgCdSe/ZnTe/Si (211) heterostructures grown by molecular beam epitaxy and to study the effects of chemical etchants for measurements of defect density in the HgCdSe epilayers. Both ZnTe/Si and HgCdSe/ZnTe interfaces were decorated with {111}-type stacking faults inclined at angles of ∼ 19° or ∼ 90° with respect to the interface plane. Similar stacking faults were also present in the upper regions of the HgCdSe films. High-resolution imaging and Fourier image analysis revealed dislocations, mostly with a 3 1 ¯ 11 Burgers vector, at both ZnTe/Si and HgCdSe/ZnTe interfaces. Etching solutions based on different combinations of nitric acid, hydrochloric acid and lactic acid were tried in attempts to identify an etchant that provided one-to-one correspondence between etch pits and defects in the HgCdSe layer. Focused-ion-beam milling and transmission electron microscopy were used to prepare site-specific cross-section samples from across the etch pits. However, many defects in regions surrounding the etch pits were unaffected by the various different etchants.</abstract><cop>New York</cop><pub>Springer US</pub><doi>10.1007/s11664-018-6737-0</doi><tpages>12</tpages></addata></record>
fulltext fulltext
identifier ISSN: 0361-5235
ispartof Journal of electronic materials, 2019-01, Vol.48 (1), p.571-582
issn 0361-5235
1543-186X
language eng
recordid cdi_proquest_journals_2127090587
source SpringerLink Journals - AutoHoldings
subjects Burgers vector
Characterization and Evaluation of Materials
Chemical etching
Chemistry and Materials Science
Defects
Dislocations
Electronics and Microelectronics
Electrons
Epitaxial growth
Etch pits
Etchants
Heterostructures
Hydrochloric acid
Image analysis
Image resolution
Instrumentation
Lactic acid
Materials Science
Molecular beam epitaxy
Nitric acid
Optical and Electronic Materials
Organic chemistry
Solid State Physics
Stacking faults
Transmission electron microscopy
Zinc tellurides
title Microstructural Characterization of Defects and Chemical Etching for HgCdSe/ZnTe/Si (211) Heterostructures
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-06T04%3A07%3A36IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Microstructural%20Characterization%20of%20Defects%20and%20Chemical%20Etching%20for%20HgCdSe/ZnTe/Si%20(211)%20Heterostructures&rft.jtitle=Journal%20of%20electronic%20materials&rft.au=Vaghayenegar,%20M.&rft.date=2019-01-01&rft.volume=48&rft.issue=1&rft.spage=571&rft.epage=582&rft.pages=571-582&rft.issn=0361-5235&rft.eissn=1543-186X&rft_id=info:doi/10.1007/s11664-018-6737-0&rft_dat=%3Cproquest_cross%3E2127090587%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=2127090587&rft_id=info:pmid/&rfr_iscdi=true