Localized corrosion of aluminum alloy 6061 in the presence of Aspergillus niger

The corrosion behavior of anodized and non-anodized aluminum alloy 6061 in the presence of Aspergillus niger fungus was studied using electrochemical noise, recurrence plots and electrochemical impedance spectroscopy techniques. Corrosion potential measurements were also obtained. The fungus generat...

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Veröffentlicht in:	International biodeterioration & biodegradation 2018-09, Vol.133, p.17-25
Hauptverfasser:	Jirón-Lazos, U., Corvo, F., De la Rosa, S.C., García-Ochoa, E.M., Bastidas, D.M., Bastidas, J.M.
Format:	Artikel
Sprache:	eng
Schlagworte:	Aluminum Aluminum alloy 6061 Aluminum alloys Aluminum base alloys Anodizing Aspergillus niger Aspergillus niger fungus Biofilms Corrosion Corrosion mechanisms Corrosion potential Electrochemical impedance spectroscopy Electrochemical noise Electrochemistry Electron transfer Fungi Localized corrosion Microbial localized corrosion Microorganisms Organic acids Recurrence plots Spectroscopy Spectrum analysis
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