Theoretical Analysis and Experimental Study on Material Removal Per Length of Wire in the Cutting of Multi-wire Saw with Reciprocating

Wire saw is widely used in wafers sawing in the photovoltaic and microelectronics industries, it also widely applied to cut other brittle materials. The quality of sawn wafer plays an important role in the subsequent machining process such as grinding and polishing. Theoretical models about reciprocating motion and feed motion of multi-wire saw are established, concept of material removal per length of wire is proposed, theoretical model about the material removal per length of wire versus cutting position are deduced. The influences of wire consumption length of a piece of wafer and feed speed ratio on the material removal per length of wire are analyzed theoretically. Sapphire ingot sawing experiments is carried out with various wire consumption lengths of a piece of wafer and feed rate ratios. The wafer qualities were measured. The experimental result showed that material removal per length of wire is different during the whole multi-wire sawing process. The material removal per length of wire is obviously