Process parameters affecting the bonding of in-mold decoration of injection molded components
This paper studies the fundamental parameters affecting bonding strength of injection molded parts by an in- mold decoration process (IMD). In order to investigate the influence of materials used and a variety of processing conditions, a test mold was created for experiments. The impact of each fact...
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| creator | Woyan, F. Bruchmüller, M. Koch, M. |
| description | This paper studies the fundamental parameters affecting bonding strength of injection molded parts by an in- mold decoration process (IMD). In order to investigate the influence of materials used and a variety of processing conditions, a test mold was created for experiments. The impact of each factor was examined quantitatively by a full factorial design of experiment (DOE). The DOE covered as processing parameters melt temperature, mold temperature and packing pressure and for product related parameters film thickness and thermoplastic material. Furthermore, the temperature in the boundary layer was experimentally determined and the thermal conditions calculated with a transient simulation. In addition, the results of the experiment were compared with the simulation. |
| doi_str_mv | 10.1063/1.4965459 |
| format | Conference Proceeding |
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In order to investigate the influence of materials used and a variety of processing conditions, a test mold was created for experiments. The impact of each factor was examined quantitatively by a full factorial design of experiment (DOE). The DOE covered as processing parameters melt temperature, mold temperature and packing pressure and for product related parameters film thickness and thermoplastic material. Furthermore, the temperature in the boundary layer was experimentally determined and the thermal conditions calculated with a transient simulation. In addition, the results of the experiment were compared with the simulation.</description><identifier>ISSN: 0094-243X</identifier><identifier>EISSN: 1551-7616</identifier><identifier>DOI: 10.1063/1.4965459</identifier><identifier>CODEN: APCPCS</identifier><language>eng</language><publisher>Melville: American Institute of Physics</publisher><subject>Bonding strength ; Boundary layers ; Decoration ; Design of experiments ; Factorial design ; Film thickness ; Injection molding ; Melt temperature ; Molds ; Process parameters</subject><ispartof>AIP conference proceedings, 2016, Vol.1779 (1)</ispartof><rights>Author(s)</rights><rights>2016 Author(s). 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In order to investigate the influence of materials used and a variety of processing conditions, a test mold was created for experiments. The impact of each factor was examined quantitatively by a full factorial design of experiment (DOE). The DOE covered as processing parameters melt temperature, mold temperature and packing pressure and for product related parameters film thickness and thermoplastic material. Furthermore, the temperature in the boundary layer was experimentally determined and the thermal conditions calculated with a transient simulation. In addition, the results of the experiment were compared with the simulation.</description><subject>Bonding strength</subject><subject>Boundary layers</subject><subject>Decoration</subject><subject>Design of experiments</subject><subject>Factorial design</subject><subject>Film thickness</subject><subject>Injection molding</subject><subject>Melt temperature</subject><subject>Molds</subject><subject>Process parameters</subject><issn>0094-243X</issn><issn>1551-7616</issn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2016</creationdate><recordtype>conference_proceeding</recordtype><recordid>eNp9kMtKxDAUhoMoOI4ufIOCO6FjTpo06VIGbzCgCwU3EnLVDtOmJhnBt7d1Bty5Orfv_OfwI3QOeAG4rq5gQZuaUdYcoBkwBiWvoT5EM4wbWhJavR6jk5TWGJOGczFDb08xGJdSMaioOpddTIXy3pnc9u9F_nCFDr2d8uCLti-7sLGFdSZEldvQ77rrCR-LaehsYUI3hN71OZ2iI682yZ3t4xy93N48L-_L1ePdw_J6VQ5EiFxyrTWzjTDgwDGujWi8F5RWHMCRmlgltOFCMKWVZbgi2lDmHTZC1YRqU83RxU53iOFz61KW67CN_XhSEiDAOBFARupyRyXT5t_35RDbTsVv-RWiBLm3Tg7W_wcDlpPXfwvVD_v5cks</recordid><startdate>20161031</startdate><enddate>20161031</enddate><creator>Woyan, F.</creator><creator>Bruchmüller, M.</creator><creator>Koch, M.</creator><general>American Institute of Physics</general><scope>8FD</scope><scope>H8D</scope><scope>L7M</scope></search><sort><creationdate>20161031</creationdate><title>Process parameters affecting the bonding of in-mold decoration of injection molded components</title><author>Woyan, F. ; Bruchmüller, M. ; Koch, M.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-p288t-7bbb5d98c1e1e57bc89ff8443711e262da8bc7885abad5032bc45fe0c8a624bc3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2016</creationdate><topic>Bonding strength</topic><topic>Boundary layers</topic><topic>Decoration</topic><topic>Design of experiments</topic><topic>Factorial design</topic><topic>Film thickness</topic><topic>Injection molding</topic><topic>Melt temperature</topic><topic>Molds</topic><topic>Process parameters</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Woyan, F.</creatorcontrib><creatorcontrib>Bruchmüller, M.</creatorcontrib><creatorcontrib>Koch, M.</creatorcontrib><collection>Technology Research Database</collection><collection>Aerospace Database</collection><collection>Advanced Technologies Database with Aerospace</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Woyan, F.</au><au>Bruchmüller, M.</au><au>Koch, M.</au><au>Holzer, Clemens H.</au><au>Payer, Martin</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Process parameters affecting the bonding of in-mold decoration of injection molded components</atitle><btitle>AIP conference proceedings</btitle><date>2016-10-31</date><risdate>2016</risdate><volume>1779</volume><issue>1</issue><issn>0094-243X</issn><eissn>1551-7616</eissn><coden>APCPCS</coden><abstract>This paper studies the fundamental parameters affecting bonding strength of injection molded parts by an in- mold decoration process (IMD). In order to investigate the influence of materials used and a variety of processing conditions, a test mold was created for experiments. The impact of each factor was examined quantitatively by a full factorial design of experiment (DOE). The DOE covered as processing parameters melt temperature, mold temperature and packing pressure and for product related parameters film thickness and thermoplastic material. Furthermore, the temperature in the boundary layer was experimentally determined and the thermal conditions calculated with a transient simulation. In addition, the results of the experiment were compared with the simulation.</abstract><cop>Melville</cop><pub>American Institute of Physics</pub><doi>10.1063/1.4965459</doi><tpages>5</tpages><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0094-243X |
| ispartof | AIP conference proceedings, 2016, Vol.1779 (1) |
| issn | 0094-243X 1551-7616 |
| language | eng |
| recordid | cdi_proquest_journals_2121572812 |
| source | AIP Journals Complete |
| subjects | Bonding strength Boundary layers Decoration Design of experiments Factorial design Film thickness Injection molding Melt temperature Molds Process parameters |
| title | Process parameters affecting the bonding of in-mold decoration of injection molded components |
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