Flexible IGZO TFT SPICE Model and Design of Active Strain-Compensation Circuits for Bendable Active Matrix Arrays

The detailed measurement and characterization of strain-induced performance variations in flexible InGaZnO thin-film transistors (IGZO TFTs) resulted in a SPICE TFT model able to simulate tensile and compressive bending. This model was used to evaluate a new concept, namely, the active compensation...

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Veröffentlicht in:	IEEE electron device letters 2018-09, Vol.39 (9), p.1314-1317
Hauptverfasser:	bin Wan Zaidi, Wan Muhammad Hilmi, Costa, Julio, Pouryazdan, Arash, Abdullah, Wan Fazlida Hanim, Munzenrieder, Niko
Format:	Artikel
Sprache:	eng
Schlagworte:	Circuit design Circuits Compensation Computer simulation Current measurement flexible electronics IGZO Indium gallium zinc oxide Integrated circuit modeling Logic gates Power consumption Resistors Semiconductor devices Spice-simulation Strain Thin film transistors Threshold voltage
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