Effect of Zn addition on bulk microstructure of lead-free solder SN100C

This paper reports the effect of adding Zn (0.5 wt% Zn, 1.0 wt% Zn) to the bulk microstructure and intermetallic compound (IMC) formation of commercial SN100C (Sn-0.7Cu-0.05Ni+Ge) lead-free solder alloy. Solder alloys were prepared by melting SN100C ingot and Zn shots, and subsequently casted into s...

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Bibliographische Detailangaben
Hauptverfasser:	K., Nur Nadirah M., S., Nurulakmal M.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Copper Germanium Ingot casting Intermetallic compounds Lead free Microstructure Nickel Tin Zinc
Online-Zugang:	Volltext
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