A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials

•An innovative methodology for creating realistic 3D voids for STIM layer.•Void morphology accounts for significant thermal resistance seen in STIM layer.•Thermal resistance is affected by void shapes, distribution and polydispersity.•At low void volume fraction, voids are modelled well as either sp...

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Veröffentlicht in:	Applied thermal engineering 2018-09, Vol.142, p.346-360
Hauptverfasser:	Okereke, Michael I., Ling, Yuxiao
Format:	Artikel
Sprache:	eng
Schlagworte:	3-D technology Chips (electronics) Electronics Finite element method Heat transfer Mathematical morphology Mechanical analysis Microelectronics Polydispersity Qualitative analysis Solder thermal interface materials Soldering Testing Thermal energy Thermal resistance Three-dimensional Virtual reality Virtual testing Void morphology Voids
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