Correlation of intergranular corrosion behaviour with microstructure in Al-Cu-Li alloy
•Increasing ageing temperature and predeformation caused acceleration in the evolution of corrosion mode.•The corrosion mode in AA1460 evolved from intergranular to intragranular.•The precipitation of δ′(Al3Li) and T1 (Al2CuLi) in AA1460 resulted in a lower value of open circuit potential.•A relatio...
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| Veröffentlicht in: | Corrosion science 2018-07, Vol.139, p.215-226 |
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| creator | Huang, Jia-lei Li, Jin-feng Liu, Dan-yang Zhang, Rui-feng Chen, Yong-lai Zhang, Xu-hu Ma, Peng-cheng Gupta, Rajeev Kumar Birbilis, Nick |
| description | •Increasing ageing temperature and predeformation caused acceleration in the evolution of corrosion mode.•The corrosion mode in AA1460 evolved from intergranular to intragranular.•The precipitation of δ′(Al3Li) and T1 (Al2CuLi) in AA1460 resulted in a lower value of open circuit potential.•A relationship between open circuit potential and corrosion mode was presented.
The IGC behaviour, OCP and microstructure of AA1460 (Al-3.12Cu-2.14Li-0.12Sc-0.12Zr, in wt.%), following HT1 (heat treatment without predeformation) and HT2 (heat treatment with predeformation) tempers were investigated. Both δ′ (Al3Li) and T1 (Al2CuLi) phases were precipitated within grains during heat treatment, while T1 phase also precipitated in the vicinity of grain boundaries. The evolution of inter- and intra-granular microstructures in AA1460 influenced the local and global electrochemical characteristics, which in turn influenced the temper dependent corrosion morphologies of AA1460. A correlation between OCP and corrosion mode was proposed, which may be used to compare the IGC sensitivity of AA1460 with different tempers. |
| doi_str_mv | 10.1016/j.corsci.2018.05.011 |
| format | Article |
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The IGC behaviour, OCP and microstructure of AA1460 (Al-3.12Cu-2.14Li-0.12Sc-0.12Zr, in wt.%), following HT1 (heat treatment without predeformation) and HT2 (heat treatment with predeformation) tempers were investigated. Both δ′ (Al3Li) and T1 (Al2CuLi) phases were precipitated within grains during heat treatment, while T1 phase also precipitated in the vicinity of grain boundaries. The evolution of inter- and intra-granular microstructures in AA1460 influenced the local and global electrochemical characteristics, which in turn influenced the temper dependent corrosion morphologies of AA1460. A correlation between OCP and corrosion mode was proposed, which may be used to compare the IGC sensitivity of AA1460 with different tempers.</description><identifier>ISSN: 0010-938X</identifier><identifier>EISSN: 1879-0496</identifier><identifier>DOI: 10.1016/j.corsci.2018.05.011</identifier><language>eng</language><publisher>Amsterdam: Elsevier Ltd</publisher><subject>Aluminium ; Aluminum alloys ; Aluminum base alloys ; Circuits ; Copper ; Corrosion ; Grain boundaries ; Heat treating ; Heat treatment ; Intergranular corrosion ; Intergranular corrosion (IGC) ; Microstructure ; Morphology ; Open circuit potential (OCP) ; Predeformation ; TEM</subject><ispartof>Corrosion science, 2018-07, Vol.139, p.215-226</ispartof><rights>2018 Elsevier Ltd</rights><rights>Copyright Elsevier BV Jul 15, 2018</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c334t-e5b981a36c4206917680c73b2bc7ba0c024b934d7c25dc328b89d0e24fb3703d3</citedby><cites>FETCH-LOGICAL-c334t-e5b981a36c4206917680c73b2bc7ba0c024b934d7c25dc328b89d0e24fb3703d3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.corsci.2018.05.011$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,780,784,3548,27922,27923,45993</link.rule.ids></links><search><creatorcontrib>Huang, Jia-lei</creatorcontrib><creatorcontrib>Li, Jin-feng</creatorcontrib><creatorcontrib>Liu, Dan-yang</creatorcontrib><creatorcontrib>Zhang, Rui-feng</creatorcontrib><creatorcontrib>Chen, Yong-lai</creatorcontrib><creatorcontrib>Zhang, Xu-hu</creatorcontrib><creatorcontrib>Ma, Peng-cheng</creatorcontrib><creatorcontrib>Gupta, Rajeev Kumar</creatorcontrib><creatorcontrib>Birbilis, Nick</creatorcontrib><title>Correlation of intergranular corrosion behaviour with microstructure in Al-Cu-Li alloy</title><title>Corrosion science</title><description>•Increasing ageing temperature and predeformation caused acceleration in the evolution of corrosion mode.•The corrosion mode in AA1460 evolved from intergranular to intragranular.•The precipitation of δ′(Al3Li) and T1 (Al2CuLi) in AA1460 resulted in a lower value of open circuit potential.•A relationship between open circuit potential and corrosion mode was presented.
The IGC behaviour, OCP and microstructure of AA1460 (Al-3.12Cu-2.14Li-0.12Sc-0.12Zr, in wt.%), following HT1 (heat treatment without predeformation) and HT2 (heat treatment with predeformation) tempers were investigated. Both δ′ (Al3Li) and T1 (Al2CuLi) phases were precipitated within grains during heat treatment, while T1 phase also precipitated in the vicinity of grain boundaries. The evolution of inter- and intra-granular microstructures in AA1460 influenced the local and global electrochemical characteristics, which in turn influenced the temper dependent corrosion morphologies of AA1460. A correlation between OCP and corrosion mode was proposed, which may be used to compare the IGC sensitivity of AA1460 with different tempers.</description><subject>Aluminium</subject><subject>Aluminum alloys</subject><subject>Aluminum base alloys</subject><subject>Circuits</subject><subject>Copper</subject><subject>Corrosion</subject><subject>Grain boundaries</subject><subject>Heat treating</subject><subject>Heat treatment</subject><subject>Intergranular corrosion</subject><subject>Intergranular corrosion (IGC)</subject><subject>Microstructure</subject><subject>Morphology</subject><subject>Open circuit potential (OCP)</subject><subject>Predeformation</subject><subject>TEM</subject><issn>0010-938X</issn><issn>1879-0496</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2018</creationdate><recordtype>article</recordtype><recordid>eNp9kEtLxDAQx4MouK5-Aw8Fz62TpK9chKX4ggUvKt5CmqZuSrdZp6my396UevY0h_9jZn6EXFNIKND8tku0w1HbhAEtE8gSoPSErGhZiBhSkZ-SFQCFWPDy45xcjGMHAMELK_JeOUTTK2_dELk2soM3-IlqmHqFUahFN85SbXbq27oJox_rd9He6iB4nLSf0IRUtOnjaoq3NlJ9746X5KxV_Wiu_uaavD3cv1ZP8fbl8bnabGPNeepjk9WipIrnOmWQC1rkJeiC16zWRa1AA0trwdOm0CxrNGdlXYoGDEvbmhfAG74mN0vvAd3XZEYvu3DjEFZKRoFTyAqRBVe6uOajRzStPKDdKzxKCnImKDu5EJQzQQmZDARD7G6JmfDBtzUog8MM2jQWjfaycfb_gl8Oj3wg</recordid><startdate>20180715</startdate><enddate>20180715</enddate><creator>Huang, Jia-lei</creator><creator>Li, Jin-feng</creator><creator>Liu, Dan-yang</creator><creator>Zhang, Rui-feng</creator><creator>Chen, Yong-lai</creator><creator>Zhang, Xu-hu</creator><creator>Ma, Peng-cheng</creator><creator>Gupta, Rajeev Kumar</creator><creator>Birbilis, Nick</creator><general>Elsevier Ltd</general><general>Elsevier BV</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SE</scope><scope>8BQ</scope><scope>8FD</scope><scope>F28</scope><scope>FR3</scope><scope>JG9</scope></search><sort><creationdate>20180715</creationdate><title>Correlation of intergranular corrosion behaviour with microstructure in Al-Cu-Li alloy</title><author>Huang, Jia-lei ; Li, Jin-feng ; Liu, Dan-yang ; Zhang, Rui-feng ; Chen, Yong-lai ; Zhang, Xu-hu ; Ma, Peng-cheng ; Gupta, Rajeev Kumar ; Birbilis, Nick</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c334t-e5b981a36c4206917680c73b2bc7ba0c024b934d7c25dc328b89d0e24fb3703d3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2018</creationdate><topic>Aluminium</topic><topic>Aluminum alloys</topic><topic>Aluminum base alloys</topic><topic>Circuits</topic><topic>Copper</topic><topic>Corrosion</topic><topic>Grain boundaries</topic><topic>Heat treating</topic><topic>Heat treatment</topic><topic>Intergranular corrosion</topic><topic>Intergranular corrosion (IGC)</topic><topic>Microstructure</topic><topic>Morphology</topic><topic>Open circuit potential (OCP)</topic><topic>Predeformation</topic><topic>TEM</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Huang, Jia-lei</creatorcontrib><creatorcontrib>Li, Jin-feng</creatorcontrib><creatorcontrib>Liu, Dan-yang</creatorcontrib><creatorcontrib>Zhang, Rui-feng</creatorcontrib><creatorcontrib>Chen, Yong-lai</creatorcontrib><creatorcontrib>Zhang, Xu-hu</creatorcontrib><creatorcontrib>Ma, Peng-cheng</creatorcontrib><creatorcontrib>Gupta, Rajeev Kumar</creatorcontrib><creatorcontrib>Birbilis, Nick</creatorcontrib><collection>CrossRef</collection><collection>Corrosion Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>Materials Research Database</collection><jtitle>Corrosion science</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Huang, Jia-lei</au><au>Li, Jin-feng</au><au>Liu, Dan-yang</au><au>Zhang, Rui-feng</au><au>Chen, Yong-lai</au><au>Zhang, Xu-hu</au><au>Ma, Peng-cheng</au><au>Gupta, Rajeev Kumar</au><au>Birbilis, Nick</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Correlation of intergranular corrosion behaviour with microstructure in Al-Cu-Li alloy</atitle><jtitle>Corrosion science</jtitle><date>2018-07-15</date><risdate>2018</risdate><volume>139</volume><spage>215</spage><epage>226</epage><pages>215-226</pages><issn>0010-938X</issn><eissn>1879-0496</eissn><abstract>•Increasing ageing temperature and predeformation caused acceleration in the evolution of corrosion mode.•The corrosion mode in AA1460 evolved from intergranular to intragranular.•The precipitation of δ′(Al3Li) and T1 (Al2CuLi) in AA1460 resulted in a lower value of open circuit potential.•A relationship between open circuit potential and corrosion mode was presented.
The IGC behaviour, OCP and microstructure of AA1460 (Al-3.12Cu-2.14Li-0.12Sc-0.12Zr, in wt.%), following HT1 (heat treatment without predeformation) and HT2 (heat treatment with predeformation) tempers were investigated. Both δ′ (Al3Li) and T1 (Al2CuLi) phases were precipitated within grains during heat treatment, while T1 phase also precipitated in the vicinity of grain boundaries. The evolution of inter- and intra-granular microstructures in AA1460 influenced the local and global electrochemical characteristics, which in turn influenced the temper dependent corrosion morphologies of AA1460. A correlation between OCP and corrosion mode was proposed, which may be used to compare the IGC sensitivity of AA1460 with different tempers.</abstract><cop>Amsterdam</cop><pub>Elsevier Ltd</pub><doi>10.1016/j.corsci.2018.05.011</doi><tpages>12</tpages></addata></record> |
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| source | ScienceDirect Journals (5 years ago - present) |
| subjects | Aluminium Aluminum alloys Aluminum base alloys Circuits Copper Corrosion Grain boundaries Heat treating Heat treatment Intergranular corrosion Intergranular corrosion (IGC) Microstructure Morphology Open circuit potential (OCP) Predeformation TEM |
| title | Correlation of intergranular corrosion behaviour with microstructure in Al-Cu-Li alloy |
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