Effect of water vapor on the thermal resistance between amorphous silica nanoparticles

Nanoparticle-based materials are of interest because of their unique thermal properties. Possessing the lowest thermal conductivities of any solid materials known, they have been widely used as insulating materials. However, the presence of water vapor has been shown to have a large influence on tho...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Journal of applied physics 2018-08, Vol.124 (5)
Hauptverfasser: Meng, Fanhe, Liu, Jin, Richards, Robert F.
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue 5
container_start_page
container_title Journal of applied physics
container_volume 124
creator Meng, Fanhe
Liu, Jin
Richards, Robert F.
description Nanoparticle-based materials are of interest because of their unique thermal properties. Possessing the lowest thermal conductivities of any solid materials known, they have been widely used as insulating materials. However, the presence of water vapor has been shown to have a large influence on those properties. In this work, we investigate the effect of water vapor on the heat transfer between nanoparticles using non-equilibrium molecular dynamics simulations. We calculate the absolute thermal resistance and Kapitza resistance between adjacent amorphous spherical silica nanoparticles, when water molecules are allowed to diffuse as vapor into the interstitial pores between particles. The thermal resistance between nanoparticles is shown to decrease rapidly when water vapor is introduced into the pores between particles. The largest decrease in interparticle resistance occurs as a result of the silanization of the silica particle surfaces. A secondary decrease is attributable to the liquid bridge that forms as water molecules condense around the contact point between nanoparticles. Most of the decrease in resistance between nanoparticles occurs when water vapor is first introduced at relative humidities (rh) of less than 1%. As the relative humidity increases above 1%, the interparticle thermal resistance decreases more slowly, approaching a constant value near 50% rh. Numerical results are compared to experimental measurements of heat transfer across packed beds of 20 nm silica nanoparticles exposed to water vapor. The simulation results are shown to be consistent with the experimental measurements for relative humidities below 15% rh, while underpredicting the experimental measurements above 15% rh.
doi_str_mv 10.1063/1.5038117
format Article
fullrecord <record><control><sourceid>proquest_scita</sourceid><recordid>TN_cdi_proquest_journals_2086301711</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2086301711</sourcerecordid><originalsourceid>FETCH-LOGICAL-c358t-557eb4137559fad8a46139a02037f2652be91061c4017697c3a417d9603437c23</originalsourceid><addsrcrecordid>eNp9kM1OwzAQhC0EEqVw4A0scQIpZTdOYvuIqvIjVeICXKOt66ipUjvYDhVvT6r2zGE1l29md4exW4QZQiUecVaCUIjyjE0QlM5kWcI5mwDkmCkt9SW7inELgKiEnrCvRdNYk7hv-J6SDfyHeh-4dzxt7GHCjjoebGxjImcsX9m0t9Zx2vnQb_wQeWy71hB35HxPIbWms_GaXTTURXtz0in7fF58zF-z5fvL2_xpmRlRqpSVpbSrAsV4pG5oraioUGiCHIRs8qrMV1aPb6EpAGWlpRFUoFzrCkQhpMnFlN0dc_vgvwcbU731Q3DjyjoHVYnRhjhS90fKBB9jsE3dh3ZH4bdGqA-11VifahvZhyMbTZsotd79A_8ByKtrGA</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2086301711</pqid></control><display><type>article</type><title>Effect of water vapor on the thermal resistance between amorphous silica nanoparticles</title><source>American Institute of Physics (AIP) Journals</source><source>Alma/SFX Local Collection</source><creator>Meng, Fanhe ; Liu, Jin ; Richards, Robert F.</creator><creatorcontrib>Meng, Fanhe ; Liu, Jin ; Richards, Robert F.</creatorcontrib><description>Nanoparticle-based materials are of interest because of their unique thermal properties. Possessing the lowest thermal conductivities of any solid materials known, they have been widely used as insulating materials. However, the presence of water vapor has been shown to have a large influence on those properties. In this work, we investigate the effect of water vapor on the heat transfer between nanoparticles using non-equilibrium molecular dynamics simulations. We calculate the absolute thermal resistance and Kapitza resistance between adjacent amorphous spherical silica nanoparticles, when water molecules are allowed to diffuse as vapor into the interstitial pores between particles. The thermal resistance between nanoparticles is shown to decrease rapidly when water vapor is introduced into the pores between particles. The largest decrease in interparticle resistance occurs as a result of the silanization of the silica particle surfaces. A secondary decrease is attributable to the liquid bridge that forms as water molecules condense around the contact point between nanoparticles. Most of the decrease in resistance between nanoparticles occurs when water vapor is first introduced at relative humidities (rh) of less than 1%. As the relative humidity increases above 1%, the interparticle thermal resistance decreases more slowly, approaching a constant value near 50% rh. Numerical results are compared to experimental measurements of heat transfer across packed beds of 20 nm silica nanoparticles exposed to water vapor. The simulation results are shown to be consistent with the experimental measurements for relative humidities below 15% rh, while underpredicting the experimental measurements above 15% rh.</description><identifier>ISSN: 0021-8979</identifier><identifier>EISSN: 1089-7550</identifier><identifier>DOI: 10.1063/1.5038117</identifier><identifier>CODEN: JAPIAU</identifier><language>eng</language><publisher>Melville: American Institute of Physics</publisher><subject>Amorphous materials ; Applied physics ; Computer simulation ; Heat transfer ; Insulation ; Kapitza resistance ; Liquid bridges ; Molecular dynamics ; Nanoparticles ; Packed beds ; Relative humidity ; Silicon dioxide ; Thermal energy ; Thermal resistance ; Thermodynamic properties ; Vapor resistance ; Water chemistry ; Water vapor</subject><ispartof>Journal of applied physics, 2018-08, Vol.124 (5)</ispartof><rights>Author(s)</rights><rights>2018 Author(s). Published by AIP Publishing.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c358t-557eb4137559fad8a46139a02037f2652be91061c4017697c3a417d9603437c23</citedby><cites>FETCH-LOGICAL-c358t-557eb4137559fad8a46139a02037f2652be91061c4017697c3a417d9603437c23</cites><orcidid>0000-0002-0839-5153 ; 0000-0003-3850-7619 ; 0000-0002-3505-5728</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://pubs.aip.org/jap/article-lookup/doi/10.1063/1.5038117$$EHTML$$P50$$Gscitation$$H</linktohtml><link.rule.ids>314,776,780,790,4498,27903,27904,76130</link.rule.ids></links><search><creatorcontrib>Meng, Fanhe</creatorcontrib><creatorcontrib>Liu, Jin</creatorcontrib><creatorcontrib>Richards, Robert F.</creatorcontrib><title>Effect of water vapor on the thermal resistance between amorphous silica nanoparticles</title><title>Journal of applied physics</title><description>Nanoparticle-based materials are of interest because of their unique thermal properties. Possessing the lowest thermal conductivities of any solid materials known, they have been widely used as insulating materials. However, the presence of water vapor has been shown to have a large influence on those properties. In this work, we investigate the effect of water vapor on the heat transfer between nanoparticles using non-equilibrium molecular dynamics simulations. We calculate the absolute thermal resistance and Kapitza resistance between adjacent amorphous spherical silica nanoparticles, when water molecules are allowed to diffuse as vapor into the interstitial pores between particles. The thermal resistance between nanoparticles is shown to decrease rapidly when water vapor is introduced into the pores between particles. The largest decrease in interparticle resistance occurs as a result of the silanization of the silica particle surfaces. A secondary decrease is attributable to the liquid bridge that forms as water molecules condense around the contact point between nanoparticles. Most of the decrease in resistance between nanoparticles occurs when water vapor is first introduced at relative humidities (rh) of less than 1%. As the relative humidity increases above 1%, the interparticle thermal resistance decreases more slowly, approaching a constant value near 50% rh. Numerical results are compared to experimental measurements of heat transfer across packed beds of 20 nm silica nanoparticles exposed to water vapor. The simulation results are shown to be consistent with the experimental measurements for relative humidities below 15% rh, while underpredicting the experimental measurements above 15% rh.</description><subject>Amorphous materials</subject><subject>Applied physics</subject><subject>Computer simulation</subject><subject>Heat transfer</subject><subject>Insulation</subject><subject>Kapitza resistance</subject><subject>Liquid bridges</subject><subject>Molecular dynamics</subject><subject>Nanoparticles</subject><subject>Packed beds</subject><subject>Relative humidity</subject><subject>Silicon dioxide</subject><subject>Thermal energy</subject><subject>Thermal resistance</subject><subject>Thermodynamic properties</subject><subject>Vapor resistance</subject><subject>Water chemistry</subject><subject>Water vapor</subject><issn>0021-8979</issn><issn>1089-7550</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2018</creationdate><recordtype>article</recordtype><recordid>eNp9kM1OwzAQhC0EEqVw4A0scQIpZTdOYvuIqvIjVeICXKOt66ipUjvYDhVvT6r2zGE1l29md4exW4QZQiUecVaCUIjyjE0QlM5kWcI5mwDkmCkt9SW7inELgKiEnrCvRdNYk7hv-J6SDfyHeh-4dzxt7GHCjjoebGxjImcsX9m0t9Zx2vnQb_wQeWy71hB35HxPIbWms_GaXTTURXtz0in7fF58zF-z5fvL2_xpmRlRqpSVpbSrAsV4pG5oraioUGiCHIRs8qrMV1aPb6EpAGWlpRFUoFzrCkQhpMnFlN0dc_vgvwcbU731Q3DjyjoHVYnRhjhS90fKBB9jsE3dh3ZH4bdGqA-11VifahvZhyMbTZsotd79A_8ByKtrGA</recordid><startdate>20180807</startdate><enddate>20180807</enddate><creator>Meng, Fanhe</creator><creator>Liu, Jin</creator><creator>Richards, Robert F.</creator><general>American Institute of Physics</general><scope>AAYXX</scope><scope>CITATION</scope><scope>8FD</scope><scope>H8D</scope><scope>L7M</scope><orcidid>https://orcid.org/0000-0002-0839-5153</orcidid><orcidid>https://orcid.org/0000-0003-3850-7619</orcidid><orcidid>https://orcid.org/0000-0002-3505-5728</orcidid></search><sort><creationdate>20180807</creationdate><title>Effect of water vapor on the thermal resistance between amorphous silica nanoparticles</title><author>Meng, Fanhe ; Liu, Jin ; Richards, Robert F.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c358t-557eb4137559fad8a46139a02037f2652be91061c4017697c3a417d9603437c23</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2018</creationdate><topic>Amorphous materials</topic><topic>Applied physics</topic><topic>Computer simulation</topic><topic>Heat transfer</topic><topic>Insulation</topic><topic>Kapitza resistance</topic><topic>Liquid bridges</topic><topic>Molecular dynamics</topic><topic>Nanoparticles</topic><topic>Packed beds</topic><topic>Relative humidity</topic><topic>Silicon dioxide</topic><topic>Thermal energy</topic><topic>Thermal resistance</topic><topic>Thermodynamic properties</topic><topic>Vapor resistance</topic><topic>Water chemistry</topic><topic>Water vapor</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Meng, Fanhe</creatorcontrib><creatorcontrib>Liu, Jin</creatorcontrib><creatorcontrib>Richards, Robert F.</creatorcontrib><collection>CrossRef</collection><collection>Technology Research Database</collection><collection>Aerospace Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Journal of applied physics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Meng, Fanhe</au><au>Liu, Jin</au><au>Richards, Robert F.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Effect of water vapor on the thermal resistance between amorphous silica nanoparticles</atitle><jtitle>Journal of applied physics</jtitle><date>2018-08-07</date><risdate>2018</risdate><volume>124</volume><issue>5</issue><issn>0021-8979</issn><eissn>1089-7550</eissn><coden>JAPIAU</coden><abstract>Nanoparticle-based materials are of interest because of their unique thermal properties. Possessing the lowest thermal conductivities of any solid materials known, they have been widely used as insulating materials. However, the presence of water vapor has been shown to have a large influence on those properties. In this work, we investigate the effect of water vapor on the heat transfer between nanoparticles using non-equilibrium molecular dynamics simulations. We calculate the absolute thermal resistance and Kapitza resistance between adjacent amorphous spherical silica nanoparticles, when water molecules are allowed to diffuse as vapor into the interstitial pores between particles. The thermal resistance between nanoparticles is shown to decrease rapidly when water vapor is introduced into the pores between particles. The largest decrease in interparticle resistance occurs as a result of the silanization of the silica particle surfaces. A secondary decrease is attributable to the liquid bridge that forms as water molecules condense around the contact point between nanoparticles. Most of the decrease in resistance between nanoparticles occurs when water vapor is first introduced at relative humidities (rh) of less than 1%. As the relative humidity increases above 1%, the interparticle thermal resistance decreases more slowly, approaching a constant value near 50% rh. Numerical results are compared to experimental measurements of heat transfer across packed beds of 20 nm silica nanoparticles exposed to water vapor. The simulation results are shown to be consistent with the experimental measurements for relative humidities below 15% rh, while underpredicting the experimental measurements above 15% rh.</abstract><cop>Melville</cop><pub>American Institute of Physics</pub><doi>10.1063/1.5038117</doi><tpages>12</tpages><orcidid>https://orcid.org/0000-0002-0839-5153</orcidid><orcidid>https://orcid.org/0000-0003-3850-7619</orcidid><orcidid>https://orcid.org/0000-0002-3505-5728</orcidid></addata></record>
fulltext fulltext
identifier ISSN: 0021-8979
ispartof Journal of applied physics, 2018-08, Vol.124 (5)
issn 0021-8979
1089-7550
language eng
recordid cdi_proquest_journals_2086301711
source American Institute of Physics (AIP) Journals; Alma/SFX Local Collection
subjects Amorphous materials
Applied physics
Computer simulation
Heat transfer
Insulation
Kapitza resistance
Liquid bridges
Molecular dynamics
Nanoparticles
Packed beds
Relative humidity
Silicon dioxide
Thermal energy
Thermal resistance
Thermodynamic properties
Vapor resistance
Water chemistry
Water vapor
title Effect of water vapor on the thermal resistance between amorphous silica nanoparticles
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-27T19%3A58%3A14IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_scita&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Effect%20of%20water%20vapor%20on%20the%20thermal%20resistance%20between%20amorphous%20silica%20nanoparticles&rft.jtitle=Journal%20of%20applied%20physics&rft.au=Meng,%20Fanhe&rft.date=2018-08-07&rft.volume=124&rft.issue=5&rft.issn=0021-8979&rft.eissn=1089-7550&rft.coden=JAPIAU&rft_id=info:doi/10.1063/1.5038117&rft_dat=%3Cproquest_scita%3E2086301711%3C/proquest_scita%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=2086301711&rft_id=info:pmid/&rfr_iscdi=true