Preparation and curing chemistry of ultra-low CTE epoxy composite based on the newly-designed triethoxysilyl-functionalized ortho-cresol novolac epoxy
For the design of the semiconductor packaging material, one of the most important challenges is to overcome the higher thermal expansion property of ‘organic’ epoxy composite than that of the ‘inorganic’ IC chip. Therefore, in order to prepare the epoxy composite with the ultra-low coefficient of th...
Gespeichert in:
| Veröffentlicht in: | Polymer (Guilford) 2018-07, Vol.147, p.81-94 |
|---|---|
| Hauptverfasser: | , , , , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 94 |
|---|---|
| container_issue | |
| container_start_page | 81 |
| container_title | Polymer (Guilford) |
| container_volume | 147 |
| creator | Kim, Yun-Ju Chun, Hyunaee Park, Sook-Yeon Park, Su-Jin Oh, Chang Ho |
| description | For the design of the semiconductor packaging material, one of the most important challenges is to overcome the higher thermal expansion property of ‘organic’ epoxy composite than that of the ‘inorganic’ IC chip. Therefore, in order to prepare the epoxy composite with the ultra-low coefficient of thermal expansion (CTE), the new material class of epoxy, i.e., alkoxysilyl-functionalized novolac epoxy (Si(OEt)3-EOCN) was synthesized using the ortho-cresol novolac epoxy (EOCN) as a starting material. The new epoxy composite with the 85wt% of silica showed the CTE1 (at T Tg) of 11 ppm/°C. Note that before alkoxysilyl-modification, the CTE1 and CTE 2 of the EOCN composite were 13 ppm/°C and 44 ppm/°C, respectively. In addition, the alkoxysilyl-functionalized epoxy was observed to show the unique curing chemistry due to the participation of alkoxysilyl group in epoxy curing reaction. In order to understand the chemistry of alkoxysilyl-functionalized epoxy, the reaction mechanism was studied using the model compounds.
[Display omitted]
•New alkoxysilyl-functionalized novolac epoxy with low-CTE is synthesized.•Curing mechanism of new epoxy is studied. |
| doi_str_mv | 10.1016/j.polymer.2018.05.073 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_2082632582</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><els_id>S003238611830483X</els_id><sourcerecordid>2082632582</sourcerecordid><originalsourceid>FETCH-LOGICAL-c374t-88edf2bc9fe9269a43ac43567fe9ac903844c619b84025c33595b6c5f35109b3</originalsourceid><addsrcrecordid>eNqFUc1q3DAQFqWBbjd9hIKgZzn6sbzyKZQlTQKB5LB3IcvjrBat5UhyUudB-rzVsrnnNMx8PzPDh9BPRitGWXN1qKbglyPEilOmKioruhFf0IqpjSCct-wrWlEqOBGqYd_Q95QOlFIueb1C_54iTCaa7MKIzdhjO0c3PmO7h6NLOS44DHj2ORriwxve7m4wTOHvgm04TiG5DLgzCXpc5HkPeIQ3v5AeknseyzRHB3lf-Mn5xZNhHu1pk_Hu_aSJBSM2Qgoej-E1eGPP9pfoYjA-wY-Puka7Pze77R15eLy93_5-IFZs6kyUgn7gnW0HaHnTmloYWwvZbEpvbEuFqmvbsLZTdfnXCiFb2TVWDkIy2nZijX6dbacYXmZIWR_CHMt5SXOqeCO4VLyw5JllY0gpwqCn6I4mLppRfUpAH_RHAvqUgKZSlwSK7vqsg_LBqytosg5GC72LYLPug_vE4T_MtJZL</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2082632582</pqid></control><display><type>article</type><title>Preparation and curing chemistry of ultra-low CTE epoxy composite based on the newly-designed triethoxysilyl-functionalized ortho-cresol novolac epoxy</title><source>Elsevier ScienceDirect Journals Complete</source><creator>Kim, Yun-Ju ; Chun, Hyunaee ; Park, Sook-Yeon ; Park, Su-Jin ; Oh, Chang Ho</creator><creatorcontrib>Kim, Yun-Ju ; Chun, Hyunaee ; Park, Sook-Yeon ; Park, Su-Jin ; Oh, Chang Ho</creatorcontrib><description>For the design of the semiconductor packaging material, one of the most important challenges is to overcome the higher thermal expansion property of ‘organic’ epoxy composite than that of the ‘inorganic’ IC chip. Therefore, in order to prepare the epoxy composite with the ultra-low coefficient of thermal expansion (CTE), the new material class of epoxy, i.e., alkoxysilyl-functionalized novolac epoxy (Si(OEt)3-EOCN) was synthesized using the ortho-cresol novolac epoxy (EOCN) as a starting material. The new epoxy composite with the 85wt% of silica showed the CTE1 (at T < Tg) of 8 ppm/°C and CTE2 (at T > Tg) of 11 ppm/°C. Note that before alkoxysilyl-modification, the CTE1 and CTE 2 of the EOCN composite were 13 ppm/°C and 44 ppm/°C, respectively. In addition, the alkoxysilyl-functionalized epoxy was observed to show the unique curing chemistry due to the participation of alkoxysilyl group in epoxy curing reaction. In order to understand the chemistry of alkoxysilyl-functionalized epoxy, the reaction mechanism was studied using the model compounds.
[Display omitted]
•New alkoxysilyl-functionalized novolac epoxy with low-CTE is synthesized.•Curing mechanism of new epoxy is studied.</description><identifier>ISSN: 0032-3861</identifier><identifier>EISSN: 1873-2291</identifier><identifier>DOI: 10.1016/j.polymer.2018.05.073</identifier><language>eng</language><publisher>Kidlington: Elsevier Ltd</publisher><subject>Bisphenol A ; Catalysts ; Chemical synthesis ; Chemistry ; Composite materials ; Cresol ; Curing ; Epoxy cresol novolacs ; Epoxy resins ; Integrated circuits ; Organic chemistry ; Packaging ; Packaging design ; Reaction mechanisms ; Silica ; Silicon dioxide ; Thermal expansion</subject><ispartof>Polymer (Guilford), 2018-07, Vol.147, p.81-94</ispartof><rights>2018 Elsevier Ltd</rights><rights>Copyright Elsevier BV Jul 4, 2018</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c374t-88edf2bc9fe9269a43ac43567fe9ac903844c619b84025c33595b6c5f35109b3</citedby><cites>FETCH-LOGICAL-c374t-88edf2bc9fe9269a43ac43567fe9ac903844c619b84025c33595b6c5f35109b3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://www.sciencedirect.com/science/article/pii/S003238611830483X$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,776,780,3537,27901,27902,65306</link.rule.ids></links><search><creatorcontrib>Kim, Yun-Ju</creatorcontrib><creatorcontrib>Chun, Hyunaee</creatorcontrib><creatorcontrib>Park, Sook-Yeon</creatorcontrib><creatorcontrib>Park, Su-Jin</creatorcontrib><creatorcontrib>Oh, Chang Ho</creatorcontrib><title>Preparation and curing chemistry of ultra-low CTE epoxy composite based on the newly-designed triethoxysilyl-functionalized ortho-cresol novolac epoxy</title><title>Polymer (Guilford)</title><description>For the design of the semiconductor packaging material, one of the most important challenges is to overcome the higher thermal expansion property of ‘organic’ epoxy composite than that of the ‘inorganic’ IC chip. Therefore, in order to prepare the epoxy composite with the ultra-low coefficient of thermal expansion (CTE), the new material class of epoxy, i.e., alkoxysilyl-functionalized novolac epoxy (Si(OEt)3-EOCN) was synthesized using the ortho-cresol novolac epoxy (EOCN) as a starting material. The new epoxy composite with the 85wt% of silica showed the CTE1 (at T < Tg) of 8 ppm/°C and CTE2 (at T > Tg) of 11 ppm/°C. Note that before alkoxysilyl-modification, the CTE1 and CTE 2 of the EOCN composite were 13 ppm/°C and 44 ppm/°C, respectively. In addition, the alkoxysilyl-functionalized epoxy was observed to show the unique curing chemistry due to the participation of alkoxysilyl group in epoxy curing reaction. In order to understand the chemistry of alkoxysilyl-functionalized epoxy, the reaction mechanism was studied using the model compounds.
[Display omitted]
•New alkoxysilyl-functionalized novolac epoxy with low-CTE is synthesized.•Curing mechanism of new epoxy is studied.</description><subject>Bisphenol A</subject><subject>Catalysts</subject><subject>Chemical synthesis</subject><subject>Chemistry</subject><subject>Composite materials</subject><subject>Cresol</subject><subject>Curing</subject><subject>Epoxy cresol novolacs</subject><subject>Epoxy resins</subject><subject>Integrated circuits</subject><subject>Organic chemistry</subject><subject>Packaging</subject><subject>Packaging design</subject><subject>Reaction mechanisms</subject><subject>Silica</subject><subject>Silicon dioxide</subject><subject>Thermal expansion</subject><issn>0032-3861</issn><issn>1873-2291</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2018</creationdate><recordtype>article</recordtype><recordid>eNqFUc1q3DAQFqWBbjd9hIKgZzn6sbzyKZQlTQKB5LB3IcvjrBat5UhyUudB-rzVsrnnNMx8PzPDh9BPRitGWXN1qKbglyPEilOmKioruhFf0IqpjSCct-wrWlEqOBGqYd_Q95QOlFIueb1C_54iTCaa7MKIzdhjO0c3PmO7h6NLOS44DHj2ORriwxve7m4wTOHvgm04TiG5DLgzCXpc5HkPeIQ3v5AeknseyzRHB3lf-Mn5xZNhHu1pk_Hu_aSJBSM2Qgoej-E1eGPP9pfoYjA-wY-Puka7Pze77R15eLy93_5-IFZs6kyUgn7gnW0HaHnTmloYWwvZbEpvbEuFqmvbsLZTdfnXCiFb2TVWDkIy2nZijX6dbacYXmZIWR_CHMt5SXOqeCO4VLyw5JllY0gpwqCn6I4mLppRfUpAH_RHAvqUgKZSlwSK7vqsg_LBqytosg5GC72LYLPug_vE4T_MtJZL</recordid><startdate>20180704</startdate><enddate>20180704</enddate><creator>Kim, Yun-Ju</creator><creator>Chun, Hyunaee</creator><creator>Park, Sook-Yeon</creator><creator>Park, Su-Jin</creator><creator>Oh, Chang Ho</creator><general>Elsevier Ltd</general><general>Elsevier BV</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7QF</scope><scope>7QO</scope><scope>7QQ</scope><scope>7SC</scope><scope>7SE</scope><scope>7SP</scope><scope>7SR</scope><scope>7T7</scope><scope>7TA</scope><scope>7TB</scope><scope>7U5</scope><scope>8BQ</scope><scope>8FD</scope><scope>C1K</scope><scope>F28</scope><scope>FR3</scope><scope>H8D</scope><scope>H8G</scope><scope>JG9</scope><scope>JQ2</scope><scope>KR7</scope><scope>L7M</scope><scope>L~C</scope><scope>L~D</scope><scope>P64</scope></search><sort><creationdate>20180704</creationdate><title>Preparation and curing chemistry of ultra-low CTE epoxy composite based on the newly-designed triethoxysilyl-functionalized ortho-cresol novolac epoxy</title><author>Kim, Yun-Ju ; Chun, Hyunaee ; Park, Sook-Yeon ; Park, Su-Jin ; Oh, Chang Ho</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c374t-88edf2bc9fe9269a43ac43567fe9ac903844c619b84025c33595b6c5f35109b3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2018</creationdate><topic>Bisphenol A</topic><topic>Catalysts</topic><topic>Chemical synthesis</topic><topic>Chemistry</topic><topic>Composite materials</topic><topic>Cresol</topic><topic>Curing</topic><topic>Epoxy cresol novolacs</topic><topic>Epoxy resins</topic><topic>Integrated circuits</topic><topic>Organic chemistry</topic><topic>Packaging</topic><topic>Packaging design</topic><topic>Reaction mechanisms</topic><topic>Silica</topic><topic>Silicon dioxide</topic><topic>Thermal expansion</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Kim, Yun-Ju</creatorcontrib><creatorcontrib>Chun, Hyunaee</creatorcontrib><creatorcontrib>Park, Sook-Yeon</creatorcontrib><creatorcontrib>Park, Su-Jin</creatorcontrib><creatorcontrib>Oh, Chang Ho</creatorcontrib><collection>CrossRef</collection><collection>Aluminium Industry Abstracts</collection><collection>Biotechnology Research Abstracts</collection><collection>Ceramic Abstracts</collection><collection>Computer and Information Systems Abstracts</collection><collection>Corrosion Abstracts</collection><collection>Electronics & Communications Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>Industrial and Applied Microbiology Abstracts (Microbiology A)</collection><collection>Materials Business File</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Environmental Sciences and Pollution Management</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>Aerospace Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><collection>ProQuest Computer Science Collection</collection><collection>Civil Engineering Abstracts</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Computer and Information Systems Abstracts Academic</collection><collection>Computer and Information Systems Abstracts Professional</collection><collection>Biotechnology and BioEngineering Abstracts</collection><jtitle>Polymer (Guilford)</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Kim, Yun-Ju</au><au>Chun, Hyunaee</au><au>Park, Sook-Yeon</au><au>Park, Su-Jin</au><au>Oh, Chang Ho</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Preparation and curing chemistry of ultra-low CTE epoxy composite based on the newly-designed triethoxysilyl-functionalized ortho-cresol novolac epoxy</atitle><jtitle>Polymer (Guilford)</jtitle><date>2018-07-04</date><risdate>2018</risdate><volume>147</volume><spage>81</spage><epage>94</epage><pages>81-94</pages><issn>0032-3861</issn><eissn>1873-2291</eissn><abstract>For the design of the semiconductor packaging material, one of the most important challenges is to overcome the higher thermal expansion property of ‘organic’ epoxy composite than that of the ‘inorganic’ IC chip. Therefore, in order to prepare the epoxy composite with the ultra-low coefficient of thermal expansion (CTE), the new material class of epoxy, i.e., alkoxysilyl-functionalized novolac epoxy (Si(OEt)3-EOCN) was synthesized using the ortho-cresol novolac epoxy (EOCN) as a starting material. The new epoxy composite with the 85wt% of silica showed the CTE1 (at T < Tg) of 8 ppm/°C and CTE2 (at T > Tg) of 11 ppm/°C. Note that before alkoxysilyl-modification, the CTE1 and CTE 2 of the EOCN composite were 13 ppm/°C and 44 ppm/°C, respectively. In addition, the alkoxysilyl-functionalized epoxy was observed to show the unique curing chemistry due to the participation of alkoxysilyl group in epoxy curing reaction. In order to understand the chemistry of alkoxysilyl-functionalized epoxy, the reaction mechanism was studied using the model compounds.
[Display omitted]
•New alkoxysilyl-functionalized novolac epoxy with low-CTE is synthesized.•Curing mechanism of new epoxy is studied.</abstract><cop>Kidlington</cop><pub>Elsevier Ltd</pub><doi>10.1016/j.polymer.2018.05.073</doi><tpages>14</tpages></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0032-3861 |
| ispartof | Polymer (Guilford), 2018-07, Vol.147, p.81-94 |
| issn | 0032-3861 1873-2291 |
| language | eng |
| recordid | cdi_proquest_journals_2082632582 |
| source | Elsevier ScienceDirect Journals Complete |
| subjects | Bisphenol A Catalysts Chemical synthesis Chemistry Composite materials Cresol Curing Epoxy cresol novolacs Epoxy resins Integrated circuits Organic chemistry Packaging Packaging design Reaction mechanisms Silica Silicon dioxide Thermal expansion |
| title | Preparation and curing chemistry of ultra-low CTE epoxy composite based on the newly-designed triethoxysilyl-functionalized ortho-cresol novolac epoxy |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-12T18%3A55%3A31IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Preparation%20and%20curing%20chemistry%20of%20ultra-low%20CTE%20epoxy%20composite%20based%20on%20the%20newly-designed%20triethoxysilyl-functionalized%20ortho-cresol%20novolac%20epoxy&rft.jtitle=Polymer%20(Guilford)&rft.au=Kim,%20Yun-Ju&rft.date=2018-07-04&rft.volume=147&rft.spage=81&rft.epage=94&rft.pages=81-94&rft.issn=0032-3861&rft.eissn=1873-2291&rft_id=info:doi/10.1016/j.polymer.2018.05.073&rft_dat=%3Cproquest_cross%3E2082632582%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=2082632582&rft_id=info:pmid/&rft_els_id=S003238611830483X&rfr_iscdi=true |