Semi-analytic approximation of the temperature field resulting from moving heat loads

•A novel semi-analytic approximation for 2D moving heat source problems is proposed.•The approximation decouples the 2D problem into three 1D problems.•In a wafer heating example the approximation reduces the computational time by 90%.•The approximation is also applicable to 3D spatial domains. Movi...

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Veröffentlicht in:International journal of heat and mass transfer 2018-07, Vol.122, p.128-137
Hauptverfasser: Veldman, D.W.M., Fey, R.H.B., Zwart, H.J., van de Wal, M.M.J., van den Boom, J.D.B.J., Nijmeijer, H.
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Sprache:eng
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