Densely Interconnected Porous BN Frameworks for Multifunctional and Isotropically Thermoconductive Polymer Composites

Ideal materials for modern electronics packaging should be highly thermoconductive. This may be achieved through designing multifunctional polymer composites. Such composites may generally be achieved via effective embedment of functional inorganic fillers into desirable polymeric bodies. Herein, tw...

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Veröffentlicht in:	Advanced functional materials 2018-07, Vol.28 (29), p.n/a
Hauptverfasser:	Xue, Yanming, Zhou, Xin, Zhan, Tianzhuo, Jiang, Baozhen, Guo, Quansheng, Fu, Xiuwei, Shimamura, Kiyoshi, Xu, Yibin, Mori, Takao, Dai, Pengcheng, Bando, Yoshio, Tang, Chengchun, Golberg, Dmitri
Format:	Artikel
Sprache:	eng
Schlagworte:	BN porous frameworks Chemical vapor deposition Combinatorial analysis dielectric properties Electronic packaging Fillers High resistance High temperature isotropic thermal conductivities Materials science Nanorods Organic chemistry Polymer matrix composites Polymers Porous materials porous polymer composites Substitution reactions Thermal expansion thermal expansions Three dimensional composites Weight reduction
Online-Zugang:	Volltext
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