Grain size-dependent Sc microalloying effect on the yield strength-pitting corrosion correlation in Al-Cu alloys

Coarse-grained (CG), fine-grained (FG), and ultrafine-grained (UFG) Al-2.5 wt% Cu (Al-Cu) alloys were respectively prepared, with and without 0.3 wt% Sc addition, for comparison. The influences of minor Sc addition on the microstructural evolution, tensile mechanical properties and pitting corrosion resistance were systematically studied at different grain scales. A significant Sc microalloying effect on the precipitation was observed that the minor Sc addition promoted the dispersion of finer θ′-Al2Cu precipitates in the CG alloy and favored the intragranular θ′-Al2Cu precipitation in the FG and UFG alloys, with the smaller grain size leading to a stronger Sc microalloying effect. The Sc addition induced convincing increases in the yield strength at all the three grain scales, and improved (in the CG and UFG Al-Cu alloys) or retained (in the FG Al-Cu alloy) the pitting corrosion resistance at the same time. This indicates that the inverse strength-pitting corrosion correlation as usually observed can be broken by minor Sc addition. The strengthening mechanisms were discussed and the grain size-dependent pitting corrosion resistance mediated by the Sc addition was rationalized in terms of a competition between the positive influence derived from the interfacial Sc segregation and the negative influence come from the deformation-induced dislocations. The present findings provide a possible approach to break the inverse strength-pitting resistance correlation in heat-treatable Al alloys by modifying the precipitate/matrix interfaces through the suitable microalloying atom segregation. [Display omitted]