Refinement Mechanism of Bi Addition on the Microstructure of Rapidly Solidified Sn-3.5Ag Eutectic Solder for Microelectronic Packaging
The effects of Bi on the microstructure of Sn-3.5Ag eutectic solder ribbon prepared by rapid solidification was investigated by optical microscopy, scanning electron microscopy and energy dispersive spectroscopy. Bi refines the primary β-Sn phase and eutectic structure. The mechanism was investigate...
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| Veröffentlicht in: | Journal of electronic materials 2018-09, Vol.47 (9), p.5588-5594 |
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| creator | Liu, Shengfa Xiong, Wenyong Xiong, Jieran Tan, Guanghua Hu, Zhebing Chen, Chen Huang, Shangyu |
| description | The effects of Bi on the microstructure of Sn-3.5Ag eutectic solder ribbon prepared by rapid solidification was investigated by optical microscopy, scanning electron microscopy and energy dispersive spectroscopy. Bi refines the primary β-Sn phase and eutectic structure. The mechanism was investigated using differential scanning calorimetry and classical nucleation theory, respectively. The results show that the primary β-Sn phase and eutectic structure can be refined by adding a small amount of Bi. The refinement of the primary β-Sn phase is attributed to high compositional undercooling by Bi addition. The refinement of eutectic structure is caused by the reduction of critical nucleation radius and critical nucleation energy due to Bi segregation. With the addition of 0.3 wt.% Bi, the shear strength of solder joints increases by 12.15%. |
| doi_str_mv | 10.1007/s11664-018-6448-6 |
| format | Article |
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Bi refines the primary β-Sn phase and eutectic structure. The mechanism was investigated using differential scanning calorimetry and classical nucleation theory, respectively. The results show that the primary β-Sn phase and eutectic structure can be refined by adding a small amount of Bi. The refinement of the primary β-Sn phase is attributed to high compositional undercooling by Bi addition. The refinement of eutectic structure is caused by the reduction of critical nucleation radius and critical nucleation energy due to Bi segregation. With the addition of 0.3 wt.% Bi, the shear strength of solder joints increases by 12.15%.</description><identifier>ISSN: 0361-5235</identifier><identifier>EISSN: 1543-186X</identifier><identifier>DOI: 10.1007/s11664-018-6448-6</identifier><language>eng</language><publisher>New York: Springer US</publisher><subject>Bismuth ; Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Electronic packaging ; Electronics and Microelectronics ; Instrumentation ; Materials Science ; Microstructure ; Nucleation ; Optical and Electronic Materials ; Optical microscopy ; Rapid solidification ; Scanning electron microscopy ; Shear strength ; Solid State Physics ; Supercooling ; Tin base alloys</subject><ispartof>Journal of electronic materials, 2018-09, Vol.47 (9), p.5588-5594</ispartof><rights>The Minerals, Metals & Materials Society 2018</rights><rights>Journal of Electronic Materials is a copyright of Springer, (2018). All Rights Reserved.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c316t-f89ba29271e06777e662242db246049620fa89648bfba562c68378274bc4f1023</citedby><cites>FETCH-LOGICAL-c316t-f89ba29271e06777e662242db246049620fa89648bfba562c68378274bc4f1023</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s11664-018-6448-6$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s11664-018-6448-6$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,780,784,27924,27925,41488,42557,51319</link.rule.ids></links><search><creatorcontrib>Liu, Shengfa</creatorcontrib><creatorcontrib>Xiong, Wenyong</creatorcontrib><creatorcontrib>Xiong, Jieran</creatorcontrib><creatorcontrib>Tan, Guanghua</creatorcontrib><creatorcontrib>Hu, Zhebing</creatorcontrib><creatorcontrib>Chen, Chen</creatorcontrib><creatorcontrib>Huang, Shangyu</creatorcontrib><title>Refinement Mechanism of Bi Addition on the Microstructure of Rapidly Solidified Sn-3.5Ag Eutectic Solder for Microelectronic Packaging</title><title>Journal of electronic materials</title><addtitle>Journal of Elec Materi</addtitle><description>The effects of Bi on the microstructure of Sn-3.5Ag eutectic solder ribbon prepared by rapid solidification was investigated by optical microscopy, scanning electron microscopy and energy dispersive spectroscopy. Bi refines the primary β-Sn phase and eutectic structure. The mechanism was investigated using differential scanning calorimetry and classical nucleation theory, respectively. The results show that the primary β-Sn phase and eutectic structure can be refined by adding a small amount of Bi. The refinement of the primary β-Sn phase is attributed to high compositional undercooling by Bi addition. The refinement of eutectic structure is caused by the reduction of critical nucleation radius and critical nucleation energy due to Bi segregation. With the addition of 0.3 wt.% Bi, the shear strength of solder joints increases by 12.15%.</description><subject>Bismuth</subject><subject>Characterization and Evaluation of Materials</subject><subject>Chemistry and Materials Science</subject><subject>Electronic packaging</subject><subject>Electronics and Microelectronics</subject><subject>Instrumentation</subject><subject>Materials Science</subject><subject>Microstructure</subject><subject>Nucleation</subject><subject>Optical and Electronic Materials</subject><subject>Optical microscopy</subject><subject>Rapid solidification</subject><subject>Scanning electron microscopy</subject><subject>Shear strength</subject><subject>Solid State Physics</subject><subject>Supercooling</subject><subject>Tin base alloys</subject><issn>0361-5235</issn><issn>1543-186X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2018</creationdate><recordtype>article</recordtype><sourceid>8G5</sourceid><sourceid>ABUWG</sourceid><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><sourceid>GNUQQ</sourceid><sourceid>GUQSH</sourceid><sourceid>M2O</sourceid><recordid>eNp1UM1q3DAQFiWFbtI8QG6Cnr3VyPLYPm6XTVpIaMk2kJuQZWlX2115I8mHvECfuzIu5BQYZmC-n2E-Qm6ALYGx-msEQBQFg6ZAIXL7QBZQibKABp8vyIKVCEXFy-oTuYzxwBhU0MCC_H001nlzMj7RB6P3yrt4ooOl3xxd9b1LbvA0V9ob-uB0GGIKo05jMBPpUZ1df3yl2-Hoemed6enWF-WyWu3oZkxGJ6cnsDeB2iHMDuaY92HwGfql9B-1c373mXy06hjN9f95RZ5uN7_X34v7n3c_1qv7QpeAqbBN2yne8hoMw7quDSLngvcdF8hEi5xZ1bQoms52qkKusSnrhtei08IC4-UV-TL7nsPwMpqY5GEYg88nJWcInFcIbWbBzJr-jcFYeQ7upMKrBCanuOUct8xxyyluiVnDZ03MXL8z4c35fdE_QXyCNg</recordid><startdate>20180901</startdate><enddate>20180901</enddate><creator>Liu, Shengfa</creator><creator>Xiong, Wenyong</creator><creator>Xiong, Jieran</creator><creator>Tan, Guanghua</creator><creator>Hu, Zhebing</creator><creator>Chen, Chen</creator><creator>Huang, Shangyu</creator><general>Springer US</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>3V.</scope><scope>7XB</scope><scope>88I</scope><scope>8AF</scope><scope>8AO</scope><scope>8FE</scope><scope>8FG</scope><scope>8FK</scope><scope>8G5</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>GNUQQ</scope><scope>GUQSH</scope><scope>HCIFZ</scope><scope>KB.</scope><scope>L6V</scope><scope>M2O</scope><scope>M2P</scope><scope>M7S</scope><scope>MBDVC</scope><scope>P5Z</scope><scope>P62</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>PTHSS</scope><scope>Q9U</scope><scope>S0X</scope></search><sort><creationdate>20180901</creationdate><title>Refinement Mechanism of Bi Addition on the Microstructure of Rapidly Solidified Sn-3.5Ag Eutectic Solder for Microelectronic Packaging</title><author>Liu, Shengfa ; Xiong, Wenyong ; Xiong, Jieran ; Tan, Guanghua ; Hu, Zhebing ; Chen, Chen ; Huang, Shangyu</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c316t-f89ba29271e06777e662242db246049620fa89648bfba562c68378274bc4f1023</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2018</creationdate><topic>Bismuth</topic><topic>Characterization and Evaluation of Materials</topic><topic>Chemistry and Materials Science</topic><topic>Electronic packaging</topic><topic>Electronics and Microelectronics</topic><topic>Instrumentation</topic><topic>Materials Science</topic><topic>Microstructure</topic><topic>Nucleation</topic><topic>Optical and Electronic Materials</topic><topic>Optical microscopy</topic><topic>Rapid solidification</topic><topic>Scanning electron microscopy</topic><topic>Shear strength</topic><topic>Solid State Physics</topic><topic>Supercooling</topic><topic>Tin base alloys</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Liu, Shengfa</creatorcontrib><creatorcontrib>Xiong, Wenyong</creatorcontrib><creatorcontrib>Xiong, Jieran</creatorcontrib><creatorcontrib>Tan, Guanghua</creatorcontrib><creatorcontrib>Hu, Zhebing</creatorcontrib><creatorcontrib>Chen, Chen</creatorcontrib><creatorcontrib>Huang, Shangyu</creatorcontrib><collection>CrossRef</collection><collection>ProQuest Central (Corporate)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>Science Database (Alumni Edition)</collection><collection>STEM Database</collection><collection>ProQuest Pharma Collection</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>Research Library (Alumni Edition)</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies & Aerospace Collection</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>ProQuest Central Student</collection><collection>Research Library Prep</collection><collection>SciTech Premium Collection</collection><collection>Materials Science Database</collection><collection>ProQuest Engineering Collection</collection><collection>Research Library</collection><collection>Science Database</collection><collection>Engineering Database</collection><collection>Research Library (Corporate)</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>Engineering Collection</collection><collection>ProQuest Central Basic</collection><collection>SIRS Editorial</collection><jtitle>Journal of electronic materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Liu, Shengfa</au><au>Xiong, Wenyong</au><au>Xiong, Jieran</au><au>Tan, Guanghua</au><au>Hu, Zhebing</au><au>Chen, Chen</au><au>Huang, Shangyu</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Refinement Mechanism of Bi Addition on the Microstructure of Rapidly Solidified Sn-3.5Ag Eutectic Solder for Microelectronic Packaging</atitle><jtitle>Journal of electronic materials</jtitle><stitle>Journal of Elec Materi</stitle><date>2018-09-01</date><risdate>2018</risdate><volume>47</volume><issue>9</issue><spage>5588</spage><epage>5594</epage><pages>5588-5594</pages><issn>0361-5235</issn><eissn>1543-186X</eissn><abstract>The effects of Bi on the microstructure of Sn-3.5Ag eutectic solder ribbon prepared by rapid solidification was investigated by optical microscopy, scanning electron microscopy and energy dispersive spectroscopy. Bi refines the primary β-Sn phase and eutectic structure. The mechanism was investigated using differential scanning calorimetry and classical nucleation theory, respectively. The results show that the primary β-Sn phase and eutectic structure can be refined by adding a small amount of Bi. The refinement of the primary β-Sn phase is attributed to high compositional undercooling by Bi addition. The refinement of eutectic structure is caused by the reduction of critical nucleation radius and critical nucleation energy due to Bi segregation. With the addition of 0.3 wt.% Bi, the shear strength of solder joints increases by 12.15%.</abstract><cop>New York</cop><pub>Springer US</pub><doi>10.1007/s11664-018-6448-6</doi><tpages>7</tpages></addata></record> |
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| subjects | Bismuth Characterization and Evaluation of Materials Chemistry and Materials Science Electronic packaging Electronics and Microelectronics Instrumentation Materials Science Microstructure Nucleation Optical and Electronic Materials Optical microscopy Rapid solidification Scanning electron microscopy Shear strength Solid State Physics Supercooling Tin base alloys |
| title | Refinement Mechanism of Bi Addition on the Microstructure of Rapidly Solidified Sn-3.5Ag Eutectic Solder for Microelectronic Packaging |
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