Compensation of Surface Roughness Using an Au Intermediate Layer in a Cu Direct Bonding Process

Copper-copper (Cu-Cu) direct bonding assisted by direct immersion gold (DIG) was demonstrated. Cu-Cu direct bonding is a critical technology for inductively coupled memory interconnections. To solve the problems of conventional methods of Cu-Cu direct bonding, a plating process using DIG to form an...

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Veröffentlicht in:	Journal of electronic materials 2018-09, Vol.47 (9), p.5403-5409
Hauptverfasser:	Noma, Hirokazu, Kamibayashi, Takumi, Kuwae, Hiroyuki, Suzuki, Naoya, Nonaka, Toshihisa, Shoji, Shuichi, Mizuno, Jun
Format:	Artikel
Sprache:	eng
Schlagworte:	Bonding Characterization and Evaluation of Materials Chemistry and Materials Science Copper Deformation Diffusion welding Electronics and Microelectronics Energy dispersive X ray spectroscopy Energy transmission Gold Instrumentation Materials Science Optical and Electronic Materials Shear tests Solid State Physics Substrates Surface roughness Transmission electron microscopy
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