Primary dendrite growth of Co3Sn2 intermetallic compound in rapidly solidified ternary Co35Cu35Sn30 alloy
The rapid solidification of ternary Co 35 Cu 35 Sn 30 alloy droplets with 20–785 µm diameter was realized by drop tube technique, aiming to investigate the dendrite growth mechanism of primary Co 3 Sn 2 intermetallic compound at high cooling rate. As alloy droplet diameter decreases, the surface seg...
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| Veröffentlicht in: | Applied physics. A, Materials science & processing Materials science & processing, 2018-07, Vol.124 (7), p.1-8, Article 472 |
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| container_title | Applied physics. A, Materials science & processing |
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| creator | Liu, J. M. Zhai, W. Dai, F. P. Yan, P. X. Wei, B. |
| description | The rapid solidification of ternary Co
35
Cu
35
Sn
30
alloy droplets with 20–785 µm diameter was realized by drop tube technique, aiming to investigate the dendrite growth mechanism of primary Co
3
Sn
2
intermetallic compound at high cooling rate. As alloy droplet diameter decreases, the surface segregation occurs prior to the solidification process with an increased probability, and the segregation shell becomes more apparent. The dendrite growth of primary Co
3
Sn
2
compound dominates the droplet solidification process, which evolves from equiaxed dendrite to spherical grain and is accompanied by remarkable grain refinement with the decrease of droplet diameter. Meanwhile, a peculiar zone near the droplet surface in which the primary Co
3
Sn
2
compound grows directionally is observed. This directional structure becomes more evident as droplet diameter decreases, which is attributed to the temperature gradient along the radial direction inside droplet. In each alloy droplet, owing to the increased cooling rate from the center to the surface, the grain size decreases accordingly. |
| doi_str_mv | 10.1007/s00339-018-1884-y |
| format | Article |
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35
Cu
35
Sn
30
alloy droplets with 20–785 µm diameter was realized by drop tube technique, aiming to investigate the dendrite growth mechanism of primary Co
3
Sn
2
intermetallic compound at high cooling rate. As alloy droplet diameter decreases, the surface segregation occurs prior to the solidification process with an increased probability, and the segregation shell becomes more apparent. The dendrite growth of primary Co
3
Sn
2
compound dominates the droplet solidification process, which evolves from equiaxed dendrite to spherical grain and is accompanied by remarkable grain refinement with the decrease of droplet diameter. Meanwhile, a peculiar zone near the droplet surface in which the primary Co
3
Sn
2
compound grows directionally is observed. This directional structure becomes more evident as droplet diameter decreases, which is attributed to the temperature gradient along the radial direction inside droplet. In each alloy droplet, owing to the increased cooling rate from the center to the surface, the grain size decreases accordingly.</description><identifier>ISSN: 0947-8396</identifier><identifier>EISSN: 1432-0630</identifier><identifier>DOI: 10.1007/s00339-018-1884-y</identifier><language>eng</language><publisher>Berlin/Heidelberg: Springer Berlin Heidelberg</publisher><subject>Applied physics ; Characterization and Evaluation of Materials ; Condensed Matter Physics ; Cooling rate ; Dendritic structure ; Grain refinement ; Intermetallic compounds ; Machines ; Manufacturing ; Materials science ; Nanotechnology ; Optical and Electronic Materials ; Physics ; Physics and Astronomy ; Processes ; Rapid solidification ; Surfaces and Interfaces ; Temperature gradients ; Thin Films</subject><ispartof>Applied physics. A, Materials science & processing, 2018-07, Vol.124 (7), p.1-8, Article 472</ispartof><rights>Springer-Verlag GmbH Germany, part of Springer Nature 2018</rights><rights>Copyright Springer Science & Business Media 2018</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c359t-3ede2f77b3bc19d5dd762b783c555067e57b80325ba6f075038599fa0f424a83</citedby><cites>FETCH-LOGICAL-c359t-3ede2f77b3bc19d5dd762b783c555067e57b80325ba6f075038599fa0f424a83</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s00339-018-1884-y$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s00339-018-1884-y$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,780,784,27924,27925,41488,42557,51319</link.rule.ids></links><search><creatorcontrib>Liu, J. M.</creatorcontrib><creatorcontrib>Zhai, W.</creatorcontrib><creatorcontrib>Dai, F. P.</creatorcontrib><creatorcontrib>Yan, P. X.</creatorcontrib><creatorcontrib>Wei, B.</creatorcontrib><title>Primary dendrite growth of Co3Sn2 intermetallic compound in rapidly solidified ternary Co35Cu35Sn30 alloy</title><title>Applied physics. A, Materials science & processing</title><addtitle>Appl. Phys. A</addtitle><description>The rapid solidification of ternary Co
35
Cu
35
Sn
30
alloy droplets with 20–785 µm diameter was realized by drop tube technique, aiming to investigate the dendrite growth mechanism of primary Co
3
Sn
2
intermetallic compound at high cooling rate. As alloy droplet diameter decreases, the surface segregation occurs prior to the solidification process with an increased probability, and the segregation shell becomes more apparent. The dendrite growth of primary Co
3
Sn
2
compound dominates the droplet solidification process, which evolves from equiaxed dendrite to spherical grain and is accompanied by remarkable grain refinement with the decrease of droplet diameter. Meanwhile, a peculiar zone near the droplet surface in which the primary Co
3
Sn
2
compound grows directionally is observed. This directional structure becomes more evident as droplet diameter decreases, which is attributed to the temperature gradient along the radial direction inside droplet. In each alloy droplet, owing to the increased cooling rate from the center to the surface, the grain size decreases accordingly.</description><subject>Applied physics</subject><subject>Characterization and Evaluation of Materials</subject><subject>Condensed Matter Physics</subject><subject>Cooling rate</subject><subject>Dendritic structure</subject><subject>Grain refinement</subject><subject>Intermetallic compounds</subject><subject>Machines</subject><subject>Manufacturing</subject><subject>Materials science</subject><subject>Nanotechnology</subject><subject>Optical and Electronic Materials</subject><subject>Physics</subject><subject>Physics and Astronomy</subject><subject>Processes</subject><subject>Rapid solidification</subject><subject>Surfaces and Interfaces</subject><subject>Temperature gradients</subject><subject>Thin Films</subject><issn>0947-8396</issn><issn>1432-0630</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2018</creationdate><recordtype>article</recordtype><recordid>eNp1kE1LxDAQhoMouK7-AG8Bz9FJ0jTpUYpfsKCwew9tk65Zuk1NWqT_3iwVPDmXgeF9XoYHoVsK9xRAPkQAzgsCVBGqVEbmM7SiGWcEcg7naAVFJoniRX6JrmI8QJqMsRVyH8EdqzBjY3sT3GjxPvjv8RP7Fpeeb3uGXT_acLRj1XWuwY0_Dn7qTTrjUA3OdDOOvnPGtc4anKL9qS6xopy42PYccCL9fI0u2qqL9uZ3r9Hu-WlXvpLN-8tb-bghDRfFSLg1lrVS1rxuaGGEMTJntVS8EUJALq2QtQLORF3lLUgBXImiaCtoM5ZViq_R3VI7BP812Tjqg5_ST13UDASlAjLFUoouqSb4GINt9bB40BT0SahehOokVJ-E6jkxbGFiyvZ7G_6a_4d-AD-seMA</recordid><startdate>20180701</startdate><enddate>20180701</enddate><creator>Liu, J. M.</creator><creator>Zhai, W.</creator><creator>Dai, F. P.</creator><creator>Yan, P. X.</creator><creator>Wei, B.</creator><general>Springer Berlin Heidelberg</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>20180701</creationdate><title>Primary dendrite growth of Co3Sn2 intermetallic compound in rapidly solidified ternary Co35Cu35Sn30 alloy</title><author>Liu, J. M. ; Zhai, W. ; Dai, F. P. ; Yan, P. X. ; Wei, B.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c359t-3ede2f77b3bc19d5dd762b783c555067e57b80325ba6f075038599fa0f424a83</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2018</creationdate><topic>Applied physics</topic><topic>Characterization and Evaluation of Materials</topic><topic>Condensed Matter Physics</topic><topic>Cooling rate</topic><topic>Dendritic structure</topic><topic>Grain refinement</topic><topic>Intermetallic compounds</topic><topic>Machines</topic><topic>Manufacturing</topic><topic>Materials science</topic><topic>Nanotechnology</topic><topic>Optical and Electronic Materials</topic><topic>Physics</topic><topic>Physics and Astronomy</topic><topic>Processes</topic><topic>Rapid solidification</topic><topic>Surfaces and Interfaces</topic><topic>Temperature gradients</topic><topic>Thin Films</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Liu, J. M.</creatorcontrib><creatorcontrib>Zhai, W.</creatorcontrib><creatorcontrib>Dai, F. P.</creatorcontrib><creatorcontrib>Yan, P. X.</creatorcontrib><creatorcontrib>Wei, B.</creatorcontrib><collection>CrossRef</collection><jtitle>Applied physics. A, Materials science & processing</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Liu, J. M.</au><au>Zhai, W.</au><au>Dai, F. P.</au><au>Yan, P. X.</au><au>Wei, B.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Primary dendrite growth of Co3Sn2 intermetallic compound in rapidly solidified ternary Co35Cu35Sn30 alloy</atitle><jtitle>Applied physics. A, Materials science & processing</jtitle><stitle>Appl. Phys. A</stitle><date>2018-07-01</date><risdate>2018</risdate><volume>124</volume><issue>7</issue><spage>1</spage><epage>8</epage><pages>1-8</pages><artnum>472</artnum><issn>0947-8396</issn><eissn>1432-0630</eissn><abstract>The rapid solidification of ternary Co
35
Cu
35
Sn
30
alloy droplets with 20–785 µm diameter was realized by drop tube technique, aiming to investigate the dendrite growth mechanism of primary Co
3
Sn
2
intermetallic compound at high cooling rate. As alloy droplet diameter decreases, the surface segregation occurs prior to the solidification process with an increased probability, and the segregation shell becomes more apparent. The dendrite growth of primary Co
3
Sn
2
compound dominates the droplet solidification process, which evolves from equiaxed dendrite to spherical grain and is accompanied by remarkable grain refinement with the decrease of droplet diameter. Meanwhile, a peculiar zone near the droplet surface in which the primary Co
3
Sn
2
compound grows directionally is observed. This directional structure becomes more evident as droplet diameter decreases, which is attributed to the temperature gradient along the radial direction inside droplet. In each alloy droplet, owing to the increased cooling rate from the center to the surface, the grain size decreases accordingly.</abstract><cop>Berlin/Heidelberg</cop><pub>Springer Berlin Heidelberg</pub><doi>10.1007/s00339-018-1884-y</doi><tpages>8</tpages><oa>free_for_read</oa></addata></record> |
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| ispartof | Applied physics. A, Materials science & processing, 2018-07, Vol.124 (7), p.1-8, Article 472 |
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| language | eng |
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| source | SpringerNature Journals |
| subjects | Applied physics Characterization and Evaluation of Materials Condensed Matter Physics Cooling rate Dendritic structure Grain refinement Intermetallic compounds Machines Manufacturing Materials science Nanotechnology Optical and Electronic Materials Physics Physics and Astronomy Processes Rapid solidification Surfaces and Interfaces Temperature gradients Thin Films |
| title | Primary dendrite growth of Co3Sn2 intermetallic compound in rapidly solidified ternary Co35Cu35Sn30 alloy |
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