加熱した錫めっき銅板および黄銅板における錫めっき層の状態分析
Voltammetric technique using an ammonia buffer solution（0.5 mol/dm3 NH4OH＋0.5 mol/dm3 NH4Cl）was applied to ascertain the corrosion products formed on tin plating on pure copper or brass and to clarify the products' formation processes. The main corrosion products formed on tin plating in air we...
Gespeichert in:
| Veröffentlicht in: | Hyōmen gijutsu 2017/06/01, Vol.68(6), pp.349-354 |
|---|---|
| Hauptverfasser: | , , , , , |
| Format: | Artikel |
| Sprache: | jpn |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 354 |
|---|---|
| container_issue | 6 |
| container_start_page | 349 |
| container_title | Hyōmen gijutsu |
| container_volume | 68 |
| creator | 中山, 茂吉 林, 美樹 藤岡, 寛之 関谷, 貴志 能登谷, 武紀 大堺, 利行 |
| description | Voltammetric technique using an ammonia buffer solution（0.5 mol/dm3 NH4OH＋0.5 mol/dm3 NH4Cl）was applied to ascertain the corrosion products formed on tin plating on pure copper or brass and to clarify the products' formation processes. The main corrosion products formed on tin plating in air were found to be SnO and SnO2･nH2O. Results further showed that SnO was formed in air at 180 ℃, although SnO2･nH2O was formed at 80 ℃ with high relative humidity of 90%. Copper/tin alloy layers in tin plating on copper grew with increased heating time. Analytical results show that the SnO film thickness on tin plating was lower than that on tin sheets. Moreover, characteristic behavior was shown for tin plating on brass in which Zn diffused rapidly to the surface under high-humidity conditions. The diffused Zn was oxidized to ZnO. However, the SnO amounts on tin plating on brass were lower than on pure copper. |
| doi_str_mv | 10.4139/sfj.68.349 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_jstag</sourceid><recordid>TN_cdi_proquest_journals_2050313389</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2050313389</sourcerecordid><originalsourceid>FETCH-LOGICAL-j2329-c5f539a4d8607a5b4b1289622a3128913441dbedaaf86d5f423f6e639caab6e13</originalsourceid><addsrcrecordid>eNpNkLtKA0EUhgdRMMQ0voL1xp05M-NMYSHBGwRstLEZZm-aJZq4mxSWE0wIGwWtrLyAdgEhCDYWPsyQhLyFCVGxOf_h4-Mc-BFaxW6RYpDraRQXuSgClQsoh4WgDlBXLqKcKzFzsOByGRXStOK5hAEjGNMcOh5mz-POwJp7a54m133bMta8WHMzydqjhy9rMtvqWvM--bz6Jf0ZNHe21fvvDwev1ryNs49RuzfsdkaPtytoKdLVNCz8ZB4d7Wwflvac8sHufmmr7MQEiHR8FjGQmgaCuxuaedTDREhOiIbZgoFSHHhhoHUkeMAiSiDiIQfpa-3xEEMerc3v1pPaRTNMGyquNZPz6UtFXOYCBhByam3OrTht6JNQ1ZPKmU4ulU4aFb8aqml5igvFZ2Pa4B_3T3WiYg3fTn6GkA</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2050313389</pqid></control><display><type>article</type><title>加熱した錫めっき銅板および黄銅板における錫めっき層の状態分析</title><source>J-STAGE</source><creator>中山, 茂吉 ; 林, 美樹 ; 藤岡, 寛之 ; 関谷, 貴志 ; 能登谷, 武紀 ; 大堺, 利行</creator><creatorcontrib>中山, 茂吉 ; 林, 美樹 ; 藤岡, 寛之 ; 関谷, 貴志 ; 能登谷, 武紀 ; 大堺, 利行</creatorcontrib><description>Voltammetric technique using an ammonia buffer solution（0.5 mol/dm3 NH4OH＋0.5 mol/dm3 NH4Cl）was applied to ascertain the corrosion products formed on tin plating on pure copper or brass and to clarify the products' formation processes. The main corrosion products formed on tin plating in air were found to be SnO and SnO2･nH2O. Results further showed that SnO was formed in air at 180 ℃, although SnO2･nH2O was formed at 80 ℃ with high relative humidity of 90%. Copper/tin alloy layers in tin plating on copper grew with increased heating time. Analytical results show that the SnO film thickness on tin plating was lower than that on tin sheets. Moreover, characteristic behavior was shown for tin plating on brass in which Zn diffused rapidly to the surface under high-humidity conditions. The diffused Zn was oxidized to ZnO. However, the SnO amounts on tin plating on brass were lower than on pure copper.</description><identifier>ISSN: 0915-1869</identifier><identifier>EISSN: 1884-3409</identifier><identifier>DOI: 10.4139/sfj.68.349</identifier><language>jpn</language><publisher>Tokyo: 一般社団法人 表面技術協会</publisher><subject>Ammonia ; Ammonia Buffer Solution ; Ammonium chloride ; Boats ; Brass ; Brass plating ; Buffer solutions ; Copper ; Copper plating ; Corrosion products ; Film thickness ; Heat treatment ; Humidity ; Organic chemistry ; Relative humidity ; Tin base alloys ; Tin dioxide ; Tin Oxides ; Tin Plating ; Voltammetry ; Zinc oxide</subject><ispartof>表面技術, 2017/06/01, Vol.68(6), pp.349-354</ispartof><rights>2017 一般社団法人 表面技術協会</rights><rights>Copyright Japan Science and Technology Agency 2017</rights><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,777,781,1877,27905,27906</link.rule.ids></links><search><creatorcontrib>中山, 茂吉</creatorcontrib><creatorcontrib>林, 美樹</creatorcontrib><creatorcontrib>藤岡, 寛之</creatorcontrib><creatorcontrib>関谷, 貴志</creatorcontrib><creatorcontrib>能登谷, 武紀</creatorcontrib><creatorcontrib>大堺, 利行</creatorcontrib><title>加熱した錫めっき銅板および黄銅板における錫めっき層の状態分析</title><title>Hyōmen gijutsu</title><addtitle>表面技術</addtitle><description>Voltammetric technique using an ammonia buffer solution（0.5 mol/dm3 NH4OH＋0.5 mol/dm3 NH4Cl）was applied to ascertain the corrosion products formed on tin plating on pure copper or brass and to clarify the products' formation processes. The main corrosion products formed on tin plating in air were found to be SnO and SnO2･nH2O. Results further showed that SnO was formed in air at 180 ℃, although SnO2･nH2O was formed at 80 ℃ with high relative humidity of 90%. Copper/tin alloy layers in tin plating on copper grew with increased heating time. Analytical results show that the SnO film thickness on tin plating was lower than that on tin sheets. Moreover, characteristic behavior was shown for tin plating on brass in which Zn diffused rapidly to the surface under high-humidity conditions. The diffused Zn was oxidized to ZnO. However, the SnO amounts on tin plating on brass were lower than on pure copper.</description><subject>Ammonia</subject><subject>Ammonia Buffer Solution</subject><subject>Ammonium chloride</subject><subject>Boats</subject><subject>Brass</subject><subject>Brass plating</subject><subject>Buffer solutions</subject><subject>Copper</subject><subject>Copper plating</subject><subject>Corrosion products</subject><subject>Film thickness</subject><subject>Heat treatment</subject><subject>Humidity</subject><subject>Organic chemistry</subject><subject>Relative humidity</subject><subject>Tin base alloys</subject><subject>Tin dioxide</subject><subject>Tin Oxides</subject><subject>Tin Plating</subject><subject>Voltammetry</subject><subject>Zinc oxide</subject><issn>0915-1869</issn><issn>1884-3409</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2017</creationdate><recordtype>article</recordtype><recordid>eNpNkLtKA0EUhgdRMMQ0voL1xp05M-NMYSHBGwRstLEZZm-aJZq4mxSWE0wIGwWtrLyAdgEhCDYWPsyQhLyFCVGxOf_h4-Mc-BFaxW6RYpDraRQXuSgClQsoh4WgDlBXLqKcKzFzsOByGRXStOK5hAEjGNMcOh5mz-POwJp7a54m133bMta8WHMzydqjhy9rMtvqWvM--bz6Jf0ZNHe21fvvDwev1ryNs49RuzfsdkaPtytoKdLVNCz8ZB4d7Wwflvac8sHufmmr7MQEiHR8FjGQmgaCuxuaedTDREhOiIbZgoFSHHhhoHUkeMAiSiDiIQfpa-3xEEMerc3v1pPaRTNMGyquNZPz6UtFXOYCBhByam3OrTht6JNQ1ZPKmU4ulU4aFb8aqml5igvFZ2Pa4B_3T3WiYg3fTn6GkA</recordid><startdate>201706</startdate><enddate>201706</enddate><creator>中山, 茂吉</creator><creator>林, 美樹</creator><creator>藤岡, 寛之</creator><creator>関谷, 貴志</creator><creator>能登谷, 武紀</creator><creator>大堺, 利行</creator><general>一般社団法人 表面技術協会</general><general>Japan Science and Technology Agency</general><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>201706</creationdate><title>加熱した錫めっき銅板および黄銅板における錫めっき層の状態分析</title><author>中山, 茂吉 ; 林, 美樹 ; 藤岡, 寛之 ; 関谷, 貴志 ; 能登谷, 武紀 ; 大堺, 利行</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-j2329-c5f539a4d8607a5b4b1289622a3128913441dbedaaf86d5f423f6e639caab6e13</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>jpn</language><creationdate>2017</creationdate><topic>Ammonia</topic><topic>Ammonia Buffer Solution</topic><topic>Ammonium chloride</topic><topic>Boats</topic><topic>Brass</topic><topic>Brass plating</topic><topic>Buffer solutions</topic><topic>Copper</topic><topic>Copper plating</topic><topic>Corrosion products</topic><topic>Film thickness</topic><topic>Heat treatment</topic><topic>Humidity</topic><topic>Organic chemistry</topic><topic>Relative humidity</topic><topic>Tin base alloys</topic><topic>Tin dioxide</topic><topic>Tin Oxides</topic><topic>Tin Plating</topic><topic>Voltammetry</topic><topic>Zinc oxide</topic><toplevel>online_resources</toplevel><creatorcontrib>中山, 茂吉</creatorcontrib><creatorcontrib>林, 美樹</creatorcontrib><creatorcontrib>藤岡, 寛之</creatorcontrib><creatorcontrib>関谷, 貴志</creatorcontrib><creatorcontrib>能登谷, 武紀</creatorcontrib><creatorcontrib>大堺, 利行</creatorcontrib><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Hyōmen gijutsu</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>中山, 茂吉</au><au>林, 美樹</au><au>藤岡, 寛之</au><au>関谷, 貴志</au><au>能登谷, 武紀</au><au>大堺, 利行</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>加熱した錫めっき銅板および黄銅板における錫めっき層の状態分析</atitle><jtitle>Hyōmen gijutsu</jtitle><addtitle>表面技術</addtitle><date>2017-06</date><risdate>2017</risdate><volume>68</volume><issue>6</issue><spage>349</spage><epage>354</epage><pages>349-354</pages><issn>0915-1869</issn><eissn>1884-3409</eissn><abstract>Voltammetric technique using an ammonia buffer solution（0.5 mol/dm3 NH4OH＋0.5 mol/dm3 NH4Cl）was applied to ascertain the corrosion products formed on tin plating on pure copper or brass and to clarify the products' formation processes. The main corrosion products formed on tin plating in air were found to be SnO and SnO2･nH2O. Results further showed that SnO was formed in air at 180 ℃, although SnO2･nH2O was formed at 80 ℃ with high relative humidity of 90%. Copper/tin alloy layers in tin plating on copper grew with increased heating time. Analytical results show that the SnO film thickness on tin plating was lower than that on tin sheets. Moreover, characteristic behavior was shown for tin plating on brass in which Zn diffused rapidly to the surface under high-humidity conditions. The diffused Zn was oxidized to ZnO. However, the SnO amounts on tin plating on brass were lower than on pure copper.</abstract><cop>Tokyo</cop><pub>一般社団法人 表面技術協会</pub><doi>10.4139/sfj.68.349</doi><tpages>6</tpages><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0915-1869 |
| ispartof | 表面技術, 2017/06/01, Vol.68(6), pp.349-354 |
| issn | 0915-1869 1884-3409 |
| language | jpn |
| recordid | cdi_proquest_journals_2050313389 |
| source | J-STAGE |
| subjects | Ammonia Ammonia Buffer Solution Ammonium chloride Boats Brass Brass plating Buffer solutions Copper Copper plating Corrosion products Film thickness Heat treatment Humidity Organic chemistry Relative humidity Tin base alloys Tin dioxide Tin Oxides Tin Plating Voltammetry Zinc oxide |
| title | 加熱した錫めっき銅板および黄銅板における錫めっき層の状態分析 |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-17T18%3A32%3A23IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_jstag&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=%E5%8A%A0%E7%86%B1%E3%81%97%E3%81%9F%E9%8C%AB%E3%82%81%E3%81%A3%E3%81%8D%E9%8A%85%E6%9D%BF%E3%81%8A%E3%82%88%E3%81%B3%E9%BB%84%E9%8A%85%E6%9D%BF%E3%81%AB%E3%81%8A%E3%81%91%E3%82%8B%E9%8C%AB%E3%82%81%E3%81%A3%E3%81%8D%E5%B1%A4%E3%81%AE%E7%8A%B6%E6%85%8B%E5%88%86%E6%9E%90&rft.jtitle=Hy%C5%8Dmen%20gijutsu&rft.au=%E4%B8%AD%E5%B1%B1,%20%E8%8C%82%E5%90%89&rft.date=2017-06&rft.volume=68&rft.issue=6&rft.spage=349&rft.epage=354&rft.pages=349-354&rft.issn=0915-1869&rft.eissn=1884-3409&rft_id=info:doi/10.4139/sfj.68.349&rft_dat=%3Cproquest_jstag%3E2050313389%3C/proquest_jstag%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=2050313389&rft_id=info:pmid/&rfr_iscdi=true |