Controlling the microstructures from the gold-tin reaction

The microstructures from the reaction between Au and Sn under different conditions were studied. A Sn/Au/Ni sandwich structure (2.5/3.752 µm) was deposited over the Si wafer. The overall composition of the Au and Sn layers corresponded to the Au20Sn binary eutectic (wt.%). When the reaction conditio...

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Veröffentlicht in:	Journal of electronic materials 2005-02, Vol.34 (2), p.182-187
Hauptverfasser:	TSAI, J. Y, CHANG, C. W, SHIEH, Y. C, HU, Y. C, KAO, C. R
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Electronics Exact sciences and technology Gold Lead free solders Optoelectronic device characterization, design, and modeling Optoelectronic devices Optoelectronics Packaging Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Semiconductors Tin
Online-Zugang:	Volltext
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