Study of Fracture Mechanics in Testing Interfacial Fracture of Solder Joints

This paper is concerned with the mechanics of interfacial fracture that are active in two common testing configurations of solder joint reliability. Utilizing eutectic Pb-Sn/Cu as a reference system and assuming the presence of a predefined crack size in the intermetallic compound (IMC) layer, stres...

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Veröffentlicht in:	Journal of electronic materials 2008-04, Vol.37 (4), p.417-428
Hauptverfasser:	Bang, W.H., Moon, M.-W., Kim, C.-U., Kang, S.H., Jung, J.P., Oh, K.H.
Format:	Artikel
Sprache:	eng
Schlagworte:	Characterization and Evaluation of Materials Chemistry and Materials Science Electronics and Microelectronics Fracture mechanics Instrumentation Materials Science Optical and Electronic Materials Shear tests Soldering Solid State Physics Stress intensity factors Tensile strength
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