Wrinkling of graphene because of the thermal expansion mismatch between graphene and copper

Well‐defined bundles of wrinkles are observed on the graphene‐covered copper by using atomic force microscopy after chemical vapor deposition process. Their numerical analyses are performed by employing a set of formula deduced from classical elasticity theory of bent thin films with clamped boundar...

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Veröffentlicht in:	Surface and interface analysis 2018-05, Vol.50 (5), p.547-551
Hauptverfasser:	Ogurtani, Omer Tarik, Senyildiz, Dogukan, Cambaz Buke, Goknur
Format:	Artikel
Sprache:	eng
Schlagworte:	Atomic force microscopy Axial stress Chemical vapor deposition Cooling Copper Elasticity Graphene strain Substrates Temperature dependence Thermal expansion Thermal mismatch thermal stresses Thin films Wrinkling
Online-Zugang:	Volltext
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