Strain rate dependence of tensile strength and ductility of nano and ultrafine grained coppers

An ultrafine grained Cu with a wide distribution of grain size and an average grain size of d= 110nm was prepared by electric brush-plating technique. Tensile properties, microstructure and deformation surface morphologies of this ultrafine grained Cu were compared with two results on an electric br...

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Veröffentlicht in:	Materials science & engineering. A, Structural materials : properties, microstructure and processing Structural materials : properties, microstructure and processing, 2018-01, Vol.712, p.341-349
Hauptverfasser:	Jiang, Yue, Hu, Jiangjiang, Jiang, Zhonghao, Lian, Jianshe, Wen, Cuie
Format:	Artikel
Sprache:	eng
Schlagworte:	Brush plating Copper Deformation Deformation mechanisms Dislocations Ductility Elongation Grain boundaries Grain size Grain size distribution Microstructure Morphology Strain hardening Strain localization Strain rate Strain rate sensitivity Strength Tensile properties Ultrafine grain
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