難加工基板のCMPにおけるスラリーフロー評価法に関する研究: 基板界面におけるスラリー流れ場とそれに及ぼす影響因子の評価

In recent years, LED and power semiconductor devises are spread rapidly towards the realization of the energy-saving society. Chemical mechanical polishing (CMP) is an important technology in the manufacturing process. In the CMP, the Preston's low is beneficial formula for estimating the remov...

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Veröffentlicht in:	Seimitsu Kōgakkaishi 2017/08/05, Vol.83(8), pp.756-761
Hauptverfasser:	畝田, 道雄, 冨家, 勇一, 堀田, 和利, 玉井, 一誠, 森永, 均, 石川, 憲一
Format:	Artikel
Sprache:	jpn
Schlagworte:	adsorptive property Chemical-mechanical polishing Correlation analysis density digital image correlation method Energy conservation hardness Mechanical properties pad asperity polishing pad Slurries slurry slurry flow Substrates velocity ratio
Online-Zugang:	Volltext
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