Component-based workflows for parallel thermomechanical analysis of arrayed geometries
Component-based simulation workflows can increase the agility of the design process by streamlining adaptation of new simulation methods. We present one such workflow for parallel unstructured mesh-based simulations and demonstrate its usefulness in the thermomechanical analysis of an array of solde...
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| Veröffentlicht in: | Engineering with computers 2017-07, Vol.33 (3), p.509-517 |
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| container_title | Engineering with computers |
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| creator | Bloomfield, Max O. Li, Zhen Granzow, Brian Ibanez, Daniel A. Oberai, Assad A. Hansen, Glen A. Liu, Xiao Hu Shephard, Mark S. |
| description | Component-based simulation workflows can increase the agility of the design process by streamlining adaptation of new simulation methods. We present one such workflow for parallel unstructured mesh-based simulations and demonstrate its usefulness in the thermomechanical analysis of an array of solder joints used in microelectronics fabrication. We automate the simulation process from problem specification to the solution of the underlying PDEs, including problem setup, domain definition, and mesh generation. We establish the utility of the proposed approach by demonstrating that qualitatively different stress concentrations are seen in solder joints near the center of such an array and a solder joint seen at the edge of the same array. |
| doi_str_mv | 10.1007/s00366-016-0487-5 |
| format | Article |
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We present one such workflow for parallel unstructured mesh-based simulations and demonstrate its usefulness in the thermomechanical analysis of an array of solder joints used in microelectronics fabrication. We automate the simulation process from problem specification to the solution of the underlying PDEs, including problem setup, domain definition, and mesh generation. 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All Rights Reserved.</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c359t-6a1caa85f2fdfa12a7efd10c10de32359b2deb1ae60c13aa8b4740a02481fe4f3</citedby><cites>FETCH-LOGICAL-c359t-6a1caa85f2fdfa12a7efd10c10de32359b2deb1ae60c13aa8b4740a02481fe4f3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s00366-016-0487-5$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s00366-016-0487-5$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,780,784,27924,27925,41488,42557,51319</link.rule.ids></links><search><creatorcontrib>Bloomfield, Max O.</creatorcontrib><creatorcontrib>Li, Zhen</creatorcontrib><creatorcontrib>Granzow, Brian</creatorcontrib><creatorcontrib>Ibanez, Daniel A.</creatorcontrib><creatorcontrib>Oberai, Assad A.</creatorcontrib><creatorcontrib>Hansen, Glen A.</creatorcontrib><creatorcontrib>Liu, Xiao Hu</creatorcontrib><creatorcontrib>Shephard, Mark S.</creatorcontrib><title>Component-based workflows for parallel thermomechanical analysis of arrayed geometries</title><title>Engineering with computers</title><addtitle>Engineering with Computers</addtitle><description>Component-based simulation workflows can increase the agility of the design process by streamlining adaptation of new simulation methods. We present one such workflow for parallel unstructured mesh-based simulations and demonstrate its usefulness in the thermomechanical analysis of an array of solder joints used in microelectronics fabrication. We automate the simulation process from problem specification to the solution of the underlying PDEs, including problem setup, domain definition, and mesh generation. We establish the utility of the proposed approach by demonstrating that qualitatively different stress concentrations are seen in solder joints near the center of such an array and a solder joint seen at the edge of the same array.</description><subject>Arrays</subject><subject>CAE) and Design</subject><subject>Calculus of Variations and Optimal Control; Optimization</subject><subject>Classical Mechanics</subject><subject>Computer Science</subject><subject>Computer simulation</subject><subject>Computer-Aided Engineering (CAD</subject><subject>Control</subject><subject>Finite element method</subject><subject>Math. Applications in Chemistry</subject><subject>Mathematical and Computational Engineering</subject><subject>Mesh generation</subject><subject>Original Article</subject><subject>Simulation</subject><subject>Soldered joints</subject><subject>Streamlining</subject><subject>Systems Theory</subject><subject>Thermomechanical analysis</subject><subject>Workflow</subject><issn>0177-0667</issn><issn>1435-5663</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2017</creationdate><recordtype>article</recordtype><sourceid>ABUWG</sourceid><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><sourceid>GNUQQ</sourceid><recordid>eNp1kE1LxDAQhoMouH78AG8Fz9FJ0ibdoyx-wYIX9Rqm7WS3a7epSZdl_71Z6sGLh2FgeN6X4WHsRsCdADD3EUBpzUGkyUvDixM2E7kqeKG1OmUzEMZw0Nqcs4sYNwBCAcxn7HPht4PvqR95hZGabO_Dl-v8PmbOh2zAgF1HXTauKWz9luo19m2NXYY9dofYxsy7DEPAQ8quKBFjaClesTOHXaTr333JPp4e3xcvfPn2_Lp4WPJaFfORaxQ1Ylk46RqHQqIh1wioBTSkZEIq2VAlkHS6qURWuckBQealcJQ7dclup94h-O8dxdFu_C6k16IV81IWYHIpEyUmqg4-xkDODqHdYjhYAfaoz076bNJnj_pskTJyysTE9isKf5r_Df0ABtF0ng</recordid><startdate>20170701</startdate><enddate>20170701</enddate><creator>Bloomfield, Max O.</creator><creator>Li, Zhen</creator><creator>Granzow, Brian</creator><creator>Ibanez, Daniel A.</creator><creator>Oberai, Assad A.</creator><creator>Hansen, Glen A.</creator><creator>Liu, Xiao Hu</creator><creator>Shephard, Mark S.</creator><general>Springer London</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>3V.</scope><scope>7SC</scope><scope>7TB</scope><scope>7XB</scope><scope>8AL</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>8FK</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>DWQXO</scope><scope>FR3</scope><scope>GNUQQ</scope><scope>HCIFZ</scope><scope>JQ2</scope><scope>K7-</scope><scope>KR7</scope><scope>L6V</scope><scope>L7M</scope><scope>L~C</scope><scope>L~D</scope><scope>M0N</scope><scope>M7S</scope><scope>P5Z</scope><scope>P62</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>PTHSS</scope><scope>Q9U</scope></search><sort><creationdate>20170701</creationdate><title>Component-based workflows for parallel thermomechanical analysis of arrayed geometries</title><author>Bloomfield, Max O. ; Li, Zhen ; Granzow, Brian ; Ibanez, Daniel A. ; Oberai, Assad A. ; Hansen, Glen A. ; Liu, Xiao Hu ; Shephard, Mark S.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c359t-6a1caa85f2fdfa12a7efd10c10de32359b2deb1ae60c13aa8b4740a02481fe4f3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2017</creationdate><topic>Arrays</topic><topic>CAE) and Design</topic><topic>Calculus of Variations and Optimal Control; Optimization</topic><topic>Classical Mechanics</topic><topic>Computer Science</topic><topic>Computer simulation</topic><topic>Computer-Aided Engineering (CAD</topic><topic>Control</topic><topic>Finite element method</topic><topic>Math. Applications in Chemistry</topic><topic>Mathematical and Computational Engineering</topic><topic>Mesh generation</topic><topic>Original Article</topic><topic>Simulation</topic><topic>Soldered joints</topic><topic>Streamlining</topic><topic>Systems Theory</topic><topic>Thermomechanical analysis</topic><topic>Workflow</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Bloomfield, Max O.</creatorcontrib><creatorcontrib>Li, Zhen</creatorcontrib><creatorcontrib>Granzow, Brian</creatorcontrib><creatorcontrib>Ibanez, Daniel A.</creatorcontrib><creatorcontrib>Oberai, Assad A.</creatorcontrib><creatorcontrib>Hansen, Glen A.</creatorcontrib><creatorcontrib>Liu, Xiao Hu</creatorcontrib><creatorcontrib>Shephard, Mark S.</creatorcontrib><collection>CrossRef</collection><collection>ProQuest Central (Corporate)</collection><collection>Computer and Information Systems Abstracts</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>Computing Database (Alumni Edition)</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies & Aerospace Collection</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Central Korea</collection><collection>Engineering Research Database</collection><collection>ProQuest Central Student</collection><collection>SciTech Premium Collection</collection><collection>ProQuest Computer Science Collection</collection><collection>Computer Science Database</collection><collection>Civil Engineering Abstracts</collection><collection>ProQuest Engineering Collection</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Computer and Information Systems Abstracts Academic</collection><collection>Computer and Information Systems Abstracts Professional</collection><collection>Computing Database</collection><collection>Engineering Database</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>Engineering Collection</collection><collection>ProQuest Central Basic</collection><jtitle>Engineering with computers</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Bloomfield, Max O.</au><au>Li, Zhen</au><au>Granzow, Brian</au><au>Ibanez, Daniel A.</au><au>Oberai, Assad A.</au><au>Hansen, Glen A.</au><au>Liu, Xiao Hu</au><au>Shephard, Mark S.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Component-based workflows for parallel thermomechanical analysis of arrayed geometries</atitle><jtitle>Engineering with computers</jtitle><stitle>Engineering with Computers</stitle><date>2017-07-01</date><risdate>2017</risdate><volume>33</volume><issue>3</issue><spage>509</spage><epage>517</epage><pages>509-517</pages><issn>0177-0667</issn><eissn>1435-5663</eissn><abstract>Component-based simulation workflows can increase the agility of the design process by streamlining adaptation of new simulation methods. We present one such workflow for parallel unstructured mesh-based simulations and demonstrate its usefulness in the thermomechanical analysis of an array of solder joints used in microelectronics fabrication. We automate the simulation process from problem specification to the solution of the underlying PDEs, including problem setup, domain definition, and mesh generation. We establish the utility of the proposed approach by demonstrating that qualitatively different stress concentrations are seen in solder joints near the center of such an array and a solder joint seen at the edge of the same array.</abstract><cop>London</cop><pub>Springer London</pub><doi>10.1007/s00366-016-0487-5</doi><tpages>9</tpages><oa>free_for_read</oa></addata></record> |
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| subjects | Arrays CAE) and Design Calculus of Variations and Optimal Control Optimization Classical Mechanics Computer Science Computer simulation Computer-Aided Engineering (CAD Control Finite element method Math. Applications in Chemistry Mathematical and Computational Engineering Mesh generation Original Article Simulation Soldered joints Streamlining Systems Theory Thermomechanical analysis Workflow |
| title | Component-based workflows for parallel thermomechanical analysis of arrayed geometries |
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