Further insight into interfacial interactions in nickel/liquid Sn–Ag solder system at 230–350 °C

Interfacial reactions are investigated between electrochemical deposited Sn-2 wt%Ag alloy and Ni for isothermal heating at various temperature (230–350 °C) and for various time to study initial stages (1–4 min) and latter stages of reaction (15 min–4 h). During the isothermal heating a continuous co...

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Veröffentlicht in:	Journal of materials science. Materials in electronics 2017-12, Vol.28 (24), p.18366-18378
Hauptverfasser:	Taneja, Divya, Volpert, Marion, Hodaj, Fiqiri
Format:	Artikel
Sprache:	eng
Schlagworte:	Characterization and Evaluation of Materials Chemical reactions Chemistry and Materials Science Elongated structure Heating Interface reactions Materials Science Morphology Needles Optical and Electronic Materials Reaction kinetics Silver base alloys Thickness Tin base alloys
Online-Zugang:	Volltext
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