Bonding Cu to Al2O3 with Bi-B-Zn Oxide Glass Via Oxidation–Reduction Reaction
Bonding Cu on Al 2 O 3 is a key and difficult technology applied in high-power semiconductor devices. A method proposed in this work investigates bonding with a kind of Bi-B-Zn oxide glass powder paste as a solder. Oxidation–reduction reactions between the Cu plate and the solder took place and gene...
Gespeichert in:
| Veröffentlicht in: | Journal of electronic materials 2018, Vol.47 (1), p.542-549 |
|---|---|
| Hauptverfasser: | , , , , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 549 |
|---|---|
| container_issue | 1 |
| container_start_page | 542 |
| container_title | Journal of electronic materials |
| container_volume | 47 |
| creator | Chen, Jianqiang Li, Yufeng Miao, Weiliang Mai, Chengle Li, Mingyu |
| description | Bonding Cu on Al
2
O
3
is a key and difficult technology applied in high-power semiconductor devices. A method proposed in this work investigates bonding with a kind of Bi-B-Zn oxide glass powder paste as a solder. Oxidation–reduction reactions between the Cu plate and the solder took place and generated Bi metal during the joining procedure. With an increase in the joining temperature, the tensile strength increased due to the increase of Bi metal formation. The Bi metal played an important role in joining Cu and Al
2
O
3
because of its much better wettability on Cu than that of the oxides. A compound ZnAl
2
O
4
was observed to form between the Al
2
O
3
ceramic and oxide layer, which strengthened the bond. |
| doi_str_mv | 10.1007/s11664-017-5783-3 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_1979947704</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>1979947704</sourcerecordid><originalsourceid>FETCH-LOGICAL-c316t-c7626db7cf9e63267ab5f81ba62a6102e86f636478e0b3540ac46a1f850e87243</originalsourceid><addsrcrecordid>eNp1kN9KwzAUxoMoOKcP4F3A62hO0pykl9vQKQwKQ0W8CWmbzo7ZatOh3vkOvqFPYrt64Y1X5zvw_YEfIafAz4FzfREAECPGQTOljWRyj4xARZKBwYd9MuISgSkh1SE5CmHNOSgwMCLJtK7yslrR2Za2NZ1sRCLpW9k-0WnJpuyxosl7mXs637gQ6H3pdr9ry7r6_vxa-nyb9ZouvduJY3JQuE3wJ793TO6uLm9n12yRzG9mkwXLJGDLMo0C81RnRexRCtQuVYWB1KFwCFx4gwVKjLTxPJUq4i6L0EFhFPdGi0iOydnQ-9LUr1sfWruut03VTVqIdRxHWvPeBYMra-oQGl_Yl6Z8ds2HBW57bnbgZjtutudmZZcRQyZ03mrlmz_N_4Z-AKQibm4</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>1979947704</pqid></control><display><type>article</type><title>Bonding Cu to Al2O3 with Bi-B-Zn Oxide Glass Via Oxidation–Reduction Reaction</title><source>Springer Nature - Complete Springer Journals</source><creator>Chen, Jianqiang ; Li, Yufeng ; Miao, Weiliang ; Mai, Chengle ; Li, Mingyu</creator><creatorcontrib>Chen, Jianqiang ; Li, Yufeng ; Miao, Weiliang ; Mai, Chengle ; Li, Mingyu</creatorcontrib><description>Bonding Cu on Al
2
O
3
is a key and difficult technology applied in high-power semiconductor devices. A method proposed in this work investigates bonding with a kind of Bi-B-Zn oxide glass powder paste as a solder. Oxidation–reduction reactions between the Cu plate and the solder took place and generated Bi metal during the joining procedure. With an increase in the joining temperature, the tensile strength increased due to the increase of Bi metal formation. The Bi metal played an important role in joining Cu and Al
2
O
3
because of its much better wettability on Cu than that of the oxides. A compound ZnAl
2
O
4
was observed to form between the Al
2
O
3
ceramic and oxide layer, which strengthened the bond.</description><identifier>ISSN: 0361-5235</identifier><identifier>EISSN: 1543-186X</identifier><identifier>DOI: 10.1007/s11664-017-5783-3</identifier><language>eng</language><publisher>New York: Springer US</publisher><subject>Aluminum oxide ; Ceramic bonding ; Characterization and Evaluation of Materials ; Chemical reduction ; Chemistry and Materials Science ; Copper ; Electronics and Microelectronics ; Instrumentation ; Joining ; Materials research ; Materials Science ; Optical and Electronic Materials ; Oxidation ; Power semiconductor devices ; Reaction bonding ; Solid State Physics ; Wettability</subject><ispartof>Journal of electronic materials, 2018, Vol.47 (1), p.542-549</ispartof><rights>The Minerals, Metals & Materials Society 2017</rights><rights>Journal of Electronic Materials is a copyright of Springer, (2017). All Rights Reserved.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c316t-c7626db7cf9e63267ab5f81ba62a6102e86f636478e0b3540ac46a1f850e87243</citedby><cites>FETCH-LOGICAL-c316t-c7626db7cf9e63267ab5f81ba62a6102e86f636478e0b3540ac46a1f850e87243</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s11664-017-5783-3$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s11664-017-5783-3$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,777,781,27905,27906,41469,42538,51300</link.rule.ids></links><search><creatorcontrib>Chen, Jianqiang</creatorcontrib><creatorcontrib>Li, Yufeng</creatorcontrib><creatorcontrib>Miao, Weiliang</creatorcontrib><creatorcontrib>Mai, Chengle</creatorcontrib><creatorcontrib>Li, Mingyu</creatorcontrib><title>Bonding Cu to Al2O3 with Bi-B-Zn Oxide Glass Via Oxidation–Reduction Reaction</title><title>Journal of electronic materials</title><addtitle>Journal of Elec Materi</addtitle><description>Bonding Cu on Al
2
O
3
is a key and difficult technology applied in high-power semiconductor devices. A method proposed in this work investigates bonding with a kind of Bi-B-Zn oxide glass powder paste as a solder. Oxidation–reduction reactions between the Cu plate and the solder took place and generated Bi metal during the joining procedure. With an increase in the joining temperature, the tensile strength increased due to the increase of Bi metal formation. The Bi metal played an important role in joining Cu and Al
2
O
3
because of its much better wettability on Cu than that of the oxides. A compound ZnAl
2
O
4
was observed to form between the Al
2
O
3
ceramic and oxide layer, which strengthened the bond.</description><subject>Aluminum oxide</subject><subject>Ceramic bonding</subject><subject>Characterization and Evaluation of Materials</subject><subject>Chemical reduction</subject><subject>Chemistry and Materials Science</subject><subject>Copper</subject><subject>Electronics and Microelectronics</subject><subject>Instrumentation</subject><subject>Joining</subject><subject>Materials research</subject><subject>Materials Science</subject><subject>Optical and Electronic Materials</subject><subject>Oxidation</subject><subject>Power semiconductor devices</subject><subject>Reaction bonding</subject><subject>Solid State Physics</subject><subject>Wettability</subject><issn>0361-5235</issn><issn>1543-186X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2018</creationdate><recordtype>article</recordtype><sourceid>8G5</sourceid><sourceid>ABUWG</sourceid><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><sourceid>GNUQQ</sourceid><sourceid>GUQSH</sourceid><sourceid>M2O</sourceid><recordid>eNp1kN9KwzAUxoMoOKcP4F3A62hO0pykl9vQKQwKQ0W8CWmbzo7ZatOh3vkOvqFPYrt64Y1X5zvw_YEfIafAz4FzfREAECPGQTOljWRyj4xARZKBwYd9MuISgSkh1SE5CmHNOSgwMCLJtK7yslrR2Za2NZ1sRCLpW9k-0WnJpuyxosl7mXs637gQ6H3pdr9ry7r6_vxa-nyb9ZouvduJY3JQuE3wJ793TO6uLm9n12yRzG9mkwXLJGDLMo0C81RnRexRCtQuVYWB1KFwCFx4gwVKjLTxPJUq4i6L0EFhFPdGi0iOydnQ-9LUr1sfWruut03VTVqIdRxHWvPeBYMra-oQGl_Yl6Z8ds2HBW57bnbgZjtutudmZZcRQyZ03mrlmz_N_4Z-AKQibm4</recordid><startdate>2018</startdate><enddate>2018</enddate><creator>Chen, Jianqiang</creator><creator>Li, Yufeng</creator><creator>Miao, Weiliang</creator><creator>Mai, Chengle</creator><creator>Li, Mingyu</creator><general>Springer US</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>3V.</scope><scope>7XB</scope><scope>88I</scope><scope>8AF</scope><scope>8AO</scope><scope>8FE</scope><scope>8FG</scope><scope>8FK</scope><scope>8G5</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>GNUQQ</scope><scope>GUQSH</scope><scope>HCIFZ</scope><scope>KB.</scope><scope>L6V</scope><scope>M2O</scope><scope>M2P</scope><scope>M7S</scope><scope>MBDVC</scope><scope>P5Z</scope><scope>P62</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>PTHSS</scope><scope>Q9U</scope><scope>S0X</scope></search><sort><creationdate>2018</creationdate><title>Bonding Cu to Al2O3 with Bi-B-Zn Oxide Glass Via Oxidation–Reduction Reaction</title><author>Chen, Jianqiang ; Li, Yufeng ; Miao, Weiliang ; Mai, Chengle ; Li, Mingyu</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c316t-c7626db7cf9e63267ab5f81ba62a6102e86f636478e0b3540ac46a1f850e87243</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2018</creationdate><topic>Aluminum oxide</topic><topic>Ceramic bonding</topic><topic>Characterization and Evaluation of Materials</topic><topic>Chemical reduction</topic><topic>Chemistry and Materials Science</topic><topic>Copper</topic><topic>Electronics and Microelectronics</topic><topic>Instrumentation</topic><topic>Joining</topic><topic>Materials research</topic><topic>Materials Science</topic><topic>Optical and Electronic Materials</topic><topic>Oxidation</topic><topic>Power semiconductor devices</topic><topic>Reaction bonding</topic><topic>Solid State Physics</topic><topic>Wettability</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Chen, Jianqiang</creatorcontrib><creatorcontrib>Li, Yufeng</creatorcontrib><creatorcontrib>Miao, Weiliang</creatorcontrib><creatorcontrib>Mai, Chengle</creatorcontrib><creatorcontrib>Li, Mingyu</creatorcontrib><collection>CrossRef</collection><collection>ProQuest Central (Corporate)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>Science Database (Alumni Edition)</collection><collection>STEM Database</collection><collection>ProQuest Pharma Collection</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>Research Library (Alumni Edition)</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies & Aerospace Collection</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>ProQuest Central Student</collection><collection>Research Library Prep</collection><collection>SciTech Premium Collection</collection><collection>Materials Science Database</collection><collection>ProQuest Engineering Collection</collection><collection>Research Library</collection><collection>Science Database</collection><collection>Engineering Database</collection><collection>Research Library (Corporate)</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>Engineering Collection</collection><collection>ProQuest Central Basic</collection><collection>SIRS Editorial</collection><jtitle>Journal of electronic materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Chen, Jianqiang</au><au>Li, Yufeng</au><au>Miao, Weiliang</au><au>Mai, Chengle</au><au>Li, Mingyu</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Bonding Cu to Al2O3 with Bi-B-Zn Oxide Glass Via Oxidation–Reduction Reaction</atitle><jtitle>Journal of electronic materials</jtitle><stitle>Journal of Elec Materi</stitle><date>2018</date><risdate>2018</risdate><volume>47</volume><issue>1</issue><spage>542</spage><epage>549</epage><pages>542-549</pages><issn>0361-5235</issn><eissn>1543-186X</eissn><abstract>Bonding Cu on Al
2
O
3
is a key and difficult technology applied in high-power semiconductor devices. A method proposed in this work investigates bonding with a kind of Bi-B-Zn oxide glass powder paste as a solder. Oxidation–reduction reactions between the Cu plate and the solder took place and generated Bi metal during the joining procedure. With an increase in the joining temperature, the tensile strength increased due to the increase of Bi metal formation. The Bi metal played an important role in joining Cu and Al
2
O
3
because of its much better wettability on Cu than that of the oxides. A compound ZnAl
2
O
4
was observed to form between the Al
2
O
3
ceramic and oxide layer, which strengthened the bond.</abstract><cop>New York</cop><pub>Springer US</pub><doi>10.1007/s11664-017-5783-3</doi><tpages>8</tpages></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0361-5235 |
| ispartof | Journal of electronic materials, 2018, Vol.47 (1), p.542-549 |
| issn | 0361-5235 1543-186X |
| language | eng |
| recordid | cdi_proquest_journals_1979947704 |
| source | Springer Nature - Complete Springer Journals |
| subjects | Aluminum oxide Ceramic bonding Characterization and Evaluation of Materials Chemical reduction Chemistry and Materials Science Copper Electronics and Microelectronics Instrumentation Joining Materials research Materials Science Optical and Electronic Materials Oxidation Power semiconductor devices Reaction bonding Solid State Physics Wettability |
| title | Bonding Cu to Al2O3 with Bi-B-Zn Oxide Glass Via Oxidation–Reduction Reaction |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-19T22%3A46%3A21IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Bonding%20Cu%20to%20Al2O3%20with%20Bi-B-Zn%20Oxide%20Glass%20Via%20Oxidation%E2%80%93Reduction%20Reaction&rft.jtitle=Journal%20of%20electronic%20materials&rft.au=Chen,%20Jianqiang&rft.date=2018&rft.volume=47&rft.issue=1&rft.spage=542&rft.epage=549&rft.pages=542-549&rft.issn=0361-5235&rft.eissn=1543-186X&rft_id=info:doi/10.1007/s11664-017-5783-3&rft_dat=%3Cproquest_cross%3E1979947704%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=1979947704&rft_id=info:pmid/&rfr_iscdi=true |