Characterizing the powder punch-face adhesive interaction during the unloading phase of powder compaction

The objective of this work is to measure the adhesive force profile between a punch face and powder compact in-die during the decompression phase of a tablet compaction process. An instrumented punch was developed for use on a single station compaction fixture mounted on a universal testing machine....

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Veröffentlicht in:Powder technology 2017-06, Vol.315, p.410-421
Hauptverfasser: Swaminathan, Shrikant, Ramey, Brian, Hilden, Jon, Wassgren, Carl
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Sprache:eng
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