Complex 3D structures via double imprint of hybrid structures and sacrificial mould techniques
The preparation of transparent complex 3D structures over large areas at low cost paves the way for numerous optical applications. We prepared nanostructures on the surface of microstructures in a negative tone photoresist by a double imprint process combined with VUV-induced surface hardening. Succ...
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Veröffentlicht in: | Microelectronic engineering 2017-05, Vol.176, p.22-27 |
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creator | Steinberg, Christian Rumler, Maximilian Runkel, Manuel Papenheim, Marc Wang, Si Mayer, Andre Becker, Marco Rommel, Mathias Scheer, Hella-Christin |
description | The preparation of transparent complex 3D structures over large areas at low cost paves the way for numerous optical applications. We prepared nanostructures on the surface of microstructures in a negative tone photoresist by a double imprint process combined with VUV-induced surface hardening. Successful preparation of the aforementioned structures asks for a compromise between the surface hardening of the nanostructures and the replication fidelity of the microstructures. Our results show that a VUV treatment time of at least 3s is required so that the cross-linked layer does not break-up. Adequate process parameters as well as their limiting values were identified by using high aspect ratio microstructures. The complex 3D structures were successfully replicated in UV-PDMS to provide long-term stable templates. To ensure effective separation despite of the undercuts a sacrificial mould technique is applied.
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•Combination of micro- and nanostructures without laborious writing techniques•Limitation of a surface-hardened SU-8 layer with high aspect ratio structures•Successful replication of complex 3D structures in UV-PDMS |
doi_str_mv | 10.1016/j.mee.2017.01.009 |
format | Article |
fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_journals_1942190401</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><els_id>S0167931717300163</els_id><sourcerecordid>1942190401</sourcerecordid><originalsourceid>FETCH-LOGICAL-c325t-e0ca272acc964a7c896f5e1187890174c3ab5d4e4a34e944294d0f995818f3c63</originalsourceid><addsrcrecordid>eNp9kM1LxDAQxYMouK7-Ad4CnluTJv0InmT9hAUvejWk0ymb0jZr0i7uf2-W9eDJ0_Dg92bmPUKuOUs548Vtlw6IacZ4mTKeMqZOyIJXpUjyvKhOySIyZaIEL8_JRQgdi1qyakE-V27Y9vhNxQMNk59hmj0GurOGNm6ue6R22Ho7TtS1dLOvvW3-cmaM0oC3rQVrejq4uW_ohLAZ7deM4ZKctaYPePU7l-Tj6fF99ZKs355fV_frBESWTwkyMFmZGQBVSFNCpYo2Rx4DVCpGkiBMnTcSpRESlZSZkg1rlcorXrUCCrEkN8e9W-8OdyfdudmP8aTmSmZcMcl4pPiRAu9C8NjqGG0wfq8504cadadjjfpQo2Zcxxqj5-7owfj-zqLXASyOgI31CJNunP3H_QMkxHsU</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>1942190401</pqid></control><display><type>article</type><title>Complex 3D structures via double imprint of hybrid structures and sacrificial mould techniques</title><source>ScienceDirect Journals (5 years ago - present)</source><creator>Steinberg, Christian ; Rumler, Maximilian ; Runkel, Manuel ; Papenheim, Marc ; Wang, Si ; Mayer, Andre ; Becker, Marco ; Rommel, Mathias ; Scheer, Hella-Christin</creator><creatorcontrib>Steinberg, Christian ; Rumler, Maximilian ; Runkel, Manuel ; Papenheim, Marc ; Wang, Si ; Mayer, Andre ; Becker, Marco ; Rommel, Mathias ; Scheer, Hella-Christin</creatorcontrib><description>The preparation of transparent complex 3D structures over large areas at low cost paves the way for numerous optical applications. We prepared nanostructures on the surface of microstructures in a negative tone photoresist by a double imprint process combined with VUV-induced surface hardening. Successful preparation of the aforementioned structures asks for a compromise between the surface hardening of the nanostructures and the replication fidelity of the microstructures. Our results show that a VUV treatment time of at least 3s is required so that the cross-linked layer does not break-up. Adequate process parameters as well as their limiting values were identified by using high aspect ratio microstructures. The complex 3D structures were successfully replicated in UV-PDMS to provide long-term stable templates. To ensure effective separation despite of the undercuts a sacrificial mould technique is applied.
[Display omitted]
•Combination of micro- and nanostructures without laborious writing techniques•Limitation of a surface-hardened SU-8 layer with high aspect ratio structures•Successful replication of complex 3D structures in UV-PDMS</description><identifier>ISSN: 0167-9317</identifier><identifier>EISSN: 1873-5568</identifier><identifier>DOI: 10.1016/j.mee.2017.01.009</identifier><language>eng</language><publisher>Amsterdam: Elsevier B.V</publisher><subject>3D structures ; CAR44 ; Crosslinking ; High aspect ratio ; Hybrid structures ; Low cost ; Microstructure ; Molds ; Nanostructured materials ; Parameter identification ; Polydimethylsiloxane ; Process parameters ; Sacrificial mould technique ; Silicone resins ; SU-8 ; Surface hardening ; Thermal imprint ; UV-PDMS ; VUV treatment</subject><ispartof>Microelectronic engineering, 2017-05, Vol.176, p.22-27</ispartof><rights>2017 Elsevier B.V.</rights><rights>Copyright Elsevier BV May 25, 2017</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c325t-e0ca272acc964a7c896f5e1187890174c3ab5d4e4a34e944294d0f995818f3c63</citedby><cites>FETCH-LOGICAL-c325t-e0ca272acc964a7c896f5e1187890174c3ab5d4e4a34e944294d0f995818f3c63</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.mee.2017.01.009$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,780,784,3548,27922,27923,45993</link.rule.ids></links><search><creatorcontrib>Steinberg, Christian</creatorcontrib><creatorcontrib>Rumler, Maximilian</creatorcontrib><creatorcontrib>Runkel, Manuel</creatorcontrib><creatorcontrib>Papenheim, Marc</creatorcontrib><creatorcontrib>Wang, Si</creatorcontrib><creatorcontrib>Mayer, Andre</creatorcontrib><creatorcontrib>Becker, Marco</creatorcontrib><creatorcontrib>Rommel, Mathias</creatorcontrib><creatorcontrib>Scheer, Hella-Christin</creatorcontrib><title>Complex 3D structures via double imprint of hybrid structures and sacrificial mould techniques</title><title>Microelectronic engineering</title><description>The preparation of transparent complex 3D structures over large areas at low cost paves the way for numerous optical applications. We prepared nanostructures on the surface of microstructures in a negative tone photoresist by a double imprint process combined with VUV-induced surface hardening. Successful preparation of the aforementioned structures asks for a compromise between the surface hardening of the nanostructures and the replication fidelity of the microstructures. Our results show that a VUV treatment time of at least 3s is required so that the cross-linked layer does not break-up. Adequate process parameters as well as their limiting values were identified by using high aspect ratio microstructures. The complex 3D structures were successfully replicated in UV-PDMS to provide long-term stable templates. To ensure effective separation despite of the undercuts a sacrificial mould technique is applied.
[Display omitted]
•Combination of micro- and nanostructures without laborious writing techniques•Limitation of a surface-hardened SU-8 layer with high aspect ratio structures•Successful replication of complex 3D structures in UV-PDMS</description><subject>3D structures</subject><subject>CAR44</subject><subject>Crosslinking</subject><subject>High aspect ratio</subject><subject>Hybrid structures</subject><subject>Low cost</subject><subject>Microstructure</subject><subject>Molds</subject><subject>Nanostructured materials</subject><subject>Parameter identification</subject><subject>Polydimethylsiloxane</subject><subject>Process parameters</subject><subject>Sacrificial mould technique</subject><subject>Silicone resins</subject><subject>SU-8</subject><subject>Surface hardening</subject><subject>Thermal imprint</subject><subject>UV-PDMS</subject><subject>VUV treatment</subject><issn>0167-9317</issn><issn>1873-5568</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2017</creationdate><recordtype>article</recordtype><recordid>eNp9kM1LxDAQxYMouK7-Ad4CnluTJv0InmT9hAUvejWk0ymb0jZr0i7uf2-W9eDJ0_Dg92bmPUKuOUs548Vtlw6IacZ4mTKeMqZOyIJXpUjyvKhOySIyZaIEL8_JRQgdi1qyakE-V27Y9vhNxQMNk59hmj0GurOGNm6ue6R22Ho7TtS1dLOvvW3-cmaM0oC3rQVrejq4uW_ohLAZ7deM4ZKctaYPePU7l-Tj6fF99ZKs355fV_frBESWTwkyMFmZGQBVSFNCpYo2Rx4DVCpGkiBMnTcSpRESlZSZkg1rlcorXrUCCrEkN8e9W-8OdyfdudmP8aTmSmZcMcl4pPiRAu9C8NjqGG0wfq8504cadadjjfpQo2Zcxxqj5-7owfj-zqLXASyOgI31CJNunP3H_QMkxHsU</recordid><startdate>20170525</startdate><enddate>20170525</enddate><creator>Steinberg, Christian</creator><creator>Rumler, Maximilian</creator><creator>Runkel, Manuel</creator><creator>Papenheim, Marc</creator><creator>Wang, Si</creator><creator>Mayer, Andre</creator><creator>Becker, Marco</creator><creator>Rommel, Mathias</creator><creator>Scheer, Hella-Christin</creator><general>Elsevier B.V</general><general>Elsevier BV</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope></search><sort><creationdate>20170525</creationdate><title>Complex 3D structures via double imprint of hybrid structures and sacrificial mould techniques</title><author>Steinberg, Christian ; Rumler, Maximilian ; Runkel, Manuel ; Papenheim, Marc ; Wang, Si ; Mayer, Andre ; Becker, Marco ; Rommel, Mathias ; Scheer, Hella-Christin</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c325t-e0ca272acc964a7c896f5e1187890174c3ab5d4e4a34e944294d0f995818f3c63</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2017</creationdate><topic>3D structures</topic><topic>CAR44</topic><topic>Crosslinking</topic><topic>High aspect ratio</topic><topic>Hybrid structures</topic><topic>Low cost</topic><topic>Microstructure</topic><topic>Molds</topic><topic>Nanostructured materials</topic><topic>Parameter identification</topic><topic>Polydimethylsiloxane</topic><topic>Process parameters</topic><topic>Sacrificial mould technique</topic><topic>Silicone resins</topic><topic>SU-8</topic><topic>Surface hardening</topic><topic>Thermal imprint</topic><topic>UV-PDMS</topic><topic>VUV treatment</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Steinberg, Christian</creatorcontrib><creatorcontrib>Rumler, Maximilian</creatorcontrib><creatorcontrib>Runkel, Manuel</creatorcontrib><creatorcontrib>Papenheim, Marc</creatorcontrib><creatorcontrib>Wang, Si</creatorcontrib><creatorcontrib>Mayer, Andre</creatorcontrib><creatorcontrib>Becker, Marco</creatorcontrib><creatorcontrib>Rommel, Mathias</creatorcontrib><creatorcontrib>Scheer, Hella-Christin</creatorcontrib><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Microelectronic engineering</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Steinberg, Christian</au><au>Rumler, Maximilian</au><au>Runkel, Manuel</au><au>Papenheim, Marc</au><au>Wang, Si</au><au>Mayer, Andre</au><au>Becker, Marco</au><au>Rommel, Mathias</au><au>Scheer, Hella-Christin</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Complex 3D structures via double imprint of hybrid structures and sacrificial mould techniques</atitle><jtitle>Microelectronic engineering</jtitle><date>2017-05-25</date><risdate>2017</risdate><volume>176</volume><spage>22</spage><epage>27</epage><pages>22-27</pages><issn>0167-9317</issn><eissn>1873-5568</eissn><abstract>The preparation of transparent complex 3D structures over large areas at low cost paves the way for numerous optical applications. We prepared nanostructures on the surface of microstructures in a negative tone photoresist by a double imprint process combined with VUV-induced surface hardening. Successful preparation of the aforementioned structures asks for a compromise between the surface hardening of the nanostructures and the replication fidelity of the microstructures. Our results show that a VUV treatment time of at least 3s is required so that the cross-linked layer does not break-up. Adequate process parameters as well as their limiting values were identified by using high aspect ratio microstructures. The complex 3D structures were successfully replicated in UV-PDMS to provide long-term stable templates. To ensure effective separation despite of the undercuts a sacrificial mould technique is applied.
[Display omitted]
•Combination of micro- and nanostructures without laborious writing techniques•Limitation of a surface-hardened SU-8 layer with high aspect ratio structures•Successful replication of complex 3D structures in UV-PDMS</abstract><cop>Amsterdam</cop><pub>Elsevier B.V</pub><doi>10.1016/j.mee.2017.01.009</doi><tpages>6</tpages></addata></record> |
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subjects | 3D structures CAR44 Crosslinking High aspect ratio Hybrid structures Low cost Microstructure Molds Nanostructured materials Parameter identification Polydimethylsiloxane Process parameters Sacrificial mould technique Silicone resins SU-8 Surface hardening Thermal imprint UV-PDMS VUV treatment |
title | Complex 3D structures via double imprint of hybrid structures and sacrificial mould techniques |
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