Mechanical Properties of Sintered Ag as a New Material for Die Bonding: Influence of the Density

Sintered silver powder is a good candidate for die bonding as an alternative to lead alloys. However, little is known about its intrinsic mechanical properties, which are required to model the entire electronic system reliability, especially during ageing. Since interconnections are obtained by sint...

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Veröffentlicht in:	Journal of electronic materials 2014-12, Vol.43 (12), p.4510-4514
Hauptverfasser:	Caccuri, V., Milhet, X., Gadaud, P., Bertheau, D., Gerland, M.
Format:	Artikel
Sprache:	eng
Schlagworte:	Alloys Bonding Characterization and Evaluation of Materials Chemistry and Materials Science Ductility Electronics and Microelectronics Instrumentation Interconnections Lead base alloys Materials Science Mechanical properties Modulus of elasticity Optical and Electronic Materials Porosity Silver Sintering Solid State Physics System reliability Tensile stress Tensile tests Yield strength Yield stress
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