RETRACTED ARTICLE: Solder Selection for Reflowing Large Ceramic Substrates During PCB Assembly
Large substrates are prone to warpage issues during reflow due to Coefficient of Thermal Expansion (CTE) mismatch with Printed Circuit Board (PCB) material subsequently affecting solder joint quality and reliability in the form of cracks and interface dislocations. This paper describes best solder p...
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| Veröffentlicht in: | Journal of failure analysis and prevention 2017-08, Vol.17 (4), p.699-705 |
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| container_title | Journal of failure analysis and prevention |
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| creator | Gangidi, Prashant Reddy Souriyasak, Noy |
| description | Large substrates are prone to warpage issues during reflow due to Coefficient of Thermal Expansion (CTE) mismatch with Printed Circuit Board (PCB) material subsequently affecting solder joint quality and reliability in the form of cracks and interface dislocations. This paper describes best solder paste alloy for reflowing larger dimension ceramic substrates during PCB assembly process to improve solder joint quality by minimizing CTE differences. Experiments have been carried out using various commercially available solder alloys for reflowing larger substrates (80 mm × 80 mm). Solder joint quality was inspected using scanning electron microscope and X-ray for multiple reflow runs using different alloy combinations. Results showed Bismuth-based solder (Bi58/Sn42) to have minimal cracking and improved CTE over other solder alloys. Advantages include reduced costs and improved reliability for applicable devices. |
| doi_str_mv | 10.1007/s11668-017-0296-1 |
| format | Article |
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This paper describes best solder paste alloy for reflowing larger dimension ceramic substrates during PCB assembly process to improve solder joint quality by minimizing CTE differences. Experiments have been carried out using various commercially available solder alloys for reflowing larger substrates (80 mm × 80 mm). Solder joint quality was inspected using scanning electron microscope and X-ray for multiple reflow runs using different alloy combinations. Results showed Bismuth-based solder (Bi58/Sn42) to have minimal cracking and improved CTE over other solder alloys. Advantages include reduced costs and improved reliability for applicable devices.</description><identifier>ISSN: 1547-7029</identifier><identifier>EISSN: 1728-5674</identifier><identifier>EISSN: 1864-1245</identifier><identifier>DOI: 10.1007/s11668-017-0296-1</identifier><language>eng</language><publisher>New York: Springer US</publisher><subject>Alloys ; Bismuth base alloys ; Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Circuit boards ; Circuit reliability ; Classical Mechanics ; Corrosion and Coatings ; Interfacial dislocations ; Materials Science ; Printed circuits ; Quality Control ; Reliability ; Safety and Risk ; Soldering ; Solid Mechanics ; Technical Article---Peer-Reviewed ; Thermal expansion ; Tribology</subject><ispartof>Journal of failure analysis and prevention, 2017-08, Vol.17 (4), p.699-705</ispartof><rights>ASM International 2017</rights><rights>Journal of Failure Analysis and Prevention is a copyright of Springer, (2017). 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Anal. and Preven</addtitle><description>Large substrates are prone to warpage issues during reflow due to Coefficient of Thermal Expansion (CTE) mismatch with Printed Circuit Board (PCB) material subsequently affecting solder joint quality and reliability in the form of cracks and interface dislocations. This paper describes best solder paste alloy for reflowing larger dimension ceramic substrates during PCB assembly process to improve solder joint quality by minimizing CTE differences. Experiments have been carried out using various commercially available solder alloys for reflowing larger substrates (80 mm × 80 mm). Solder joint quality was inspected using scanning electron microscope and X-ray for multiple reflow runs using different alloy combinations. Results showed Bismuth-based solder (Bi58/Sn42) to have minimal cracking and improved CTE over other solder alloys. 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| ispartof | Journal of failure analysis and prevention, 2017-08, Vol.17 (4), p.699-705 |
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| subjects | Alloys Bismuth base alloys Characterization and Evaluation of Materials Chemistry and Materials Science Circuit boards Circuit reliability Classical Mechanics Corrosion and Coatings Interfacial dislocations Materials Science Printed circuits Quality Control Reliability Safety and Risk Soldering Solid Mechanics Technical Article---Peer-Reviewed Thermal expansion Tribology |
| title | RETRACTED ARTICLE: Solder Selection for Reflowing Large Ceramic Substrates During PCB Assembly |
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