$Thermal performance of phase change material (PCM) based pin-finned heat sinks for electronics devices: Effect of pin thickness and PCM volume fraction$

Thermal performance of phase change material (PCM) based pin-finned heat sinks for electronics devices: Effect of pin thickness and PCM volume fraction

•Inclusion of paraffin wax reduces the base temperature of heat sink.•An enhancement ratio of 2.64 at ψ=1.00 is achieved for a SPT of 60°C at 3.174kW/m2 for 2mm thick pin-fin heat sink.•At heat input of 1.98kW/m2, it took 145min and 229min to reach SPTs of 60°C and 70°C respectively.•3mm Pin-fin thi...

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Veröffentlicht in:	Applied thermal engineering 2017-02, Vol.112, p.143-155
Hauptverfasser:	Arshad, Adeel, Ali, Hafiz Muhammad, Ali, Muzaffar, Manzoor, Shehryar
Format:	Artikel
Sprache:	eng
Schlagworte:	Aluminum Concentration (composition) Cooling Cross-sections Electronic devices Fins Heat conductivity Heat flux Heat sink Heat sinks Heat transfer Latent heat Paraffin wax Performance evaluation Phase change materials Phase change materials (PCMs) Reliability Studies Thermal conductivity Thermal conductivity enhancer (TCE) Thermal energy Thermal management (TM)
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