Heat Transfer Characteristics of Billet/Die Interface and Measures to Relieve Thermal Stress for Hot Forging Die

The interfacial heat transfer coefficient (IHTC) shows the heat transfer capacity at the billet/die interface during the hot forming process, which affects the temperature gradient in the die that may potentially induce high thermal stress. Consequently, this determines the service life of the die....

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Veröffentlicht in:	International journal of thermophysics 2017-07, Vol.38 (7), p.1-20, Article 102
Hauptverfasser:	Lu, Baoshan, Wang, Leigang, Geng, Zhe, Huang, Yao
Format:	Artikel
Sprache:	eng
Schlagworte:	Classical Mechanics Condensed Matter Physics Geophysics Industrial Chemistry/Chemical Engineering Physical Chemistry Physics Physics and Astronomy Service life Superalloys Thermal stress Thermodynamics
Online-Zugang:	Volltext
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