Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance

The mechanical stability of Sn-Ag-Cu interconnects with low and high silver content against mechanical shock at room and elevated temperatures was investigated. With a heating element-embedded printed circuit board design, a test temperature from room temperature to 80°C was established. High impact...

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Veröffentlicht in:	Journal of electronic materials 2016-12, Vol.45 (12), p.6177-6183
Hauptverfasser:	Lee, Tae-Kyu, Chen, Zhiqiang, Baty, Greg, Bieler, Thomas R., Kim, Choong-Un
Format:	Artikel
Sprache:	eng
Schlagworte:	Characterization and Evaluation of Materials Chemistry and Materials Science Electronics and Microelectronics Instrumentation Lead free solders Materials Science Optical and Electronic Materials Silver Solid State Physics Temperature
Online-Zugang:	Volltext
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