More Power Reduction With 3-Tier Logic-on-Logic 3-D ICs

Low-power is one of the key driving forces in modern very large scale integration systems. Recent studies show that 3-D integrated circuits (ICs) offer a significant power saving over 2-D ICs. However, these studies are mainly limited to two-tier (2-tier) designs. Thus, in this paper, we extend our...

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Veröffentlicht in:	IEEE transactions on computer-aided design of integrated circuits and systems 2016-12, Vol.35 (12), p.2056-2067
Hauptverfasser:	Taigon Song, Panth, Shreepad, Yoo-Jin Chae, Sung Kyu Lim
Format:	Artikel
Sprache:	eng
Schlagworte:	3D IC Benchmark testing Bonding CAD Computer aided design Design automation Design optimization F2F (face-to-face) floorplanning Integrated circuits Interconnections low power Metals Microprocessors Power management power reduction Three-dimensional displays Through-silicon vias TSV Very large scale integration
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