Effect of Silver Flakes in Silver Paste on the Joining Process and Properties of Sandwich Power Modules (IGBTs Chip/Silver Paste/Bare Cu)

In this study, a silver paste has been introduced for attaching chips onto bare Cu substrates (without coating) without applying pressure. Small nano-thickness Ag flakes, measuring 1  μ m–5  μ m length, were embedded uniformly in Ag nanoparticles for improving the density of the material. The presen...

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Veröffentlicht in:	Journal of electronic materials 2016-11, Vol.45 (11), p.5789-5799
Hauptverfasser:	Zhao, Su-Yan, Li, Xin, Mei, Yun-Hui, Lu, Guo-Quan
Format:	Artikel
Sprache:	eng
Schlagworte:	Bond strength Characterization and Evaluation of Materials Chemistry and Materials Science Electronics and Microelectronics Heat conductivity Instrumentation Materials Science Optical and Electronic Materials Silver Solid State Physics
Online-Zugang:	Volltext
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