Sealing of silicon-glass microcavities with polymer filling

Investigation of hermetic sealing of selected polymers in silicon-glass microcavities has been presented. The anodic bonding method has been adapted for hermetic encapsulation of the polymer in microcavity. According to standard conditions of the anodic bonding process (temperature: 400°C, voltage:...

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Veröffentlicht in:	Bulletin of the Polish Academy of Sciences. Technical sciences 2016-06, Vol.64 (2), p.283-286
Hauptverfasser:	Knapkiewicz, P., Augustyniak, I.
Format:	Artikel
Sprache:	eng
Schlagworte:	anodic bonding polymer filling sealing of silicon and glass
Online-Zugang:	Volltext
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