Post CMP Wet Cleaning Influence on Cu Hillocks
Up to date, it is commonly reported in literature that the amount of copper hillocks is dependent on a) the total amount of residual Cu oxide after Cu CMP, and b) the Cu nitridation. The present work describes how that is only partially true: hillocks depend also on the kind of oxide and on the roug...
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Veröffentlicht in: | Solid state phenomena 2016-09, Vol.255, p.270-276 |
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Hauptverfasser: | , , , , , , , , , , |
Format: | Artikel |
Sprache: | eng |
Online-Zugang: | Volltext |
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