Preparation and High-Frequency Dielectric Properties of Cu/SiO2 Composites
In this paper, Cu/SiO2 composites with different metal contents were successfully prepared by a selective reduction process. The phase composition and microstructure of composites were analyzed by XRD and SEM, respectively. The results show that spherical copper particles are uniformly distributed i...
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| Veröffentlicht in: | Key engineering materials 2015-07, Vol.655, p.174-177 |
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| creator | Fan, Run Hua Zhang, Xi Hua Zhang, Zi Dong Yan, Ke Lan Chen, Min Sun, Kai |
| description | In this paper, Cu/SiO2 composites with different metal contents were successfully prepared by a selective reduction process. The phase composition and microstructure of composites were analyzed by XRD and SEM, respectively. The results show that spherical copper particles are uniformly distributed in silica matrix. The impedance and permittivity of composites were tested with RF impedance analyzer (0.1~1 GHz). It is indicated Cu/SiO2 composites exhibit capacitive character. In addition, the dielectric constants get enlarged due to the enhancement of interface polarization. |
| doi_str_mv | 10.4028/www.scientific.net/KEM.655.174 |
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The phase composition and microstructure of composites were analyzed by XRD and SEM, respectively. The results show that spherical copper particles are uniformly distributed in silica matrix. The impedance and permittivity of composites were tested with RF impedance analyzer (0.1~1 GHz). It is indicated Cu/SiO2 composites exhibit capacitive character. In addition, the dielectric constants get enlarged due to the enhancement of interface polarization.</description><identifier>ISSN: 1013-9826</identifier><identifier>ISSN: 1662-9795</identifier><identifier>EISSN: 1662-9795</identifier><identifier>DOI: 10.4028/www.scientific.net/KEM.655.174</identifier><language>eng</language><publisher>Zurich: Trans Tech Publications Ltd</publisher><ispartof>Key engineering materials, 2015-07, Vol.655, p.174-177</ispartof><rights>2015 Trans Tech Publications Ltd</rights><rights>Copyright Trans Tech Publications Ltd. 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| title | Preparation and High-Frequency Dielectric Properties of Cu/SiO2 Composites |
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