Effects of Chamber Pressure on the Performance of CO2 Beam Cleaning

As the size of functional patterns in the semiconductor chips shrinks down to below 100 nm, removing nanoscale contaminant particles is an important technological challenge that the current semiconductor manufacturing industry must overcome. Several cleaning methods proposed to date, such as megason...

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Veröffentlicht in:Solid state phenomena 2014-09, Vol.219, p.131-133
Hauptverfasser: Kim, Ho Young, Lee, Joong Ha, Kim, Seung Ho
Format: Artikel
Sprache:eng
Online-Zugang:Volltext
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