Enhancing the thermal conductivities of SiO2/Epoxy composites by orientation
To improve the thermal conductivity of epoxy resin, tensile way was used to orient the molecular chain of epoxy resin with SiO2 particles filled. In this article, SiO2/Epoxy composites which had approximately one‐dimensional lattice structure were prepared. The heat generated by LED chip rapidly pas...
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| Veröffentlicht in: | Polymer composites 2016-03, Vol.37 (3), p.818-823 |
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| Hauptverfasser: | , , |
| Format: | Artikel |
| Sprache: | eng |
| Online-Zugang: | Volltext |
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