Low-Capacitance Through-Silicon-Vias With Combined Air/SiO2 Liners

Through-silicon-vias (TSVs) with air-gap insulators have the advantages of low capacitance and low thermal stress. This paper reports the design, fabrication, and characterization of new TSVs with combined air/SiO 2 insulators. Sacrificial technologies based on heat decomposition of poly(propylene c...

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Veröffentlicht in:	IEEE transactions on electron devices 2016-02, Vol.63 (2), p.739-745
Hauptverfasser:	Huang, Cui, Wu, Ke, Wang, Zheyao
Format:	Artikel
Sprache:	eng
Schlagworte:	Air gap Air gaps benzocyclobutene (BCB) Capacitance Etching Fabrication Plugs poly(propylene carbonate) (PPC) Reliability sacrificial technology Through-silicon vias
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