Sequential Lateral Solidification of Silicon Thin Films on Cu BEOL-Integrated Wafers for Monolithic 3-D Integration

We demonstrate that wafers integrated with copper (Cu) Damascene interconnects are suitable substrates for the excimer laser crystallization of silicon thin films. This approach allows for the monolithic 3-D integration of transistors on the back end of line (BEOL) of silicon wafers for VLSI monolit...

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