Formation of a Metastable Phase at the Interface Between Sn and Ag–Pd Substrates During Liquid-State Reaction
Ag–Pd alloys are widely used as thick-film conductors and are potential alternatives to the expensive Au bump. In this work, because Sn is the primary element in solders, we investigated Sn/Ag–Pd interfacial reactions at 250°C as a means of assessing the reliability and evaluating reflow reactions a...
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| Veröffentlicht in: | Journal of electronic materials 2014-11, Vol.43 (11), p.4275-4281 |
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| creator | Lin, Hsin-fu Chen, Chih-chi |
| description | Ag–Pd alloys are widely used as thick-film conductors and are potential alternatives to the expensive Au bump. In this work, because Sn is the primary element in solders, we investigated Sn/Ag–Pd interfacial reactions at 250°C as a means of assessing the reliability and evaluating reflow reactions at joints between solder and Ag–Pd conductor contacts, and in the Ag bump combined with the solder cap. The experimental results showed that Sn/Ag–Pd interfacial reactions at 250°C are different from those of Sn/Ag and Sn/Pd. A metastable Sn–Ag–Pd ternary phase is formed when the amount of Pd added is 20–40 at.%. Because, in commercial applications, at least 20 wt.% Pd (~20 at.% Pd) is used in Ag–Pd alloys to eliminate the silver-migration phenomenon, assessment of the reliability of Ag bumps and the soldered joints of Ag–Pd thick film hybrid circuits must be based on Sn/Ag–Pd interfacial reactions, not those of Sn/Pd and Sn/Ag. |
| doi_str_mv | 10.1007/s11664-014-3393-x |
| format | Article |
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In this work, because Sn is the primary element in solders, we investigated Sn/Ag–Pd interfacial reactions at 250°C as a means of assessing the reliability and evaluating reflow reactions at joints between solder and Ag–Pd conductor contacts, and in the Ag bump combined with the solder cap. The experimental results showed that Sn/Ag–Pd interfacial reactions at 250°C are different from those of Sn/Ag and Sn/Pd. A metastable Sn–Ag–Pd ternary phase is formed when the amount of Pd added is 20–40 at.%. Because, in commercial applications, at least 20 wt.% Pd (~20 at.% Pd) is used in Ag–Pd alloys to eliminate the silver-migration phenomenon, assessment of the reliability of Ag bumps and the soldered joints of Ag–Pd thick film hybrid circuits must be based on Sn/Ag–Pd interfacial reactions, not those of Sn/Pd and Sn/Ag.</description><identifier>ISSN: 0361-5235</identifier><identifier>EISSN: 1543-186X</identifier><identifier>DOI: 10.1007/s11664-014-3393-x</identifier><identifier>CODEN: JECMA5</identifier><language>eng</language><publisher>Boston: Springer US</publisher><subject>Alloys ; Applied sciences ; Brazing. Soldering ; Characterization and Evaluation of Materials ; Chemical reactions ; Chemistry and Materials Science ; Condensed matter: structure, mechanical and thermal properties ; Diffusion in solids ; Electronics and Microelectronics ; Exact sciences and technology ; Instrumentation ; Interfaces ; Joining, thermal cutting: metallurgical aspects ; Liquids ; Materials Science ; Metals. Metallurgy ; Optical and Electronic Materials ; Physics ; Solid State Physics ; Substrates ; Transport properties of condensed matter (nonelectronic)</subject><ispartof>Journal of electronic materials, 2014-11, Vol.43 (11), p.4275-4281</ispartof><rights>The Minerals, Metals & Materials Society 2014</rights><rights>2015 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c298t-9bed03bc8f733f6ccbf80c06526128cc3bb98bd73e6c266abb55345284b0ccd03</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s11664-014-3393-x$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s11664-014-3393-x$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,776,780,27901,27902,41464,42533,51294</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=28883143$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Lin, Hsin-fu</creatorcontrib><creatorcontrib>Chen, Chih-chi</creatorcontrib><title>Formation of a Metastable Phase at the Interface Between Sn and Ag–Pd Substrates During Liquid-State Reaction</title><title>Journal of electronic materials</title><addtitle>Journal of Elec Materi</addtitle><description>Ag–Pd alloys are widely used as thick-film conductors and are potential alternatives to the expensive Au bump. In this work, because Sn is the primary element in solders, we investigated Sn/Ag–Pd interfacial reactions at 250°C as a means of assessing the reliability and evaluating reflow reactions at joints between solder and Ag–Pd conductor contacts, and in the Ag bump combined with the solder cap. The experimental results showed that Sn/Ag–Pd interfacial reactions at 250°C are different from those of Sn/Ag and Sn/Pd. A metastable Sn–Ag–Pd ternary phase is formed when the amount of Pd added is 20–40 at.%. Because, in commercial applications, at least 20 wt.% Pd (~20 at.% Pd) is used in Ag–Pd alloys to eliminate the silver-migration phenomenon, assessment of the reliability of Ag bumps and the soldered joints of Ag–Pd thick film hybrid circuits must be based on Sn/Ag–Pd interfacial reactions, not those of Sn/Pd and Sn/Ag.</description><subject>Alloys</subject><subject>Applied sciences</subject><subject>Brazing. Soldering</subject><subject>Characterization and Evaluation of Materials</subject><subject>Chemical reactions</subject><subject>Chemistry and Materials Science</subject><subject>Condensed matter: structure, mechanical and thermal properties</subject><subject>Diffusion in solids</subject><subject>Electronics and Microelectronics</subject><subject>Exact sciences and technology</subject><subject>Instrumentation</subject><subject>Interfaces</subject><subject>Joining, thermal cutting: metallurgical aspects</subject><subject>Liquids</subject><subject>Materials Science</subject><subject>Metals. 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Soldering</topic><topic>Characterization and Evaluation of Materials</topic><topic>Chemical reactions</topic><topic>Chemistry and Materials Science</topic><topic>Condensed matter: structure, mechanical and thermal properties</topic><topic>Diffusion in solids</topic><topic>Electronics and Microelectronics</topic><topic>Exact sciences and technology</topic><topic>Instrumentation</topic><topic>Interfaces</topic><topic>Joining, thermal cutting: metallurgical aspects</topic><topic>Liquids</topic><topic>Materials Science</topic><topic>Metals. Metallurgy</topic><topic>Optical and Electronic Materials</topic><topic>Physics</topic><topic>Solid State Physics</topic><topic>Substrates</topic><topic>Transport properties of condensed matter (nonelectronic)</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Lin, Hsin-fu</creatorcontrib><creatorcontrib>Chen, Chih-chi</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>ProQuest Central (Corporate)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>Science Database (Alumni Edition)</collection><collection>STEM Database</collection><collection>ProQuest Pharma Collection</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>Research Library (Alumni Edition)</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies & Aerospace Collection</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>ProQuest Central Student</collection><collection>Research Library Prep</collection><collection>SciTech Premium Collection</collection><collection>Materials Science Database</collection><collection>ProQuest Engineering Collection</collection><collection>Research Library</collection><collection>Science Database</collection><collection>Engineering Database</collection><collection>Research Library (Corporate)</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>Engineering Collection</collection><collection>ProQuest Central Basic</collection><collection>SIRS Editorial</collection><jtitle>Journal of electronic materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Lin, Hsin-fu</au><au>Chen, Chih-chi</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Formation of a Metastable Phase at the Interface Between Sn and Ag–Pd Substrates During Liquid-State Reaction</atitle><jtitle>Journal of electronic materials</jtitle><stitle>Journal of Elec Materi</stitle><date>2014-11-01</date><risdate>2014</risdate><volume>43</volume><issue>11</issue><spage>4275</spage><epage>4281</epage><pages>4275-4281</pages><issn>0361-5235</issn><eissn>1543-186X</eissn><coden>JECMA5</coden><abstract>Ag–Pd alloys are widely used as thick-film conductors and are potential alternatives to the expensive Au bump. In this work, because Sn is the primary element in solders, we investigated Sn/Ag–Pd interfacial reactions at 250°C as a means of assessing the reliability and evaluating reflow reactions at joints between solder and Ag–Pd conductor contacts, and in the Ag bump combined with the solder cap. The experimental results showed that Sn/Ag–Pd interfacial reactions at 250°C are different from those of Sn/Ag and Sn/Pd. A metastable Sn–Ag–Pd ternary phase is formed when the amount of Pd added is 20–40 at.%. Because, in commercial applications, at least 20 wt.% Pd (~20 at.% Pd) is used in Ag–Pd alloys to eliminate the silver-migration phenomenon, assessment of the reliability of Ag bumps and the soldered joints of Ag–Pd thick film hybrid circuits must be based on Sn/Ag–Pd interfacial reactions, not those of Sn/Pd and Sn/Ag.</abstract><cop>Boston</cop><pub>Springer US</pub><doi>10.1007/s11664-014-3393-x</doi><tpages>7</tpages></addata></record> |
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| subjects | Alloys Applied sciences Brazing. Soldering Characterization and Evaluation of Materials Chemical reactions Chemistry and Materials Science Condensed matter: structure, mechanical and thermal properties Diffusion in solids Electronics and Microelectronics Exact sciences and technology Instrumentation Interfaces Joining, thermal cutting: metallurgical aspects Liquids Materials Science Metals. Metallurgy Optical and Electronic Materials Physics Solid State Physics Substrates Transport properties of condensed matter (nonelectronic) |
| title | Formation of a Metastable Phase at the Interface Between Sn and Ag–Pd Substrates During Liquid-State Reaction |
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