Confinement Effects on Evolution of Intermetallic Compounds During Metallurgical Joint Formation

In this work, we compare the microstructural evolution of Sn/Cu/Sn and Cu/Sn/Cu ‘sandwich’ configurations under metallurgical bonding conditions. These simulations are relevant in explaining experimental observations that suggest that the resulting dominant intermetallic compound in Cu-Sn systems de...

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Veröffentlicht in:Journal of electronic materials 2014-07, Vol.43 (7), p.2510-2520
Hauptverfasser: Park, M. S., Gibbons, S. L., Arróyave, R.
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Sprache:eng
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