Confinement Effects on Evolution of Intermetallic Compounds During Metallurgical Joint Formation
In this work, we compare the microstructural evolution of Sn/Cu/Sn and Cu/Sn/Cu ‘sandwich’ configurations under metallurgical bonding conditions. These simulations are relevant in explaining experimental observations that suggest that the resulting dominant intermetallic compound in Cu-Sn systems de...
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Veröffentlicht in: | Journal of electronic materials 2014-07, Vol.43 (7), p.2510-2520 |
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Format: | Artikel |
Sprache: | eng |
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