Different Directions of Switching of Chromium Oxide Thin Films

We have investigated the switching behavior of as-deposited CrO x and post-annealed CrO y films by use of a variety of electrodes (top electrode Ag, Ti; bottom electrode Pt, fluorine tin oxide (FTO)). Resistance switching is highly dependent on electrode material and post-annealing treatment. Among...

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Veröffentlicht in:Journal of electronic materials 2014-07, Vol.43 (7), p.2747-2753
Hauptverfasser: Pham, Ngoc Kim, Nguyen, Do Trung, Dao, Bang Tam Thi, Ta, Kieu Hanh Thi, Tran, Vinh Cao, Nguyen, Van Hieu, Kim, Sang Sub, Maenosono, Shinya, Phan, Thang Bach
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container_end_page 2753
container_issue 7
container_start_page 2747
container_title Journal of electronic materials
container_volume 43
creator Pham, Ngoc Kim
Nguyen, Do Trung
Dao, Bang Tam Thi
Ta, Kieu Hanh Thi
Tran, Vinh Cao
Nguyen, Van Hieu
Kim, Sang Sub
Maenosono, Shinya
Phan, Thang Bach
description We have investigated the switching behavior of as-deposited CrO x and post-annealed CrO y films by use of a variety of electrodes (top electrode Ag, Ti; bottom electrode Pt, fluorine tin oxide (FTO)). Resistance switching is highly dependent on electrode material and post-annealing treatment. Among Pt devices, I – V hysteresis was observed for the Ag/CrO x /Pt device only; no resistance switching was observed for Ag/CrO y /Pt, Ti/CrO x /Pt, and Ti/CrO y /Pt devices. Among FTO devices, I – V hysteresis was observed for the Ag/CrO x /FTO device whereas I – V hysteresis with the opposite switching direction was observed for Ag/CrO y /FTO, Ti/CrO x /FTO, and Ti/CrO y /FTO devices. The direction of switching depends not only on electrode material but also on post-annealing treatment, which affects the density of grain boundaries. Thus, the density of grain boundaries determines the type of charge carrier involved in the switching process. For as-deposited CrO x films with a high density of grain boundaries Ag filament paths mediated by electrochemical redox reaction were observed, irrespective of bottom electrode material (Pt or FTO). Post-annealed CrO y films with a low density of grain boundaries suppressed electrochemical redox reaction in the Ag/CrO y /Pt device but promoted short-range movement of O 2− ions through the bottom interface, resulting in resistance switching in the Ag/CrO y /FTO device. Electrochemical redox reaction-controlled resistance switching occurred solely in oxides with a high density of grain boundaries or dislocations.
doi_str_mv 10.1007/s11664-014-3193-3
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Resistance switching is highly dependent on electrode material and post-annealing treatment. Among Pt devices, I – V hysteresis was observed for the Ag/CrO x /Pt device only; no resistance switching was observed for Ag/CrO y /Pt, Ti/CrO x /Pt, and Ti/CrO y /Pt devices. Among FTO devices, I – V hysteresis was observed for the Ag/CrO x /FTO device whereas I – V hysteresis with the opposite switching direction was observed for Ag/CrO y /FTO, Ti/CrO x /FTO, and Ti/CrO y /FTO devices. The direction of switching depends not only on electrode material but also on post-annealing treatment, which affects the density of grain boundaries. Thus, the density of grain boundaries determines the type of charge carrier involved in the switching process. For as-deposited CrO x films with a high density of grain boundaries Ag filament paths mediated by electrochemical redox reaction were observed, irrespective of bottom electrode material (Pt or FTO). Post-annealed CrO y films with a low density of grain boundaries suppressed electrochemical redox reaction in the Ag/CrO y /Pt device but promoted short-range movement of O 2− ions through the bottom interface, resulting in resistance switching in the Ag/CrO y /FTO device. 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Resistance switching is highly dependent on electrode material and post-annealing treatment. Among Pt devices, I – V hysteresis was observed for the Ag/CrO x /Pt device only; no resistance switching was observed for Ag/CrO y /Pt, Ti/CrO x /Pt, and Ti/CrO y /Pt devices. Among FTO devices, I – V hysteresis was observed for the Ag/CrO x /FTO device whereas I – V hysteresis with the opposite switching direction was observed for Ag/CrO y /FTO, Ti/CrO x /FTO, and Ti/CrO y /FTO devices. The direction of switching depends not only on electrode material but also on post-annealing treatment, which affects the density of grain boundaries. Thus, the density of grain boundaries determines the type of charge carrier involved in the switching process. For as-deposited CrO x films with a high density of grain boundaries Ag filament paths mediated by electrochemical redox reaction were observed, irrespective of bottom electrode material (Pt or FTO). Post-annealed CrO y films with a low density of grain boundaries suppressed electrochemical redox reaction in the Ag/CrO y /Pt device but promoted short-range movement of O 2− ions through the bottom interface, resulting in resistance switching in the Ag/CrO y /FTO device. Electrochemical redox reaction-controlled resistance switching occurred solely in oxides with a high density of grain boundaries or dislocations.</description><subject>Annealing</subject><subject>Applied sciences</subject><subject>Characterization and Evaluation of Materials</subject><subject>Chemical compounds</subject><subject>Chemistry</subject><subject>Chemistry and Materials Science</subject><subject>Condensed matter: structure, mechanical and thermal properties</subject><subject>Defects and impurities in crystals; microstructure</subject><subject>Electrochemistry</subject><subject>Electrodes: preparations and properties</subject><subject>Electronics</subject><subject>Electronics and Microelectronics</subject><subject>Exact sciences and technology</subject><subject>General and physical chemistry</subject><subject>Grain and twin boundaries</subject><subject>Heat treatment</subject><subject>Instrumentation</subject><subject>Linear defects: dislocations, disclinations</subject><subject>Materials Science</subject><subject>Metals. 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Resistance switching is highly dependent on electrode material and post-annealing treatment. Among Pt devices, I – V hysteresis was observed for the Ag/CrO x /Pt device only; no resistance switching was observed for Ag/CrO y /Pt, Ti/CrO x /Pt, and Ti/CrO y /Pt devices. Among FTO devices, I – V hysteresis was observed for the Ag/CrO x /FTO device whereas I – V hysteresis with the opposite switching direction was observed for Ag/CrO y /FTO, Ti/CrO x /FTO, and Ti/CrO y /FTO devices. The direction of switching depends not only on electrode material but also on post-annealing treatment, which affects the density of grain boundaries. Thus, the density of grain boundaries determines the type of charge carrier involved in the switching process. For as-deposited CrO x films with a high density of grain boundaries Ag filament paths mediated by electrochemical redox reaction were observed, irrespective of bottom electrode material (Pt or FTO). Post-annealed CrO y films with a low density of grain boundaries suppressed electrochemical redox reaction in the Ag/CrO y /Pt device but promoted short-range movement of O 2− ions through the bottom interface, resulting in resistance switching in the Ag/CrO y /FTO device. Electrochemical redox reaction-controlled resistance switching occurred solely in oxides with a high density of grain boundaries or dislocations.</abstract><cop>Boston</cop><pub>Springer US</pub><doi>10.1007/s11664-014-3193-3</doi><tpages>7</tpages></addata></record>
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subjects Annealing
Applied sciences
Characterization and Evaluation of Materials
Chemical compounds
Chemistry
Chemistry and Materials Science
Condensed matter: structure, mechanical and thermal properties
Defects and impurities in crystals
microstructure
Electrochemistry
Electrodes: preparations and properties
Electronics
Electronics and Microelectronics
Exact sciences and technology
General and physical chemistry
Grain and twin boundaries
Heat treatment
Instrumentation
Linear defects: dislocations, disclinations
Materials Science
Metals. Metallurgy
Optical and Electronic Materials
Physics
Production techniques
Solid State Physics
Structure of solids and liquids
crystallography
Thin films
title Different Directions of Switching of Chromium Oxide Thin Films
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