Au-In-based Hermetic Sealing for MEMS Packaging for Down-Hole Application
Hermetic sealing of micro-electro mechanical systems (MEMS) sensors for down-hole application requires high-quality void-free bonds, with metallic hermetic sealing being widely used for this purpose. As most of the MEMS sensors cannot withstand high temperatures, transient liquid phase (TLP) bonding...
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| Veröffentlicht in: | Journal of electronic materials 2014-07, Vol.43 (7), p.2498-2509 |
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| creator | Chidambaram, Vivek Bangtao, Chen Lip, Gan Chee Rhee Min Woo, Daniel |
| description | Hermetic sealing of micro-electro mechanical systems (MEMS) sensors for down-hole application requires high-quality void-free bonds, with metallic hermetic sealing being widely used for this purpose. As most of the MEMS sensors cannot withstand high temperatures, transient liquid phase (TLP) bonding is promising for metallic sealing applications, since the re-melting temperature of the bond is much higher than the bonding temperature. In this paper, major issues involving TLP bonding, including non-uniform diffusion kinetics across the interface and the formation of intermetallic compounds prior to bonding for fast reactive metallic systems like Au-In, have been addressed by using diffusion barriers. The performance of various diffusion barriers that include Ti, Ni, and Pt has been evaluated. Ni has been determined to be a prospective candidate, since it averts diffusion to a certain extent prior to TLP bonding. The mechanical strength and hermeticity of the Au-In joints have also been characterized after aging at 300 °C up to 500 h. No major changes in the thermo-mechanical properties of the AuIn and AuIn
2
phases were observed and, hence, these phases are concluded to be thermally stable at this temperature regime. Improvements in hermeticity were confirmed when subjected to high-temperature thermal aging. |
| doi_str_mv | 10.1007/s11664-014-3131-4 |
| format | Article |
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2
phases were observed and, hence, these phases are concluded to be thermally stable at this temperature regime. Improvements in hermeticity were confirmed when subjected to high-temperature thermal aging.</description><identifier>ISSN: 0361-5235</identifier><identifier>EISSN: 1543-186X</identifier><identifier>DOI: 10.1007/s11664-014-3131-4</identifier><identifier>CODEN: JECMA5</identifier><language>eng</language><publisher>Boston: Springer US</publisher><subject>Applied sciences ; Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Condensed matter: structure, mechanical and thermal properties ; Diffusion in solids ; Electronics ; Electronics and Microelectronics ; Exact sciences and technology ; Instrumentation ; Joining, thermal cutting: metallurgical aspects ; Materials Science ; Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology ; Metals ; Metals. Metallurgy ; Microelectromechanical systems ; Optical and Electronic Materials ; Physics ; Sensors ; Shear strength ; Solid State Physics ; Transport properties of condensed matter (nonelectronic) ; Welding</subject><ispartof>Journal of electronic materials, 2014-07, Vol.43 (7), p.2498-2509</ispartof><rights>TMS 2014</rights><rights>2015 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c412t-cf44ebf5ee041043305305ce1ba40dbdee15c8488bff194c2dc239c546dadc453</citedby><cites>FETCH-LOGICAL-c412t-cf44ebf5ee041043305305ce1ba40dbdee15c8488bff194c2dc239c546dadc453</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s11664-014-3131-4$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s11664-014-3131-4$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,780,784,27923,27924,41487,42556,51318</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=28580154$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Chidambaram, Vivek</creatorcontrib><creatorcontrib>Bangtao, Chen</creatorcontrib><creatorcontrib>Lip, Gan Chee</creatorcontrib><creatorcontrib>Rhee Min Woo, Daniel</creatorcontrib><title>Au-In-based Hermetic Sealing for MEMS Packaging for Down-Hole Application</title><title>Journal of electronic materials</title><addtitle>Journal of Elec Materi</addtitle><description>Hermetic sealing of micro-electro mechanical systems (MEMS) sensors for down-hole application requires high-quality void-free bonds, with metallic hermetic sealing being widely used for this purpose. As most of the MEMS sensors cannot withstand high temperatures, transient liquid phase (TLP) bonding is promising for metallic sealing applications, since the re-melting temperature of the bond is much higher than the bonding temperature. In this paper, major issues involving TLP bonding, including non-uniform diffusion kinetics across the interface and the formation of intermetallic compounds prior to bonding for fast reactive metallic systems like Au-In, have been addressed by using diffusion barriers. The performance of various diffusion barriers that include Ti, Ni, and Pt has been evaluated. Ni has been determined to be a prospective candidate, since it averts diffusion to a certain extent prior to TLP bonding. The mechanical strength and hermeticity of the Au-In joints have also been characterized after aging at 300 °C up to 500 h. No major changes in the thermo-mechanical properties of the AuIn and AuIn
2
phases were observed and, hence, these phases are concluded to be thermally stable at this temperature regime. Improvements in hermeticity were confirmed when subjected to high-temperature thermal aging.</description><subject>Applied sciences</subject><subject>Characterization and Evaluation of Materials</subject><subject>Chemistry and Materials Science</subject><subject>Condensed matter: structure, mechanical and thermal properties</subject><subject>Diffusion in solids</subject><subject>Electronics</subject><subject>Electronics and Microelectronics</subject><subject>Exact sciences and technology</subject><subject>Instrumentation</subject><subject>Joining, thermal cutting: metallurgical aspects</subject><subject>Materials Science</subject><subject>Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology</subject><subject>Metals</subject><subject>Metals. Metallurgy</subject><subject>Microelectromechanical systems</subject><subject>Optical and Electronic Materials</subject><subject>Physics</subject><subject>Sensors</subject><subject>Shear strength</subject><subject>Solid State Physics</subject><subject>Transport properties of condensed matter (nonelectronic)</subject><subject>Welding</subject><issn>0361-5235</issn><issn>1543-186X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2014</creationdate><recordtype>article</recordtype><sourceid>8G5</sourceid><sourceid>ABUWG</sourceid><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><sourceid>GNUQQ</sourceid><sourceid>GUQSH</sourceid><sourceid>M2O</sourceid><recordid>eNp1kNFLwzAQxoMoOKd_gG8F8TGaa5IuexxzusFEYQq-hTS9jM6urUmH-N-b0Sm-CAcHd9_33fEj5BLYDTA2ug0AWSYoA0E5cKDiiAxACk5BZW_HZMB4BlSmXJ6SsxA2jIEEBQOymOzooqa5CVgkc_Rb7EqbrNBUZb1OXOOTx9njKnk29t2sf0Z3zWdN502FyaRtq9Karmzqc3LiTBXw4tCH5PV-9jKd0-XTw2I6WVIrIO2odUJg7iQiE8AE50zGsgi5EazIC0SQVgmlcudgLGxa2JSPrRRZYQorJB-Sqz639c3HDkOnN83O1_GkhhjFR2oEPKqgV1nfhODR6daXW-O_NDC9J6Z7YjoS03tiWkTP9SHZBGsq501ty_BrTJVUbM90SNJeF-KqXqP_88G_4d8LcHlp</recordid><startdate>20140701</startdate><enddate>20140701</enddate><creator>Chidambaram, Vivek</creator><creator>Bangtao, Chen</creator><creator>Lip, Gan Chee</creator><creator>Rhee Min Woo, Daniel</creator><general>Springer US</general><general>Springer</general><general>Springer Nature B.V</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>3V.</scope><scope>7XB</scope><scope>88I</scope><scope>8AF</scope><scope>8AO</scope><scope>8FE</scope><scope>8FG</scope><scope>8FK</scope><scope>8G5</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>GNUQQ</scope><scope>GUQSH</scope><scope>HCIFZ</scope><scope>KB.</scope><scope>L6V</scope><scope>M2O</scope><scope>M2P</scope><scope>M7S</scope><scope>MBDVC</scope><scope>P5Z</scope><scope>P62</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>PTHSS</scope><scope>Q9U</scope><scope>S0X</scope></search><sort><creationdate>20140701</creationdate><title>Au-In-based Hermetic Sealing for MEMS Packaging for Down-Hole Application</title><author>Chidambaram, Vivek ; Bangtao, Chen ; Lip, Gan Chee ; Rhee Min Woo, Daniel</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c412t-cf44ebf5ee041043305305ce1ba40dbdee15c8488bff194c2dc239c546dadc453</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2014</creationdate><topic>Applied sciences</topic><topic>Characterization and Evaluation of Materials</topic><topic>Chemistry and Materials Science</topic><topic>Condensed matter: structure, mechanical and thermal properties</topic><topic>Diffusion in solids</topic><topic>Electronics</topic><topic>Electronics and Microelectronics</topic><topic>Exact sciences and technology</topic><topic>Instrumentation</topic><topic>Joining, thermal cutting: metallurgical aspects</topic><topic>Materials Science</topic><topic>Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology</topic><topic>Metals</topic><topic>Metals. Metallurgy</topic><topic>Microelectromechanical systems</topic><topic>Optical and Electronic Materials</topic><topic>Physics</topic><topic>Sensors</topic><topic>Shear strength</topic><topic>Solid State Physics</topic><topic>Transport properties of condensed matter (nonelectronic)</topic><topic>Welding</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Chidambaram, Vivek</creatorcontrib><creatorcontrib>Bangtao, Chen</creatorcontrib><creatorcontrib>Lip, Gan Chee</creatorcontrib><creatorcontrib>Rhee Min Woo, Daniel</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>ProQuest Central (Corporate)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>Science Database (Alumni Edition)</collection><collection>STEM Database</collection><collection>ProQuest Pharma Collection</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>Research Library (Alumni Edition)</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies & Aerospace Collection</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>ProQuest Central Student</collection><collection>Research Library Prep</collection><collection>SciTech Premium Collection</collection><collection>Materials Science Database</collection><collection>ProQuest Engineering Collection</collection><collection>Research Library</collection><collection>Science Database</collection><collection>Engineering Database</collection><collection>Research Library (Corporate)</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>Engineering Collection</collection><collection>ProQuest Central Basic</collection><collection>SIRS Editorial</collection><jtitle>Journal of electronic materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Chidambaram, Vivek</au><au>Bangtao, Chen</au><au>Lip, Gan Chee</au><au>Rhee Min Woo, Daniel</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Au-In-based Hermetic Sealing for MEMS Packaging for Down-Hole Application</atitle><jtitle>Journal of electronic materials</jtitle><stitle>Journal of Elec Materi</stitle><date>2014-07-01</date><risdate>2014</risdate><volume>43</volume><issue>7</issue><spage>2498</spage><epage>2509</epage><pages>2498-2509</pages><issn>0361-5235</issn><eissn>1543-186X</eissn><coden>JECMA5</coden><abstract>Hermetic sealing of micro-electro mechanical systems (MEMS) sensors for down-hole application requires high-quality void-free bonds, with metallic hermetic sealing being widely used for this purpose. As most of the MEMS sensors cannot withstand high temperatures, transient liquid phase (TLP) bonding is promising for metallic sealing applications, since the re-melting temperature of the bond is much higher than the bonding temperature. In this paper, major issues involving TLP bonding, including non-uniform diffusion kinetics across the interface and the formation of intermetallic compounds prior to bonding for fast reactive metallic systems like Au-In, have been addressed by using diffusion barriers. The performance of various diffusion barriers that include Ti, Ni, and Pt has been evaluated. Ni has been determined to be a prospective candidate, since it averts diffusion to a certain extent prior to TLP bonding. The mechanical strength and hermeticity of the Au-In joints have also been characterized after aging at 300 °C up to 500 h. No major changes in the thermo-mechanical properties of the AuIn and AuIn
2
phases were observed and, hence, these phases are concluded to be thermally stable at this temperature regime. Improvements in hermeticity were confirmed when subjected to high-temperature thermal aging.</abstract><cop>Boston</cop><pub>Springer US</pub><doi>10.1007/s11664-014-3131-4</doi><tpages>12</tpages></addata></record> |
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| subjects | Applied sciences Characterization and Evaluation of Materials Chemistry and Materials Science Condensed matter: structure, mechanical and thermal properties Diffusion in solids Electronics Electronics and Microelectronics Exact sciences and technology Instrumentation Joining, thermal cutting: metallurgical aspects Materials Science Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology Metals Metals. Metallurgy Microelectromechanical systems Optical and Electronic Materials Physics Sensors Shear strength Solid State Physics Transport properties of condensed matter (nonelectronic) Welding |
| title | Au-In-based Hermetic Sealing for MEMS Packaging for Down-Hole Application |
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