Effect of Heat Treatment on the Thermoelectric Properties of Bismuth–Antimony–Telluride Prepared by Mechanical Deformation and Mechanical Alloying

In this work, p -type 20%Bi 2 Te 3 –80%Sb 2 Te 3 bulk thermoelectric (TE) materials were prepared by mechanical deformation (MD) of pre-melted ingot and by mechanical alloying (MA) of elemental Bi, Sb, and Te granules followed by cold-pressing. The dependence on annealing time of changes of microstr...

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Veröffentlicht in:Journal of electronic materials 2014-06, Vol.43 (6), p.2255-2261
Hauptverfasser: Lee, Deuk-Hee, Lee, Jae-Uk, Jung, Sung-Jin, Baek, Seung-Hyub, Kim, Ju-Heon, Kim, Dong-Ik, Hyun, Dow-Bin, Kim, Jin-Sang
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Sprache:eng
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Zusammenfassung:In this work, p -type 20%Bi 2 Te 3 –80%Sb 2 Te 3 bulk thermoelectric (TE) materials were prepared by mechanical deformation (MD) of pre-melted ingot and by mechanical alloying (MA) of elemental Bi, Sb, and Te granules followed by cold-pressing. The dependence on annealing time of changes of microstructure and TE properties of the prepared samples, including Seebeck coefficient, electrical resistivity, thermal conductivity, and figure-of-merit, was investigated. For both samples, saturation of the Seebeck coefficient and electrical resistivity were observed after annealing for 1 h at 380°C. It is suggested that energy stored in samples prepared by both MA and MD facilitated their recrystallization within short annealing times. The 20%Bi 2 Te 3 –80%Sb 2 Te 3 sample prepared by MA followed by heat treatment had higher a Seebeck coefficient and electrical resistivity than specimens fabricated by MD. Maximum figures-of-merit of 3.00 × 10 −3 /K and 2.85 × 10 −3 /K were achieved for samples prepared by MA and MD, respectively.
ISSN:0361-5235
1543-186X
DOI:10.1007/s11664-014-3037-1